IP Library Granted Patent US 10,340,886
Granted Patent B2
US 10,340,886 · App. 15/317,563 · Granted Jul 2, 2019

Ceramic substrate, layered body, and saw device

Inventors: Keiichiro Geshi (Osaka, JP); Shigeru Nakayama (Osaka, JP)
Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
H03H9/25B32B9/005B32B18/00C04B35/053C04B35/057C04B35/111C04B35/14C04B35/185C04B35/195C04B35/443C04B35/46C04B35/495C04B35/565C04B35/581C04B35/587H03H3/08H03H9/02543H03H9/02559H03H9/02574H03H9/02669H03H9/058H03H9/08B32B2307/20B32B2457/00C04B2235/3203C04B2235/963C04B2237/34C04B2237/341C04B2237/343C04B2237/345
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Quick Facts
Patent No.
US 10,340,886
App. No.
15/317,563
Granted
Jul 2, 2019
Kind
B2
Abstract

A ceramic substrate is formed of a polycrystalline ceramic and has a supporting main surface. The supporting main surface has a roughness of 0.01 nm or more and 3.0 nm or less in terms of Sa. The number of projections and depressions with a height of 1 nm or more in a square region with 50 μm sides on the supporting main surface is less than 5 on average, and the number of projections and depressions with a height of 2 nm or more in the square region is less than 1 on average.

Claims (13)

1. A ceramic substrate formed of a polycrystalline ceramic and having a supporting main surface,

wherein the supporting main surface has a roughness of 0.01 nm or more and 3.0 nm or less in terms of Sa, and

a number of projections and depressions with a height of 1 nm or more in a square region with 50 μm sides on the supporting main surface is less than 5 on average, and a number of projections and depressions with a height of 2 nm or more in the square region is less than 1 on average.

2. The ceramic substrate according to claim 1 , wherein the supporting main surface has a roughness of 0.5 nm or less in terms of Sq.

3. The ceramic substrate according to claim 1 , wherein the polycrystalline ceramic is made of at least one material selected from the group consisting of spinel, alumina, magnesia, silica, mullite, cordierite, calcia, titania, silicon nitride, aluminum nitride, and silicon carbide.

4. A layered body comprising:

the ceramic substrate according to claim 1 ; and

a piezoelectric substrate disposed on the supporting main surface and formed of a piezoelectric body,

wherein the ceramic substrate and the piezoelectric substrate are bonded to each other through Van der Waals force.

5. The layered body according to claim 4 , wherein bonding strength between the ceramic substrate and the piezoelectric substrate is 0.5 J/m 2 or more.

6. A SAW device comprising:

the layered body according to claim 4 ; and

an electrode formed on a main surface of the piezoelectric substrate, the main surface being located opposite to the ceramic substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2016
From: GESHI, KEIICHIRO; NAKAYAMA, SHIGERU
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 040698/0815 →
Priority Claims (1)
JP 2016-057300 · Mar 22, 2016 · national
Continuity (1)
Related Publication 20170279435A1 · Sep 28, 2017