Cascode radio frequency (RF) power amplifier on single diffusion

1. An amplifier, comprising:

a cascode structure comprising a first transistor having first characteristics coupled to a second transistor having second characteristics different than the first characteristics, the first transistor located with the second transistor on a single diffusion, the single diffusion having no intervening insulating layer separating the first transistor from the second transistor, the single diffusion comprising at least a P-type well region, a floating P body region having a P+ island, and a no well region having a native state of a silicon-on-insulator (SOI) layer on which the amplifier is located.

2. The amplifier of claim 1 , wherein the first transistor is a transconductance N-type metal oxide semiconductor (NMOS) transistor.

3. The amplifier of claim 1 , wherein the second transistor is a high-voltage N-type metal oxide semiconductor (NMOS) transistor.

4. The amplifier of claim 1 , wherein a gate oxide thickness of the first transistor is different than a gate oxide thickness of the second transistor.

5. The amplifier of claim 1 , wherein a channel length of the first transistor is different than a channel length of the second transistor.

6. The amplifier of claim 1 , wherein:

a gate oxide thickness of the second transistor is thicker than a gate oxide thickness of the first transistor; and

a channel length of the second transistor is wider than a channel length of the first transistor.

7. The amplifier of claim 1 , wherein a gate of the second transistor is wider than a gate of the first transistor, the gate of the second transistor comprising an additional segment forming a resistance associated with the gate of the second transistor.

8. The amplifier of claim 1 , wherein a gate of the second transistor is wider than a gate of the first transistor, the gate of the second transistor having a capacitance associated with the gate of the second transistor.

9. The amplifier of claim 1 , further comprising a floating diffusion covering a drain of the first transistor and a source of the second transistor, the floating diffusion comprising the floating P body region having the P+ island covering one side of the floating diffusion on the source side of the second transistor.

10. The amplifier of claim 9 , wherein the P+ islands are interspersed with N+ material to tap the floating P body region.

11. The amplifier of claim 1 , further comprising a lightly doped N-drift region covering the drain of the second transistor.

12. The amplifier of claim 11 , wherein silicidation of the lightly doped N-drift region is blocked by a mask on a side of the drain of the second transistor.

13. A cascode amplifier, comprising:

a first transistor configured as a transconductance N-type metal oxide semiconductor (NMOS) transistor; and

a second transistor configured as a high-voltage N-type metal oxide semiconductor (NMOS) transistor, the first transistor and the second transistor located on a single diffusion, wherein a gate oxide thickness of the first transistor is different than a gate oxide thickness of the second transistor, the single diffusion having no intervening insulating layer separating the first transistor from the second transistor, the single diffusion comprising at least a P-type well region, a floating P body region having a P+ island, and a no well region having a native state of a silicon-on-insulator (SOI) layer on which the amplifier is located.

14. The amplifier of claim 13 , wherein a channel length of the first transistor is different than a channel length of the second transistor.

15. The amplifier of claim 13 , wherein a gate oxide thickness of the second transistor is thicker than a gate oxide thickness of the first transistor.

16. The amplifier of claim 13 , wherein a channel length of the second transistor is wider than a channel length of the first transistor.

17. The amplifier of claim 13 , wherein a gate of the second transistor is wider than a gate of the first transistor, the gate of the second transistor comprising an additional segment forming a resistance associated with the gate of the second transistor.

18. The amplifier of claim 13 , wherein a gate of the second transistor is wider than a gate of the first transistor, the gate of the second transistor having a capacitance associated with the gate of the second transistor.

19. The amplifier of claim 13 , further comprising a floating diffusion covering a drain of the first transistor and a source of the second transistor, the floating diffusion comprising the floating P body region having the P+ island covering one side of the floating diffusion on the source side of the second transistor.

20. The amplifier of claim 19 , wherein the P+ islands are interspersed with N+ material to tap the floating P body region.

21. The amplifier of claim 13 , further comprising a lightly doped N-drift region covering the drain of the second transistor.

22. The amplifier of claim 21 , wherein silicidation of the lightly doped N-drift region is blocked by a mask on a side of the drain of the second transistor.

23. A cascode amplifier, comprising:

a first transistor configured as a transconductance N-type metal oxide semiconductor (NMOS) transistor; and

a second transistor configured as a high-voltage N-type metal oxide semiconductor (NMOS) transistor, the first transistor and the second transistor located on a single diffusion, wherein a channel length of the first transistor is different than a channel length of the second transistor, the single diffusion having no intervening insulating layer separating the first transistor from the second transistor, the single diffusion comprising at least a P-type well region, a floating P body region having a P+ island, and a no well region having a native state of a silicon-on-insulator (SOI) layer on which the amplifier is located.

24. The amplifier of claim 23 , wherein a gate oxide thickness of the first transistor is different than a gate oxide thickness of the second transistor.

25. The amplifier of claim 23 , wherein:

a gate oxide thickness of the second transistor is thicker than a gate oxide thickness of the first transistor; and

a channel length of the second transistor is wider than a channel length of the first transistor.

26. The amplifier of claim 23 , wherein a gate of the second transistor is wider than a gate of the first transistor, the gate of the second transistor comprising an additional segment forming a resistance associated with the gate of the second transistor.

27. The amplifier of claim 23 , wherein a gate of the second transistor is wider than a gate of the first transistor, the gate of the second transistor having a capacitance associated with the gate of the second transistor.

28. The amplifier of claim 25 , further comprising:

a floating diffusion covering a drain of the first transistor and a source of the second transistor, the floating diffusion comprising the floating P body region having the P+ island covering one side of the floating diffusion on the source side of the second transistor, wherein the P+ islands are interspersed with N+ material to tap the floating P body region; and

a lightly doped N-drift region covering the drain of the second transistor, wherein silicidation of the lightly doped N-drift region is blocked by a mask on a side of the drain of the second transistor.