Three-dimensional heat transfer device
A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.
1. A three-dimensional heat transfer device, comprising:
a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and
a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body,
wherein the first capillary structure is connected to the second capillary structure by metallic bonding.
2. The three-dimensional heat transfer device according to claim 1 , further comprising a bonding layer,
wherein a side of the bonding layer is connected to the first capillary structure by metallic bonding, and another side of the bonding layer is connected to the second capillary structure by metallic bonding.
3. The three-dimensional heat transfer device according to claim 2 , wherein the bonding layer includes gold powder, silver powder, copper powder, or iron powder.
4. The three-dimensional heat transfer device according to claim 2 , wherein both the first capillary structure and the second capillary structure are selected from the group consisting of metal mesh, sintered metal powder, sintered ceramic and combination thereof.
5. The three-dimensional heat transfer device according to claim 4 , wherein
an open end of the pipe body comprises an opening and an edge forming the opening, and
the second capillary structure is flush with the edge.
6. The three-dimensional heat transfer device according to claim 5 , wherein
the open end of the pipe body includes a recess defined on the edge, and
the recess is in fluid communication with the opening.
7. The three-dimensional heat transfer device according to claim 5 , wherein
a closed end of the pipe body is opposite to the open end of the pipe body, and
the second capillary structure contacts the closed end.
8. The three-dimensional heat transfer device according to claim 5 , wherein
a closed end of the pipe body is opposite to the open end of the pipe body, and
the second capillary structure is axially spaced apart from the closed end.
9. The three-dimensional heat transfer device according to claim 7 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure is disposed on the inner circumferential surface, and
the second capillary structure extends circumferentially along the inner circumferential surface.
10. The three-dimensional heat transfer device according to claim 8 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure is disposed on the inner circumferential surface, and
the second capillary structure extends circumferentially along the inner circumferential surface.
11. The three-dimensional heat transfer device according to claim 7 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure comprises two capillary elements disposed on the inner circumferential surface, and
the two capillary elements are spaced apart from each other.
12. The three-dimensional heat transfer device according to claim 8 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure comprises two capillary elements disposed on the inner circumferential surface, and
the two capillary elements are spaced apart from each other.
13. The three-dimensional heat transfer device according to claim 4 , wherein
an open end of the pipe body comprises an opening and an edge forming the opening, and
the second capillary structure comprises a contact portion extending from the edge of the pipe body, the contact portion being exposed.
14. The three-dimensional heat transfer device according to claim 13 , wherein
a closed end of the pipe body is opposite to the open end of the pipe body, and
the second capillary structure contacts the closed end.
15. The three-dimensional heat transfer device according to claim 13 , wherein
a closed end of the pipe body is opposite to the open end of the pipe body, and
the second capillary structure is spaced apart from the closed end.
16. The three-dimensional heat transfer device according to claim 14 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure is disposed on the inner circumferential surface, and
the second capillary structure extends circumferentially along the inner circumferential surface.
17. The three-dimensional heat transfer device according to claim 15 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure is disposed on the inner circumferential surface, and
the second capillary structure extends circumferentially along the inner circumferential surface.
18. The three-dimensional heat transfer device according to claim 14 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure comprises two capillary elements disposed on the inner circumferential surface, and
the two capillary elements are spaced apart from each other.
19. The three-dimensional heat transfer device according to claim 15 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure comprises two capillary elements disposed on the inner circumferential surface, and
the two capillary elements are spaced apart from each other.
20. The three-dimensional heat transfer device according to claim 2 , wherein the first capillary structure and the second capillary structure are selected from the group consisting of metal mesh, sintered metal powder, sintered ceramic, micro grooves and combination thereof.
21. The three-dimensional heat transfer device according to claim 20 , wherein an open end of the pipe body comprises an opening and an edge forming the opening, and the second capillary structure is flush with the edge.
22. The three-dimensional heat transfer device according to claim 21 , wherein the open end of the pipe body comprises a recess located on the edge, and the recess is in fluid communication with the opening.
23. The three-dimensional heat transfer device according to claim 21 , wherein a closed end of the pipe body is opposite to the open end of the pipe body, and the second capillary structure contacts the closed end.
24. The three-dimensional heat transfer device according to claim 21 , wherein a closed end of the pipe body is opposite to the open end of the pipe body, and the second capillary structure is axially spaced apart from the close end.
25. The three-dimensional heat transfer device according to claim 23 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure is disposed on the inner circumferential surface, and
the second capillary structure extends circumferentially along the inner circumferential surface.
26. The three-dimensional heat transfer device according to claim 24 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure is disposed on the inner circumferential surface, and
the second capillary structure extends circumferentially along the inner circumferential surface.
27. The three-dimensional heat transfer device according to claim 23 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure comprises two capillary elements disposed on the inner circumferential surface, and
the two capillary elements are spaced apart from each other.
28. The three-dimensional heat transfer device according to claim 24 , wherein
the pipe body comprises an inner circumferential surface,
the second capillary structure comprises two capillary elements disposed on the inner circumferential surface, and
the two capillary elements are spaced apart from each other.
29. The three-dimensional heat transfer device according to claim 1 , wherein
the chamber body of the vapor chamber comprises a first plate and a second plate, the first plate is connected to the second plate, the first plate and the second plate jointly define a cavity,
the second plate comprises an through hole and a flange extending from the through hole, the heat pipe being received in the through hole, and the flange surrounding the heat pipe.
30. The three-dimensional heat transfer device according to claim 29 , wherein the first capillary structure is disposed on a surface of the first plate facing the cavity.
31. The three-dimensional heat transfer device according to claim 30 , further comprising a third capillary structure disposed on a surface of the second plate facing the cavity.
32. The three-dimensional heat transfer device according to claim 1 , further comprising a fins assembly disposed on the heat pipe.
33. A three-dimensional heat transfer device, comprising:
a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body;
a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body; and
a bonding layer connected to the first capillary structure and the second capillary structure, and the bonding layer comprising a porous structure.
34. A method of manufacturing a three-dimensional heat transfer device, comprising:
providing a vapor chamber including a first capillary structure;
providing a metal powder on at least a part of the first capillary structure;
contacting a heat pipe including a second capillary structure to the metal powder; and
performing a sintering process to sinter the metal powder to form a bonding layer,
wherein the bonding layer is connected to the first capillary structure and the second capillary structure by metallic bonding.
35. A method of manufacturing a three-dimensional heat transfer device, comprising:
providing a vapor chamber comprising a first capillary structure;
providing a metal powder on at least part of the first capillary structure;
contacting a heat pipe including a second capillary structure on the metal powder; and
performing a sintering process to sinter the metal powder to form a bonding layer comprising a porous structure,
wherein the bonding layer is connected to the first capillary structure and the second capillary structure.