Density modulated thin film electrodes, methods of making same, and applications of same
Density modulated thin film electrodes, methods of making the same, and applications of the same. The density modulated thin film electrode includes a substrate formed of a current collecting material, and a thin film formed of an electrode material on the substrate. The thin film has a first surface and an opposite, second surface, and a density that is changed with a distance defined from the first surface to a plane in the thin film, the plane being parallel to the first surface. The method includes depositing the electrode material on the substrate to form the thin film, where, during deposition of the electrode material, a pressure of an operating gas is controlled and changed to a predetermined pressure value according to a deposited thickness of the electrode material, so as to make the density of the thin film changed with the distance.
1. An electrode usable for a battery, comprising:
a substrate formed of a current collecting material;
at least one layer formed of a silicon film on the substrate, the at least one layer having a first surface and an opposite, second surface, and a density that is changed with a distance defined from the first surface to a plane in the at least one layer, wherein the density of the at least one layer of the silicon film is changed in the form of one or multiple periods of a sine wave function of the distance, or in the form of a rectangular function of the distance, the plane being parallel to the first surface, wherein a maximal value of the distance is a thickness of the at least one layer defined between the first and second surfaces; and
a capping layer having a density higher than the lowest density, formed on the second surface of the at least one layer of the silicon film, when the density of the at least one layer of the electrode material at the second surface has the lowest density, wherein the capping layer is formed of only a material that is same as the silicon film of the at least one layer.
2. The electrode of claim 1 , wherein the substrate comprises nanorod arrays formed of the current collecting material, such that the first surface of the at least one layer of the silicon film is adhered to the substrate through the nanorod arrays.
3. The electrode of claim 1 , wherein the current collecting material comprises copper (Cu), nickel (Ni), or aluminum (Al).
4. The electrode of claim 1 , further comprising an adhesion and compliant layer formed between the substrate and the at least one layer of the silicon film.
5. The electrode of claim 4 , wherein the adhesion and compliant layer comprises nanorod arrays.
6. The electrode of claim 4 , wherein the adhesion and compliant layer is formed of chromium (Cr), titanium (Ti), nickel (Ni), tantalum (Ta), molybdenum (Mo), or tungsten (W).
7. The electrode of claim 4 , wherein the adhesion and compliant layer is a graded composite layer of the current collecting material and a material that is same as the at least one layer of the silicon film, formed by co-depositing the current collecting material and the material that is same as the at least one layer of the silicon film with varying compositions as a function of thickness of the graded composite layer, wherein the graded composite layer has a first surface being adhered to the substrate and an opposite, second surface being adhered to the first surface of the at least one layer of the silicon film, and wherein ratio of the current collecting material to the material that is same as the at least one layer of the silicon film of the graded composite layer is changed from 100:0 at the first surface of the graded composite layer to 0:100 at the second surface of the graded composite layer by controlling their relative deposition rates.