Effective substitution of global distributed head switch cells with cluster head switch cells
An IC includes a first IC portion and a second IC portion. The IC includes a first set of standard cells in the first IC portion. The IC includes a plurality of memory cells and a second set of standard cells in the second IC portion. The second set of standard cells is located in channels between the memory cells. The IC further includes a plurality of GDHS cells in the first IC portion. The GDHS cells are configured to switch power on and to switch power off to the first set of standard cells. The IC further includes a plurality of CHS cells in the first IC portion. The CHS cells are configured to switch power on and to switch power off to the second set of standard cells in the second IC portion.
1. An integrated circuit (IC) including a first IC portion and a second IC portion, comprising:
a first set of logic cells in the first IC portion;
a plurality of memory cells and a second set of logic cells in the second IC portion, the second set of logic cells being located in channels between the memory cells;
a plurality of global distributed head switch (GDHS) cells in the first IC portion, the GDHS cells being configured to switch power on and to switch power off to the first set of logic cells; and
a plurality of cluster head switch (CHS) cells in the first IC portion, the CHS cells being configured to switch power on and to switch power off to the second set of logic cells in the second IC portion.
2. The IC of claim 1 , wherein the CHS cells are located on edges of the first IC portion adjacent the second IC portion.
3. The IC of claim 1 , further comprising:
a power distribution network extending across the IC; and
a redistribution layer (RDL) above the power distribution network,
wherein the GDHS cells and the CHS cells are located below the power distribution network and are coupled to the power distribution network, and
wherein the CHS cells are coupled to the second set of logic cells through the RDL.
4. The IC of claim 1 , wherein the first IC portion excludes memory cells.
5. A method of power gating of an integrated circuit (IC) including a first IC portion and a second IC portion, comprising:
power gating a first set of logic cells in the first IC portion through a plurality of global distributed head switch (GDHS) cells in the first IC portion, the GDHS cells being configured to switch power on and to switch power off to the first set of logic cells; and
power gating a second set of logic cells in the second IC portion through a plurality of cluster head switch (CHS) cells in the first IC portion, the second set of logic cells being located in channels between a plurality of memory cells in the second IC portion, the CHS cells being configured to switch power on and to switch power off to the second set of logic cells in the second IC portion.
6. The method of claim 5 , wherein the CHS cells are located on edges of the first IC portion adjacent the second IC portion.
7. The method of claim 5 , wherein the IC comprises:
a power distribution network extending across the IC; and
a redistribution layer (RDL) above the power distribution network,
wherein the GDHS cells and the CHS cells are located below the power distribution network and are coupled to the power distribution network, and
wherein the CHS cells are coupled to the second set of logic cells through the RDL.
8. The method of claim 5 , wherein the first IC portion excludes memory cells.
9. An apparatus for power gating of an integrated circuit (IC) including a first IC portion and a second IC portion, comprising:
means for power gating a first set of logic cells in the first IC portion through a plurality of global distributed head switch (GDHS) cells in the first IC portion, the GDHS cells being configured to switch power on and to switch power off to the first set of logic cells; and
means for power gating a second set of logic cells in the second IC portion through a plurality of cluster head switch (CHS) cells in the first IC portion, the second set of logic cells being located in channels between a plurality of memory cells in the second IC portion, the CHS cells being configured to switch power on and to switch power off to the second set of logic cells in the second IC portion.
10. The apparatus of claim 9 , wherein the CHS cells are located on edges of the first IC portion adjacent the second IC portion.
11. The apparatus of claim 9 , wherein the IC comprises:
a power distribution network extending across the IC; and
a redistribution layer (RDL) above the power distribution network,
wherein the GDHS cells and the CHS cells are located below the power distribution network and are coupled to the power distribution network, and
wherein the CHS cells are coupled to the second set of logic cells through the RDL.
12. The apparatus of claim 9 , wherein the first IC portion excludes memory cells.