IP Library › Granted Patent US 10,347,648
Granted Patent B2
US 10,347,648 · App. 15/883,730 · Granted Jul 9, 2019

Nonvolatile semiconductor storage device

Inventors: Naoki Yasuda (Yokohama, JP); Masaru Kito (Kuwana, JP)
Assignee: Toshiba Memory Corporation
H01L27/1157H01L21/28282H01L27/11568H01L27/11573H01L27/11582H01L29/511H01L29/513H01L29/517H01L29/518H01L29/792H01L29/7926
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Quick Facts
Patent No.
US 10,347,648
App. No.
15/883,730
Granted
Jul 9, 2019
Kind
B2
Abstract

A nonvolatile semiconductor storage device having a control gate formed on a semiconductor substrate and including a cylindrical through hole. A block insulating film, a charge storage film, a tunnel insulating film, and a semiconductor layer are formed on a side surface of the control gate inside the through hole. The tunnel insulating film includes a first insulating film having SiO 2 as a base material and containing an element that lowers a band gap of the base material by being added. A density and a density gradient of the element monotonously increase from the semiconductor layer toward the charge storage film.

Claims (17)

1. A nonvolatile semiconductor storage device, comprising:

a substrate;

a stacked structural unit including a plurality of electrode films stacked in a first direction, the first direction crossing a surface of the substrate;

a silicon pillar extending in the first direction;

a block insulating film provided between the electrode films and the silicon pillar;

a charge storage film provided between the block insulating film and the silicon pillar; and

a tunnel insulating film provided between the charge storage film and the silicon pillar,

wherein the tunnel insulating film includes a first point, a second point, a third point, and a fourth point in this order from the silicon pillar toward the charge storage film, and

a first band gap at the first point is higher than a second band gap at the second point, a third band gap at the third point is higher than the second band gap, and the third band gap is higher than a fourth band gap at the fourth band gap.

2. The device of claim 1 , wherein the fourth band gap is higher than the second band gap.

3. The device of claim 1 , wherein the tunnel insulating film includes a fifth point between the fourth point and the charge storage film, and

the fourth band gap is higher than a fifth band gap at the fifth point.

4. The device of claim 1 , wherein the first point includes silicon oxide.

5. The device of claim 1 , wherein the third point and the fourth point includes silicon oxide and nitrogen.

6. The device of claim 5 , wherein a first density of nitrogen at the third point is lower than a second density of nitrogen at the fourth point.

7. The device of claim 1 , wherein the second point includes silicon oxide and a microcrystal.

8. The device of claim 7 , wherein the microcrystal is silicon microcrystal.

Assignments (3)
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
Priority Claims (1)
JP 2011-195846 · Sep 8, 2011 · national
Continuity (6)
Continuation 15334828 · Oct 26, 2016
Continuation 14944483 · Nov 18, 2015
Continuation 14606267 · Jan 27, 2015
Continuation 14157162 · Jan 16, 2014
Division 13428111 · Mar 23, 2012
Related Publication 20180175048A1 · Jun 21, 2018