IP Library › Granted Patent US 10,336,880
Granted Patent B2
US 10,336,880 · App. 15/542,261 · Granted Jul 2, 2019

Propylene resin foam particles and foam particle molded article

Inventors: Masaharu Oikawa (Yokkaichi, JP); Nobumasa Koshita (Yokkaichi, JP); Syouta Takagi (Yokkaichi, JP)
Assignee: JSP Corporation
C08J9/228C08J9/0061C08J9/122C08J9/16C08J9/22C08J9/232C08L23/16C08J2203/06C08J2323/16C08J2423/08C08J2423/16C08L2205/025
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,336,880
App. No.
15/542,261
Granted
Jul 2, 2019
Kind
B2
Abstract

Provided is an expanded propylene resin bead including a core layer in a foamed state, which includes a propylene-based resin composition (a) satisfying the following (i) and (ii); and a cover layer which includes an olefin-based resin (b) satisfying the following (iii) or (iv): (i) the propylene-based resin composition (a) is a mixture of 65% by weight to 98% by weight of a propylene-based resin (a1) having a melting point of 145° C. to 165° C. and a flexural modulus of 1,200 MPa or more and 35% by weight to 2% by weight of a propylene-based resin (a2) having a melting point of 100° C. to 145° C. and a flexural modulus of 800 MPa to 1,200 MPa; (ii) a difference in a melting point between the resin (a1) and the resin (a2) is 5° C. to 25° C.; (iii) the olefin-based resin (b) is a crystalline olefin-based resin having a melting point (TmB) that is lower than a melting point (TmA) of the composition (a) and being in a relation of (0° C.<[TmA-TmB]≤80° C.); and (iv) the olefin-based resin (b) is a non-crystalline olefin-based resin having a softening point (TsB) that is lower than the TmA and being in a relation of (0° C.<[TmA−TsB]≤100° C.).

Claims (15)

1. An expanded propylene resin bead comprising a core layer being in a foamed state and constituted of a propylene-based resin composition (a) and a cover layer covering the core layer and constituted of an olefin-based resin (b),

the propylene-based resin composition (a) satisfying the following (i) and (ii), and the olefin-based resin (b) satisfying the following (iii) or (iv):

(i) the propylene-based resin composition (a) is a mixture of 65% by weight to 98% by weight of a propylene-based resin (a1) having a melting point of 145° C. or more and less than 165° C. and a flexural modulus of 1,200 MPa or more and 35% by weight to 2% by weight of a propylene-based resin (a2) having a melting point of 135° C. to 145° C. and a flexural modulus of 1,000 MPa to 1,200 MPa, provided that a sum total weight of the propylene-based resin (a1) and the propylene-based resin (a2) is 100% by weight, wherein the propylene-based resin (a2) is obtained through polymerization in the presence of a metallocene-based polymerization catalyst;

(ii) a difference between the melting point of the propylene-based resin (a1) and the melting point of the propylene-based resin (a2) [(melting point of a1)−(melting point of a2)] is 5° C. to 25° C.;

(iii) the olefin-based resin (b) is a crystalline olefin-based resin having a melting point (TmB) that is lower than a melting point (TmA) of the propylene-based resin composition (a), with a difference between the melting point (TmA) and the melting point (TmB) [TmA−TmB] being more than 0° C. and 80° C. or less; and

(iv) the olefin-based resin (b) is a non-crystalline olefin-based resin having a softening point (TsB) that is lower than the melting point (TmA) of the propylene-based resin composition (a), with a difference between the melting point (TmA) and the softening point (TsB) [TmA−TsB] being more than 0° C. and 100° C. or less.

2. The expanded propylene resin bead according to claim 1 , wherein in a first time DSC curve obtained by the heat flux differential scanning calorimetry when heated from ambient temperature to 200° C. at a heating rate of 10° C./min, the expanded propylene resin bead has a ratio of a partial endothermic peak calorific value in a range of from 80° C. to 145° C. to a total endothermic peak calorific value of 0.30 to 0.45.

3. The expanded propylene resin bead according to claim 1 , wherein in the item (ii), the difference in melting point between the propylene-based resin (a1) and the propylene-based resin (a2) [(melting point of a1)−(melting point of a2)] is 10 to 25° C.

4. The expanded propylene resin bead according to claim 1 , wherein the propylene-based resin (a2) and the propylene-based resin (a1) are a propylene-based resin obtained through polymerization in the presence of a metallocene-based polymerization catalyst.

5. The expanded propylene resin bead according to claim 1 , wherein the propylene-based resin (a2) is a propylene-based random copolymer obtained through polymerization in the presence of a metallocene-based polymerization catalyst, and the propylene-based resin (a1) is a propylene-based copolymer.

6. The expanded propylene resin bead according to claim 1 , wherein the propylene-based resin composition (a) has a content of the propylene-based resin (a1) of 70% by weight to 90% by weight and a content of the propylene-based resin (a2) of 10% by weight to 30% by weight.

7. The expanded propylene resin bead according to claim 1 , wherein the olefin-based resin (b) is a propylene-based resin obtained through polymerization in the presence of a metallocene-based polymerization catalyst.

8. The expanded propylene resin bead according to claim 1 , wherein the olefin-based resin (b) is an ethylene-based resin obtained through polymerization in the presence of a metallocene-based polymerization catalyst.

9. An expanded propylene resin beads molded article obtained through in-mold molding of the expanded propylene resin beads according to claim 1 .

10. The expanded propylene resin beads molded article according to claim 9 , wherein the article is prepared using in-mold molding with a pressure of molding steam of 0.32 MPa to 0.34 MPa.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2017
From: OIKAWA, MASAHARU; KOSHITA, NOBUMASA; TAKAGI, SYOUTA
To: JSP CORPORATION
Reel/Frame 042932/0831 →
Continuity (1)
Related Publication 20180022886A1 · Jan 25, 2018
Cited By (1)
US 12,240,956