Methods and systems for material cladding of multilayer ceramic capacitors

Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layers and termination caps comprising a base metal may be cladded with a noble metal to lower costs without the tendency of base metal atoms combining with oxygen atoms in the dielectric material as the base metal does not physically contact the dielectric material. The conductive layers may comprise a wavy shape, and may comprise conductive layer ends modified to minimize or eliminate sharp edges and corners, such as comprising a convex, wavy, or bulbous shape. The noble metal portion of a conductive layer may be a minimum thickness required to prevent chemical reactions between the base metal portion and the dielectric material. In conjunction with computer modeling of Laplace's equation, the conductors can be reshaped at little material cost to make the electric field nearly uniform through adjustments of the base metal portion.