Semiconductor device and semiconductor system

1. A semiconductor device comprising:

an operation control circuit configured for generating a first signal based on an internal temperature being equal to or higher than a first predetermined temperature;

an error correction circuit configured for correcting an error of read data according to a read parity and generating output data based on the error correction control signal; and

a memory array configured to output the read data and the read parity to the error correction circuit based on a read operation,

wherein the operation control circuit is configured to generate a second signal based on the internal temperature being equal to or higher than a second predetermined temperature,

wherein the first predetermined temperature is different from the second predetermined temperature,

wherein the operation control circuit comprises a temperature sensor, and

wherein the temperature sensor generates the first detection signal which is enabled, based on the internal temperature being lower than the first predetermined temperature, generates the second detection signal which is enabled, based on the internal temperature being equal to or higher than the first predetermined temperature and being lower than the second predetermined temperature, and generates the third detection signal which is enabled, based on the internal temperature being equal to or higher than the second predetermined temperature.

2. The semiconductor device according to claim 1 , wherein the first signal includes an error correction control signal and the second signal includes the error correction control signal and a scrub control signal.

3. The semiconductor device according to claim 2 , wherein the second predetermined temperature is set to be higher than the first predetermined temperature.

4. The semiconductor device according to claim 2 , wherein the error correction circuit generates a scrub write control signal and generates scrub data by buffering the output data, based on the scrub control signal.

5. The semiconductor device according to claim 2 , wherein the operation control circuit comprises:

a control signal generation circuit configured for generating the error correction control signal and the scrub control signal based on the first to third detection signals.

6. The semiconductor device according to claim 5 , wherein the temperature sensor generates the first detection signal which is enabled, based on the internal temperature being lower than the first predetermined temperature, generates the second detection signal which is enabled, based on the internal temperature being equal to or higher than the first predetermined temperature and being lower than the second predetermined temperature, and generates the third detection signal which is enabled, based on the internal temperature being equal to or higher than the second predetermined temperature.

7. The semiconductor device according to claim 5 , wherein the control signal generation circuit generates the error correction control signal based on the second detection signal being enabled, and generates the error correction control signal and the scrub control signal based on the third detection signal being enabled.

8. The semiconductor device according to claim 2 , wherein the error correction circuit comprises:

a data error correction circuit configured for correcting an error of the read data according to the read parity and outputting the output data, based on the error correction control signal; and

a scrub operation control circuit configured for generating the scrub write control signal and generating the scrub data by buffering the output data, based on the scrub control signal.

9. The semiconductor device according to claim 1 , further comprising:

a read write control circuit configured for generating a read control signal or a write control signal by decoding a command or generating a write control signal based on the scrub write control signal; and

a memory core circuit including the memory array, and configured for outputting the read data and the read parity from the memory array based on the read control signal and storing the scrub data in the memory array based on the write control signal.

10. A semiconductor device comprising:

an operation control circuit configured for generating a first signal based on a level of a core voltage being lower than a level of a reference voltage; and

an error correction circuit configured for correcting an error of read data according to a read parity and generating output data based on the first signal; and

a memory array configured to output the read data and the read parity to the error correction circuit based on a read operation,

wherein the operation control circuit is configured to generate a second signal based on the level of the core voltage being lower than a level obtained by subtracting a level of a predetermined voltage from the level of the reference voltage,

wherein the operation control circuit comprises a voltage detection circuit, and

wherein the voltage detection circuit generates the first detection signal which is enabled, based on the level of the core voltage being equal to or higher than the level of the reference voltage, generates the second detection signal which is enabled, based on the level of the core voltage being lower than the level of the reference voltage and being equal to or higher than the level obtained by subtracting the level of the predetermined voltage from the level of the reference voltage, and generates the third detection signal which is enabled, based on the level of the core voltage being lower than the level obtained by subtracting the level of the predetermined voltage from the level of the reference voltage.

11. The semiconductor device according to claim 10 , wherein the first signal includes an error correction control signal and the second signal includes the error correction control signal and a scrub control signal.

12. The semiconductor device according to claim 11 , wherein the error correction circuit generates a scrub write control signal and generates scrub data by buffering the output data, based on the scrub control signal.

13. The semiconductor device according to claim 11 , wherein the operation control circuit comprises:

a control signal generation circuit configured for generating the error correction control signal and the scrub control signal based on the first to third detection signals.

14. The semiconductor device according to claim 13 , wherein the control signal generation circuit generates the error correction control signal based on the second detection signal being enabled, and generates the error correction control signal and the scrub control signal based on the third detection signal being enabled.

15. The semiconductor device according to claim 10 , further comprising:

a read write control circuit configured for generating a read control signal or a write control signal by decoding a command or generating a write control signal based on the scrub write control signal; and

a memory core circuit including the memory array, and configured for outputting the read data and the read parity from the memory array based on the read control signal and storing the scrub data in the memory array based on the write control signal.

