IP Library › Granted Patent US 10,347,461
Granted Patent B2
US 10,347,461 · App. 16/022,230 · Granted Jul 9, 2019

Method for the in situ preparation of microscopic specimens

Inventors: Andreas Schmaunz (Oberkochen, DE); Holger Doemer (Bopfingen, DE)
Assignee: Carl Zeiss Microscopy GmbH
H01J37/20H01J37/3053H01J37/3056H01J37/31G01N1/286H01J37/28H01J2237/063H01J2237/08H01J2237/28H01J2237/2802H01J2237/31745H01J2237/31749
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Quick Facts
Patent No.
US 10,347,461
App. No.
16/022,230
Granted
Jul 9, 2019
Kind
B2
Abstract

A method relates to the in situ preparation of a microscopic specimen is carried out using a particle beam device, which includes a particle beam column for producing a focused beam of charged particles, a specimen receptacle for receiving a specimen block, and a detector for detecting interaction products of the interaction between particle beam and specimen material. The method includes: providing a specimen block having an exposed structure that comprises a specimen region of interest; producing a bending edge in the exposed structure by the action of the particle beam such that at least some of the exposed structure is shaped in the direction of the incident particle beam; and moving the specimen receptacle, in which the specimen block is received, so that a specimen region, which is enclosed by the shaped structure, is observable and/or processable in the particle beam device.

Claims (41)

1. A method for in situ preparation of a microscopic specimen, using a particle beam device comprising a particle beam column to produce a focused beam of charged particles, a specimen receptacle to receive a specimen block, and a detector to detect interaction products of the interaction between particle beam and specimen material, the method comprising:

providing a specimen block having a structure that is exposed and that comprises a specimen region of interest;

using the particle beam to produce a bending edge in the exposed structure so that at least some of the exposed structure is shaped in a direction of the incident particle beam; and

moving the specimen receptacle, in which the specimen block is received, so that a specimen region, which is enclosed by the shaped structure, is observable and/or processable in the particle beam device.

2. The method of claim 1 , further comprising observing and/or processing the specimen region of interest with the aid of the particle beam device.

3. The method of claim 1 , wherein producing the bending edge comprises predetermining a desired size of the shape of the exposed structure and producing the desired shape.

4. The method of claim 1 , wherein producing a bending edge is repeated so that the microscopic specimen has a plurality of bending edges.

5. The method of claim 1 , further comprising stabilizing the form of the bending edge by applying a deposition.

6. The method of claim 1 , wherein the particle beam device comprises an ion beam column, and the particle beam comprises a focused ion beam.

7. The method of claim 1 , wherein the particle beam device comprises a multi-beam device, which comprises an ion beam column that produces a focused ion beam and an electron beam column that produces a focused electron beam.

8. The method of claim 1 , wherein:

the particle beam device comprises an electron beam column that produces a focused electron beam and a gas injection system that introduces etching gas; and

the electron beam and etching gas produce the bending edge.

9. The method of claim 1 , wherein providing the exposed structure comprises depositing a coating.

10. The method of claim 9 , wherein the coating comprises platinum.

11. The method of claim 10 , wherein the exposed structure is exposed from the specimen block by etching.

12. The method of claim 11 , further comprising supplying an XeF 2 -precursor for etching purposes.

13. The method of claim 10 , wherein:

a specimen block is provided, in which the specimen region of interest has a particle that is situated on the surface of the specimen block;

by applying a deposition, the particle is embedded in the deposition material;

the deposition is undercut in etching such that the deposition with the particle forms the exposed structure; and

the bending edge is produced in the deposition.

14. The method of claim 1 , wherein the microscopic specimen comprises a TEM lamella.

15. The method of claim 1 , wherein the microscopic specimen comprises a tomography specimen.

16. The method of claim 1 , wherein the exposed structure comprises a conductor track of an electronic component.

17. The method of claim 1 , wherein:

the particle beam device comprises an electron beam column and a STEM detector;

the specimen region of interest is transparent to electrons; and

the method further comprises:

passing electrons from the electron beam column through the specimen region of interest; and

using the STEM detector to detect interaction products arising as a result thereof.

18. One or more machine-readable hardware storage devices comprising instructions that are executable by one or more processing devices to perform operations comprising:

performing the method of claim 1 .

19. A method for transferring a microscopic specimen, carried out using a particle beam device comprising a particle beam column for producing a focused beam of charged particles; a specimen receptacle for receiving a specimen block; a detector for detecting interaction products of the interaction between particle beam and specimen material; and a displaceable transfer apparatus for receiving the microscopic specimen, the method comprising:

providing a specimen block having a structure that is exposed and that comprises the specimen to be prepared;

positioning the transfer apparatus;

using a particle beam to form a bending edge in the exposed structure so that at least some of the exposed structure is shaped in a direction of the incident particle beam, wherein the shaped structure is moved into a vicinity of the transfer apparatus;

fastening the structure to the transfer apparatus; and

severing the structure from the specimen block.

20. One or more machine-readable hardware storage devices comprising instructions that are executable by one or more processing devices to perform operations comprising:

performing the method of claim 19 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2018
From: SCHMAUNZ, ANDREAS; DOEMER, HOLGER
To: CARL ZEISS MICROSCOPY GMBH
Reel/Frame 046418/0417 →
Priority Claims (1)
DE 10 2017 212 020 · Jul 13, 2017 · national
Continuity (1)
Related Publication 20190019650A1 · Jan 17, 2019
Cited By (1)
US 12,676,288