Heterojunction bipolar transistor power amplifier with backside thermal heatsink
A heterojunction bipolar transistor may include an emitter, a base contacting the emitter, a collector contacting the base, a sub-collector contacting the collector, and an electrical isolation layer contacting the sub-collector. The heterojunction bipolar transistor may also include a backside heatsink thermally coupled to the sub-collector and the collector. The backside heatsink may be aligned with a central axis of the emitter and the base.
1. A heterojunction bipolar transistor, comprising:
an emitter;
a base contacting the emitter;
a collector contacting the base;
a sub-collector contacting the collector;
means for dissipating heat from the collector through the sub-collector; and
a thermally conductive etch stop layer lining the sub-collector and arranged between the means for dissipating heat and the sub-collector.
2. The heterojunction bipolar transistor of claim 1 , integrated into a chip of a wireless transceiver, the wireless transceiver incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.
3. The heterojunction bipolar transistor of claim 1 , in which the means for dissipating heat directly contacts a backside of the thermally conductive etch stop layer and a front-side of the thermally conductive etch stop layer lines the sub-collector.
4. The heterojunction bipolar transistor of claim 1 , in which the sub-collector is comprised of a III-V compound semiconductor material or a II-VI compound semiconductor material.
5. The heterojunction bipolar transistor of claim 1 , in which the thermally conductive etch stop layer comprises aluminum arsenide (AlAs).
6. A heterojunction bipolar transistor, comprising:
an emitter;
a base contacting the emitter;
a collector contacting the base;
a sub-collector contacting the collector;
a backside thermal via thermally coupled to the collector through the sub-collector, in which the backside thermal via is substantially aligned with the emitter and the base; and
a thermally conductive etch stop layer lining the sub-collector and arranged between the backside thermal via and the sub-collector.
7. The heterojunction bipolar transistor of claim 6 , integrated into a chip of a power amplifier incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.
8. The heterojunction bipolar transistor of claim 6 , in which the backside thermal via directly contacts a backside of the thermally conductive etch stop layer and a front-side of the thermally conductive etch stop layer lines the sub-collector.
9. The heterojunction bipolar transistor of claim 6 in which the sub-collector is comprised of a III-V compound semiconductor material or a II-VI compound semiconductor material.
10. The heterojunction bipolar transistor of claim 6 , in which the thermally conductive etch stop layer comprises aluminum arsenide (AlAs).