16. A semiconductor system comprising:

a first semiconductor device configured for outputting a command and being inputted with output data; and

a second semiconductor device configured for generating a first signal and a second signal depending upon an internal temperature or a level of a core voltage, and generating the output data by correcting an error of read data according to a read parity based on the first signal, based on a read operation being performed based on the command,

wherein the read parity and the read data are outputted from a memory array, included in the second semiconductor device, in the read operation,

wherein the second semiconductor device is configured to generate the first signal based on the internal temperature being equal to or higher than a first predetermined temperature and to generate the second signal based on the internal temperature being equal to or higher than a second predetermined temperature,

wherein the first predetermined temperature is different from the second predetermined temperature,

wherein the second semiconductor device comprises a temperature sensor, and

wherein the temperature sensor generates the first detection signal which is enabled, based on the internal temperature being lower than the first predetermined temperature, generates the second detection signal which is enabled, based on the internal temperature being equal to or higher than the first predetermined temperature and being lower than the second predetermined temperature, and generates the third detection signal which is enabled, based on the internal temperature being equal to or higher than the second predetermined temperature.

17. The semiconductor system according to claim 16 ,

wherein the first signal includes an error correction control signal and the second signal includes the error correction control signal and a scrub control signal, and

wherein the second predetermined temperature is set to be higher than the first predetermined temperature.

18. The semiconductor system according to claim 17 , wherein the second semiconductor device generates the error correction control signal based on the level of the core voltage being lower than a level of a reference voltage, and generates the scrub control signal based on the level of the core voltage being lower than a level obtained by subtracting a level of a predetermined voltage from the level of the reference voltage.

19. The semiconductor system according to claim 16 , wherein the second semiconductor device generates scrub data by buffering the output data based on the scrub control signal, and stores the scrub data in the memory array.

20. A semiconductor device comprising:

an operation control circuit configured to generate a first to third detection signals based on an internal temperature of the semiconductor device; and

an error correction circuit configured to output read data as output data with or without performing an error correction operation and with or without performing a scrub operation based on the first to third detection signals,

wherein the operation control circuit is configured to generate the second detection signal based on the internal temperature being equal to or higher than a first predetermined temperature and to generate the third detection signal based on the internal temperature being equal to or higher than a second predetermined temperature, and

wherein the first predetermined temperature is different from the second predetermined temperature.

21. The semiconductor device according to claim 20 , wherein when the internal temperature is below the first predetermined temperature the error correction circuit is configured to output the read data as the output data without performing the error correction operation and without performing the scrub operation.

22. The semiconductor device according to claim 20 ,

wherein when the internal temperature is greater than or equal to a first predetermined temperature and less than the second predetermined temperature the error correction circuit is configured to output the read data as the output data with performing the error correction operation and without performing the scrub operation, and

wherein the second predetermined temperature is set to be greater than the first predetermined temperature.

23. The semiconductor device according to claim 20 ,

wherein when the internal temperature is greater than a first and a second predetermined temperature the error correction circuit is configured to output the read data as the output data with performing the error correction operation and with performing the scrub operation, and

wherein the second predetermined temperature is set to be greater than the first predetermined temperature.

24. The semiconductor device according to claim 20 ,

wherein the error correction operation includes correcting an error of the read data according to a read parity and generating the output data, and

wherein the scrub operation includes generating scrub data by buffering the output data.

25. A semiconductor device comprising:

an operation control circuit configured to generate a first to third detection signals based on a level of a core voltage of the semiconductor device; and

an error correction circuit configured to output read data as output data with or without performing an error correction operation and with or without performing a scrub operation based on the first to third detection signals,

wherein the operation control circuit is configured to generate the second detection signal based on a level of a core voltage being lower than a level of a reference voltage and to generate the third detection signal based on the level of the core voltage being lower than a level obtained by subtracting a level of a predetermined voltage from the level of the reference voltage.

26. The semiconductor device according to claim 25 ,

wherein when the level of the core voltage is equal to or higher than the reference voltage the error correction circuit is configured to output the read data as the output data without performing the error correction operation and without performing the scrub operation.

27. The semiconductor device according to claim 25 ,

wherein when the level of the core voltage is lower, by a level equal to or lower than the level of the predetermined voltage, than the reference voltage the error correction circuit is configured to output the read data as the output data with performing the error correction operation and without performing the scrub operation.

28. The semiconductor device according to claim 25 ,

wherein when the level of the core voltage is lower, by a level higher than the level of the predetermined voltage, than the reference voltage the error correction circuit is configured to output the read data as the output data with performing the error correction operation and with performing the scrub operation.

29. The semiconductor device according to claim 25 ,

wherein the error correction operation includes correcting an error of the read data according to a read parity and generating the output data, and

wherein the scrub operation includes generating scrub data by buffering the output data.