Light-emitting device and manufacturing method therefor
Disclosed in one embodiment is a light-emitting device comprising: a first semiconductor layer; an active layer arranged on the first semiconductor layer and including a plurality of first uneven portions; an electron blocking layer including a plurality of second uneven portions arranged on the plurality of first uneven portions; and a second semiconductor layer formed on the electron blocking layer, wherein the electron blocking layer has at least two doping concentration peak sections of a p-type dopant in the thickness direction.
1. A light-emitting device comprising:
a first semiconductor layer;
an active layer disposed on the first semiconductor layer and including a plurality of first uneven portions;
an electron blocking layer including a plurality of second uneven portions disposed on the plurality of first uneven portions; and
a second semiconductor layer formed on the electron blocking layer,
wherein the electron blocking layer has two or more doping concentration peak sections of a P-type dopant in a thickness direction of the electron blocking layer,
wherein each peak section is an inflection point at which a concentration of the p-type dopant increases and then decreases,
wherein the electron blocking layer further includes a plurality of sub-layers, and
wherein at least one of the peak sections is provided at an interface between two adjacent sub-layers.
2. The light-emitting device of claim 1 , wherein a thickness of each of the plurality of second uneven portions is smaller than that of an even region formed between the plurality of second uneven portions.
3. The light-emitting device of claim 2 , wherein the electron blocking layer has two or more peak sections in a thickness direction of the even region.
4. The light-emitting device of claim 1 , wherein elements configuring the plurality of sub-layers are the same.
5. The light-emitting device of claim 1 , wherein:
the electron blocking layer includes a first sub-layer closest to the active layer and a second sub-layer formed on the first sub-layer; and
the first sub-layer has two or more peak sections in the thickness direction.
6. The light-emitting device of claim 1 , wherein:
the electron blocking layer includes a first sub-layer closest to the active layer and a second sub-layer formed on the first sub-layer;
the first sub-layer is undoped with the p-type dopant; and
the second sub-layer has two peak sections in the thickness direction.
7. The light-emitting device of claim 1 , wherein the electron blocking layer includes a first carrier implantation path in a region provided between the plurality of second uneven portions, and a second carrier implantation path at a sidewall of each of the second uneven portions.
8. An electronic device comprising one or more light-emitting devices, wherein each of the light-emitting devices includes:
a first semiconductor layer;
an active layer disposed on the first semiconductor layer and including a plurality of first uneven portions;
an electron blocking layer including a plurality of second uneven portions disposed on the plurality of first uneven portions; and
a second semiconductor layer formed on the electron blocking layer,
wherein the electron blocking layer has two or more doping concentration peak sections of a P-type dopant in a thickness direction of the electron blocking layer,
wherein each peak section is an inflection point at which a concentration of the p-type dopant increases and then decreases,
wherein the electron blocking layer further includes a plurality of sub-layers, and
wherein at least one of the peak sections is provided at an interface between two adjacent sub-layers.
9. The electronic device of claim 8 , wherein a thickness of each of the plurality of second uneven portions is smaller than that of an even region formed between the plurality of second uneven portions.
10. The electronic device of claim 9 , wherein the electron blocking layer has two or more peak sections in a thickness direction of the even region.
11. The electronic device of claim 8 , wherein the plurality of sub-layers have the same elements.
12. The electronic device of claim 8 , wherein:
the electron blocking layer includes a first sub-layer closest to the active layer and a second sub-layer formed on the first sub-layer; and
the first sub-layer has two or more peak sections in the thickness direction.
13. The electronic device of claim 8 , wherein:
the electron blocking layer includes a first sub-layer closest to the active layer and a second sub-layer formed on the first sub-layer;
the first sub-layer is undoped with the p-type dopant; and
the second sub-layer has two or more peak sections in the thickness direction.
14. The electronic device of claim 8 , wherein the electron blocking layer includes a first carrier implantation path in a region provided between the plurality of second uneven portions, and a second carrier implantation path at a sidewall of each of the second uneven portions.
15. The electronic device of claim 8 , wherein the electronic device is one of a display device, a lighting device, and a head lamp.
16. A light-emitting device comprising:
a first semiconductor layer;
an active layer disposed on the first semiconductor layer and including a plurality of first uneven portions;
an electron blocking layer including a plurality of second uneven portions disposed on the plurality of first uneven portions; and
a second semiconductor layer formed on the electron blocking layer,
wherein the electron blocking layer has two or more doping concentration peak sections of a P-type dopant in a thickness direction of the electron blocking layer,
wherein each peak section is an inflection point at which a concentration of the p-type dopant increases and then decreases,
wherein the electron blocking layer further includes a plurality of sub-layers,
wherein at least one of the peak sections is provided at an interface between two adjacent sub-layers,
wherein a thickness of each of the plurality of second uneven portions is smaller than that of an even region formed between the plurality of second uneven portions,
wherein the electron blocking layer has two or more peak sections in a thickness direction of the even region,
wherein elements configuring the plurality of sub-layers are the same,
wherein the electron blocking layer includes a first sub-layer closest to the active layer and a second sub-layer formed on the first sub-layer; and the first sub-layer has two or more peak sections in the thickness direction, and
wherein the electron blocking layer includes a first carrier implantation path in a region provided between the plurality of second uneven portions, and a second carrier implantation path at a sidewall of each of the second uneven portions.