Guard rings including semiconductor fins and regrown regions
A method includes forming a gate stack over a semiconductor fin, wherein the semiconductor fin forms a ring, and etching a portion of the semiconductor fin not covered by the gate stack to form a recess. The method further includes performing an epitaxy to grow an epitaxy semiconductor region from the recess, forming a first contact plug overlying and electrically coupled to the epitaxy semiconductor region, and forming a second contact plug, wherein the second contact plug is overlying and electrically coupled to the gate stack.
1. A device comprising:
a semiconductor substrate;
a guard ring comprising:
a first plurality of semiconductor fins aligned to a first ring, wherein the first ring encircles a portion of the semiconductor substrate;
a plurality of gate stacks on sidewalls and top surfaces of the first plurality of semiconductor fins;
a plurality of semiconductor regions, with each comprising a portion between two of the first plurality of semiconductor fins; and
a well region overlapped by the plurality of semiconductor regions and the first plurality of semiconductor fins, wherein the plurality of semiconductor regions and the well region are of a same conductivity type; and
a second plurality of semiconductor fins aligned to a second ring, with the plurality of gate stacks further extending on sidewalls and top surfaces of the second plurality of semiconductor fins, wherein the second ring encircles the first ring.
2. The device of claim 1 , wherein both the plurality of semiconductor regions and the well region are of p-type.
3. The device of claim 1 , wherein both the plurality of semiconductor regions and the well region are of n-type.
4. The device of claim 1 further comprising a plurality of gate contact plugs over and electrically connected to the plurality of gate stacks, wherein the plurality of gate contact plugs are electrically interconnected.
5. The device of claim 1 further comprising a plurality of contact plugs over and electrically connected to the plurality of semiconductor regions, wherein the plurality of contact plugs are electrically interconnected.
6. The device of claim 1 further comprising a metal line electrically intercoupling the plurality of gate stacks, electrically intercoupling the plurality of semiconductor regions, and electrically coupling the plurality of gate stacks to the plurality of semiconductor regions.
7. A device comprising:
a semiconductor substrate;
a first combined structure comprising:
a first plurality of semiconductor fins aligned to a first straight line;
a first plurality of epitaxy semiconductor regions interconnecting neighboring ones of the first plurality of semiconductor fins; and
a first plurality of gate stacks on sidewalls and top surfaces of the first plurality of semiconductor fins, wherein the first plurality of gate stacks are electrically intercoupled; and
a second combined structure comprising:
a second plurality of semiconductor fins aligned to a second straight line, wherein a portion of the semiconductor substrate is between the first combined structure and the second combined structure;
a second plurality of epitaxy semiconductor regions interconnecting neighboring ones of the second plurality of semiconductor fins; and
a second plurality of gate stacks on sidewalls and top surfaces of the second plurality of semiconductor fins, wherein the second plurality of gate stacks are electrically intercoupled, and are electrically coupled to the first plurality of gate stacks.
8. The device of claim 7 further comprising:
a third combined structure physically connecting the first combined structure to the second combined structure, the third combined structure comprising:
a third plurality of semiconductor fins;
a third plurality of epitaxy semiconductor regions interconnecting neighboring ones of the third plurality of semiconductor fins; and
a third plurality of gate stacks on sidewalls and top surfaces of the third plurality of semiconductor fins, wherein the third plurality of gate stacks are electrically intercoupled.
9. The device of claim 8 further comprising:
a fourth combined structure physically connecting the first combined structure to the second combined structure, wherein the first, the second, the third, and the fourth combined structures form a ring encircling the portion of the semiconductor substrate, and the fourth combined structure comprising:
a fourth plurality of semiconductor fins;
a fourth plurality of epitaxy semiconductor regions interconnecting neighboring ones of the fourth plurality of semiconductor fins; and
a fourth plurality of gate stacks on sidewalls and top surfaces of the fourth plurality of semiconductor fins, wherein the fourth plurality of gate stacks are electrically intercoupled.
10. The device of claim 7 , wherein the first plurality of gate stacks and the second plurality of gate stacks are further electrically connected to the first plurality of epitaxy semiconductor regions and the second plurality of epitaxy semiconductor regions.
11. The device of claim 7 , wherein the first plurality of epitaxy semiconductor regions and the second plurality of epitaxy semiconductor regions are of a same conductivity type.
12. The device of claim 11 further comprising a well region underlying the first plurality of epitaxy semiconductor regions and the first plurality of semiconductor fins, wherein the well region is of the same conductivity type.
13. The device of claim 7 further comprising:
a conductive line; and
a plurality of contact plugs connecting the first plurality of epitaxy semiconductor regions and the first plurality of gate stacks to the conductive line.
14. A device comprising:
a semiconductor substrate;
isolation regions extending into the semiconductor substrate;
a semiconductor ring comprising:
a plurality of semiconductor fins separated from each other and protruding higher than the isolation regions;
a plurality of gate stacks on top surfaces and sidewalls of the plurality of semiconductor fins; and
a plurality of epitaxy semiconductor regions interconnecting the plurality of semiconductor fins; and
a plurality of silicide regions, each over and contacting one of the plurality of epitaxy semiconductor regions; and
a voltage source electrically connected to, and configured to apply a same voltage to, the plurality of gate stacks.
15. The device of claim 14 , wherein the plurality of epitaxy semiconductor regions are of p-type, and the voltage source is configured to provide a negative voltage or a ground voltage to the plurality of epitaxy semiconductor regions.
16. The device of claim 14 , wherein the plurality of epitaxy semiconductor regions are of n-type, and the voltage source is configured to provide a positive voltage to the plurality of epitaxy semiconductor regions.
17. The device of claim 14 , wherein the semiconductor ring is connected to the semiconductor substrate.
18. The device of claim 14 further comprising a transistor encircled by the semiconductor ring.
19. The device of claim 14 , wherein the voltage source is electrically connected to, and configured to apply a same voltage to, the plurality of epitaxy semiconductor regions.
20. The device of claim 1 , wherein each of the plurality of semiconductor regions further comprises a second portion between two of the second plurality of semiconductor fins.