Semiconductor apparatus and semiconductor system including the same

1. A semiconductor apparatus comprising:

a package substrate; and

a semiconductor chip,

wherein the package substrate comprises a substrate pad coupled with a package ball,

wherein the semiconductor chip comprises:

a main pad coupled with the substrate pad;

a first buffer coupled with the main pad; and

an auxiliary pad coupled with the first buffer.

2. The semiconductor apparatus according to claim 1 ,

wherein transmission of a signal from the semiconductor chip to an external of the semiconductor chip is performed through the substrate pad, and

wherein reception of a signal received externally from the semiconductor chip is performed through the substrate pad.

3. The semiconductor apparatus according to claim 1 , wherein the main pad is wire-bonded with the substrate pad, and the main pad and the auxiliary pad are indirectly coupled with each other.

4. The semiconductor apparatus according to claim 1 , wherein the main pad is coupled with the substrate pad through a through electrode, and the main pad and the auxiliary pad are not coupled directly with each other.

5. The semiconductor apparatus according to claim 1 , further comprising:

a second buffer coupled with the first buffer, the auxiliary pad and an internal circuit of the semiconductor chip.

6. The semiconductor apparatus according to claim 5 , wherein the second buffer buffers a signal outputted from the first buffer and provides the buffered signal to the internal circuit of the semiconductor chip, or buffers a signal outputted from the internal circuit and provides the buffered signal to the first buffer.

7. A semiconductor apparatus comprising:

a package substrate; and

a first semiconductor chip and a second semiconductor chip stacked with the package substrate,

wherein the package substrate comprises a substrate pad coupled with a package ball,

wherein the first semiconductor chip comprises:

a first main pad coupled with the substrate pad;

a first buffer coupled with the first main pad;

a first auxiliary pad coupled with the first buffer; and

a second buffer coupled with the first buffer and the first auxiliary pad, and

wherein the second semiconductor chip comprises:

a second auxiliary pad coupled with the first auxiliary pad.

8. The semiconductor apparatus according to claim 7 ,

wherein transmission of a signal from the semiconductor chip to an external of the semiconductor chip is performed through the substrate pad, and

wherein reception of a signal received externally from the semiconductor chip is performed through the substrate pad.

9. The semiconductor apparatus according to claim 7 , wherein the first main pad is wire-bonded with the substrate pad, and the first main pad is indirectly coupled with the first auxiliary pad.

10. The semiconductor apparatus according to claim 7 , wherein the second buffer buffers a signal outputted from the first buffer and provides the buffered signal to an internal circuit of the first semiconductor chip, or buffer a signal outputted from the internal circuit and provides the buffered signal to the first buffer.

11. The semiconductor apparatus according to claim 7 , wherein the second auxiliary pad is wire-bonded with the first auxiliary pad.

12. The semiconductor apparatus according to claim 11 , further comprising:

a third semiconductor chip stacked with the first and second semiconductor chips over the package substrate,

wherein the third semiconductor chips comprises a third auxiliary pad, and

wherein the third auxiliary pad of the third semiconductor chip is wire-bonded with the second auxiliary pad.

13. The semiconductor apparatus according to claim 12 ,

wherein the second semiconductor chip further comprises a second main pad, and the third semiconductor chip further comprises a third main pad, and

wherein the second main pad and the third main pad are not wire-bonded with the substrate pad.

14. The semiconductor apparatus according to claim 7 ,

wherein the second semiconductor chip further comprises:

a second main pad;

a third buffer coupled with the second main pad; and

a fourth buffer coupled with the third buffer and the second auxiliary pad, and

wherein the second main pad is not wire-bonded with the substrate pad.

15. A semiconductor apparatus comprising:

a package substrate; and

a first semiconductor chip stacked over the package substrate,

wherein the package substrate comprises:

a substrate pad which is coupled with a package ball, and

wherein the first semiconductor chip comprises:

a main pad coupled with the substrate pad;

an auxiliary pad; and

a buffer configured to couple the main pad and the auxiliary pad.

16. The semiconductor apparatus according to claim 15 ,

wherein the semiconductor apparatus further comprises a plurality of semiconductor chips which are stacked with the first semiconductor chip,

wherein each of the plurality of semiconductor chips comprises a main pad and an auxiliary pad, and

wherein the auxiliary pads of adjacent semiconductor chips among the plurality of semiconductor chips are wire-bonded with each other, and main pads of the plurality of semiconductor chips are not wire-bonded with the first substrate pad.

17. The semiconductor apparatus according to claim 15 ,

wherein the semiconductor apparatus further comprises a plurality of semiconductor chips which are stacked with the first semiconductor chip,

wherein each of the plurality of semiconductor chips comprises a main pad and an auxiliary pad,

wherein the first semiconductor chip and the plurality of semiconductor chips are classified into first to n^th groups, the main pad of at least one semiconductor chip of each group is wire-bonded with the substrate pad, and the auxiliary pads of semiconductor chips of each group are wire-bonded with each other, and

wherein n is an integer equal to or greater than two.

18. The semiconductor apparatus according to claim 16 ,

wherein the auxiliary pads of adjacent semiconductor chips among the plurality of semiconductor chips in the each group are wire-bonded with each other.