IP Library Granted Patent US 10,346,087
Granted Patent B2
US 10,346,087 · App. 15/678,759 · Granted Jul 9, 2019

Apparatus for outputting internal state of memory apparatus and memory system using the apparatus

Inventors: Seong-hoon Woo (Hwaseong-si, KR); Hak-sun Kim (Suwon-si, KR); Kwang-jin Lee (Hwaseong-si, KR); Su-chang Jeon (Seoul, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
G06F3/0653G06F3/0604G06F3/0679G06F13/16G11C7/1063G11C7/20G11C7/22G11C16/20G11C16/32G11C16/0483
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Quick Facts
Patent No.
US 10,346,087
App. No.
15/678,759
Granted
Jul 9, 2019
Kind
B2
Abstract

An apparatus for outputting an internal state of a memory apparatus and a memory system using the apparatus are provided. The apparatus includes a state signal generating circuit that generates a first signal indicating an internal operation state of the memory apparatus, and a state signal output control circuit that receives the first signal and outputs a second signal to an output pad based on a chip enable signal or an initially set function command, or both. The first signal indicates one state from among two states and the second signal indicates one state from among three states.

Claims (30)

1. An apparatus for outputting a state signal of a memory apparatus, the apparatus comprising:

a state signal generating circuit configured to generate a first signal indicating an internal operation state of the memory apparatus; and

a state signal output control circuit configured to receive the first signal and output a second signal to an output pad based on at least one of a chip enable signal and an initially set function command,

wherein the first signal indicates one state from among two states, and the second signal indicates one state from among three states, and

wherein the second signal has a logic state associated with a logic state of the first signal in a chip enable interval of the memory apparatus, and the output pad has a high impedance state irrespective of the logic state of the first signal in a chip disable interval of the memory apparatus.

2. The apparatus of claim 1 , wherein the second signal having a logic state associated with a logic state of the first signal in a chip enable interval according to the initially set function command is output to the output pad, and the output pad has a high impedance state irrespective of the logic state of the first signal in a chip disable interval according to the initially set function command.

3. The apparatus of claim 1 , wherein the first signal comprises a state signal indicating whether the memory apparatus is in a ready state or a busy state.

4. The apparatus of claim 1 , wherein the second signal comprises a state signal indicating a state related to at least one operation from among a read operation, a program operation, and an erase operation performed by the memory apparatus.

5. The apparatus of claim 1 , wherein the state signal output control circuit comprises:

a logic circuit configured to generate a chip enable signal for a way to which the memory apparatus belongs from the initially set function command;

a push-pull circuit configured to invert the first signal input to a first node and output the inverted first signal to a second node; and

a tri-state inverter configured to invert a signal of the second node and output the inverted signal to the output pad when the chip enable signal generated by the logic circuit is in a first logic state,

wherein the output pad has a high impedance state when the chip enable signal generated by the logic circuit is in a second logic state.

6. The apparatus of claim 1 , wherein the first signal is generated according to each die or plane of the memory apparatus, and the second signal is output through the output pad allocated according to the die or plane.

7. An apparatus for outputting a state signal of a memory apparatus, the apparatus comprising:

a state signal generating circuit configured to generate a first signal indicating an internal operation state of the memory apparatus; and

a state signal output control circuit configured to receive the first signal and output a second signal to an output pad based on at least one of a chip enable signal and an initially set function command,

wherein the first signal indicates one state from among two states, and the second signal indicates one state from among three states,

wherein the second signal having a logic state associated with a logic state of the first signal in an interval where the chip enable signal has a first logic state is output to the output pad, and the output pad has a high impedance state irrespective of the logic state of the first signal in an interval where the chip enable signal has a second logic state.

8. An apparatus for outputting a state signal of a memory apparatus, the apparatus comprising:

a state signal generating circuit configured to generate a first signal indicating an internal operation state of the memory apparatus; and

a state signal output control circuit configured to receive the first signal and output a second signal to an output pad based on at least one of a chip enable signal and an initially set function command,

wherein the first signal indicates one state from among two states, and the second signal indicates one state from among three states,

wherein the state signal output control circuit comprises:

a push-pull circuit configured to invert the first signal input to a first node and output the inverted first signal to a second node; and

a tri-state inverter configured to invert a signal of the second node and output the inverted signal to the output pad when the chip enable signal is in a first logic state, and

wherein the output pad has a high impedance state when the chip enable signal is in a second logic state.

9. The apparatus of claim 8 , wherein the push-pull circuit comprises one p-channel metal-oxide-semiconductor (PMOS) transistor and one n-channel metal-oxide-semiconductor (NMOS) transistor,

wherein the PMOS transistor has a gate connected to the first node, a source connected to a power supply terminal, and a drain connected to the second node, and

the NMOS transistor has a gate connected to the first node, a source connected to a ground terminal, and a drain connected to the second node.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2017
From: WOO, SEONG-HOON; KIM, HAK-SUN; LEE, KWANG-JIN; JEON, SU-CHANG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 043309/0866 →
Priority Claims (1)
KR 10-2016-0103752 · Aug 16, 2016 · national
Continuity (1)
Related Publication 20180052639A1 · Feb 22, 2018
Cited By (2)
US 12,411,636 US 12,468,446