Method for manufacturing semiconductor device
It is an object to provide a highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics. It is another object to manufacture a highly reliable semiconductor device at lower cost with high productivity. In a method for manufacturing a semiconductor device which includes a thin film transistor where a semiconductor layer including a channel formation region using an oxide semiconductor layer, a source region, and a drain region are formed using an oxide semiconductor layer, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor layer.
1. A method for manufacturing a semiconductor device comprising the steps of:
forming a first oxide semiconductor layer over an insulating layer;
forming a second oxide semiconductor layer over the first oxide semiconductor layer;
heating the first oxide semiconductor layer and the second oxide semiconductor layer under an atmosphere comprising nitrogen at a temperature equal to or higher than 400° C. to increase a carrier concentration in each of the first oxide semiconductor layer and the second oxide semiconductor layer;
after heating the first oxide semiconductor layer and the second oxide semiconductor layer, forming an oxide insulating layer over and in contact with a part of the first oxide semiconductor layer; and
after forming the oxide insulating layer, heating the oxide insulating layer to increase resistivity of the part of the first oxide semiconductor layer.
2. The method for manufacturing a semiconductor device according to claim 1 , wherein heating the oxide insulating layer is performed at a temperature equal to or higher than 150° C. and equal to or lower than 350° C.
3. The method for manufacturing a semiconductor device according to claim 1 , wherein heating the oxide insulating layer is performed under an atmosphere comprising nitrogen.
4. The method for manufacturing a semiconductor device according to claim 1 , further comprising the step of forming a source electrode layer and a drain electrode layer over the second oxide semiconductor layer before forming the oxide insulating layer.
5. The method for manufacturing a semiconductor device according to claim 4 , wherein the source electrode layer and the drain electrode layer comprise a material selected from titanium and molybdenum.
6. The method for manufacturing a semiconductor device according to claim 1 , wherein the first oxide semiconductor layer comprises a crystal.
7. The method for manufacturing a semiconductor device according to claim 1 , wherein the first oxide semiconductor layer comprises indium and zinc.
8. A method for manufacturing a semiconductor device comprising the steps of:
forming a first conductive layer;
forming a first oxide semiconductor layer over the first conductive layer;
forming a second oxide semiconductor layer over the first oxide semiconductor layer;
heating the first oxide semiconductor layer and the second oxide semiconductor layer under an atmosphere comprising nitrogen at a temperature equal to or higher than 400° C. to increase a carrier concentration in each of the first oxide semiconductor layer and the second oxide semiconductor layer;
after heating the first oxide semiconductor layer and the second oxide semiconductor layer, forming an oxide insulating layer over and in contact with a part of the first oxide semiconductor layer;
after forming the oxide insulating layer, heating the oxide insulating layer to reduce the carrier concentration in the part of the first oxide semiconductor layer; and
forming a second conductive layer over the oxide insulating layer,
wherein the second conductive layer overlaps the first conductive layer and the first oxide semiconductor layer.
9. The method for manufacturing a semiconductor device according to claim 8 , wherein heating the oxide insulating layer is performed at a temperature equal to or higher than 150° C. and equal to or lower than 350° C.
10. The method for manufacturing a semiconductor device according to claim 8 , wherein heating the oxide insulating layer is performed under an atmosphere comprising nitrogen.
11. The method for manufacturing a semiconductor device according to claim 8 , further comprising the step of forming a source electrode layer and a drain electrode layer over the second oxide semiconductor layer before forming the oxide insulating layer.
12. The method for manufacturing a semiconductor device according to claim 11 , wherein the source electrode layer and the drain electrode layer comprise a material selected from titanium and molybdenum.
13. The method for manufacturing a semiconductor device according to claim 8 , wherein the first oxide semiconductor layer comprises a crystal.
14. The method for manufacturing a semiconductor device according to claim 8 , wherein the first oxide semiconductor layer comprises indium and zinc.
15. The method for manufacturing a semiconductor device according to claim 8 , wherein the first conductive layer and the second conductive layer are electrically connected to each other.
16. A method for manufacturing a semiconductor device comprising the steps of:
forming a first oxide semiconductor layer over an insulating layer;
forming a second oxide semiconductor layer over the first oxide semiconductor layer;
heating the first oxide semiconductor layer and the second oxide semiconductor layer under an atmosphere comprising nitrogen at a temperature equal to or higher than 400° C. to increase a carrier concentration in each of the first oxide semiconductor layer and the second oxide semiconductor layer;
after heating the first oxide semiconductor layer and the second oxide semiconductor layer, forming an oxide insulating layer over and in contact with a part of the first oxide semiconductor layer; and
after forming the oxide insulating layer, heating the oxide insulating layer to reduce the carrier concentration in the part of the first oxide semiconductor layer.
17. The method for manufacturing a semiconductor device according to claim 16 , wherein heating the oxide insulating layer is performed at a temperature equal to or higher than 150° C. and equal to or lower than 350° C.
18. The method for manufacturing a semiconductor device according to claim 16 , wherein heating the oxide insulating layer is performed under an atmosphere comprising nitrogen.
19. The method for manufacturing a semiconductor device according to claim 16 , further comprising the step of forming a source electrode layer and a drain electrode layer over the second oxide semiconductor layer before forming the oxide insulating layer,
wherein the source electrode layer and the drain electrode layer comprise a material selected from titanium and molybdenum.
20. The method for manufacturing a semiconductor device according to claim 16 , wherein the first oxide semiconductor layer comprises indium and zinc.