Organic light emitting diode display and method of manufacturing the same

1. An organic light emitting diode display, comprising:

a substrate including a display area in which a plurality of pixels are disposed and a peripheral area positioned around the display area;

a thin film transistor comprising a gate electrode, a source electrode and a drain electrode;

a pixel electrode connected to the thin film transistor;

a common electrode overlapping the pixel electrode;

a touch signal transfer wiring disposed in the peripheral area on the substrate;

an insulating layer disposed on the substrate, the insulating layer covering at least a portion of the touch signal transfer wiring and including a protrusion and an opening partially overlapping the touch signal transfer wiring;

a connection conductor connected to the touch signal transfer wiring through the opening and disposed on the insulating layer;

an encapsulation substrate facing the substrate and including a touch area corresponding to the display area and a peripheral area disposed around the touch area;

a touch electrode layer disposed under the touch area of the encapsulation substrate; and

a touch wiring connected to the touch electrode layer and disposed under the peripheral area of the encapsulation substrate,

wherein the connection conductor is formed of a same material as the common electrode and is directly connected to the touch wiring and the touch signal transfer wiring which is formed of a same material as the source electrode,

wherein the connection conductor comprises a first portion, a second portion and a third portion, and

wherein the third portion is located between the first portion and the second portion, and the first portion and the second portion directly contact the touch wiring.

2. The organic light emitting diode display of claim 1 , wherein:

the connection conductor is disposed in the peripheral area of the substrate.

3. The organic light emitting diode display of claim 2 , further comprising:

a sealing member disposed at an outer region of the peripheral area of the substrate,

wherein the connection conductor is disposed inside the sealing member.

4. The organic light emitting diode display of claim 1 , wherein:

the protrusion completely encloses a circumference of the opening.

5. The organic light emitting diode display of claim 1 , wherein:

the protrusion is disposed at one side of a circumference of the opening.

6. The organic light emitting diode display of claim 1 , wherein:

the insulating layer includes a plurality of openings and the protrusion encloses the plurality of openings.

7. The organic light emitting diode display of claim 1 , wherein:

the insulating layer and the connection conductor are disposed in the display area.

8. The organic light emitting diode display of claim 1 , further comprising:

an organic emission layer, and a pixel defined layer partitioning the organic emission layer that are disposed in the display area.

9. The organic light emitting diode display of claim 8 , wherein:

the protrusion comprises the same material as the pixel defined layer.

10. A method of manufacturing an organic light emitting diode display, comprising:

providing a substrate including a display area in which a plurality of pixels are disposed and a peripheral area disposed around the display area;

forming a touch signal transfer wiring in the peripheral area on the substrate;

forming an insulating layer on the substrate, the insulating layer covering the touch signal transfer wiring on the substrate and including a protrusion formed to protrude upward and an opening partially overlapping the touch signal transfer wiring;

forming a connection conductor connected to the touch signal transfer wiring through the opening on the insulating layer;

providing an encapsulation substrate including a touch area corresponding to the display area and a peripheral area disposed around the touch area and facing the substrate;

forming a touch electrode layer under the touch area of the encapsulation substrate;

forming a touch wiring under the peripheral area of the encapsulation substrate, the touch wiring connected to the touch electrode layer; and

adhering the touch signal transfer wiring and the touch wiring to each other through the connection conductor by pressing the touch signal transfer wiring and the touch wiring toward each other,

wherein the insulation layer and the protrusion are formed of a same material and formed in one piece, and a maximum thickness of the insulating layer disposed in the peripheral area is greater than that disposed in the display area,

wherein the connection conductor directly connects the touch signal transfer wiring and the touch wiring,

wherein the connection conductor comprises a first portion, a second portion and a third portion, and

wherein the third portion is located between the first portion and the second portion, and the first portion and the second portion directly contact the touch wiring.

11. The method of claim 10 , wherein:

the connection conductor is disposed in the peripheral area of the substrate.

12. The method of claim 11 , further comprising:

positioning a sealing member at an outer region of the peripheral area of the substrate,

wherein the connection conductor is disposed inside the sealing member.

13. The method of claim 10 , further comprising:

forming a pixel electrode, an organic emission layer, a common electrode, and a pixel defined layer partitioning the organic emission layer in the display area.

14. The method of claim 13 , wherein:

the protrusion comprises a same material as the pixel defined layer.

15. The method of claim 13 , wherein:

the connection conductor comprises a same material as the common electrode.