Semiconductor device and manufacturing method thereof
A device includes a wiring substrate. A first semiconductor-chip has a first face, a second face, and a first side face between an outer edge of the first face and an outer edge of the second face, where the first side face is a first condition plane. The first semiconductor-chip is located above the wiring substrate. A second semiconductor-chip has a third face, a fourth face, a second side face between an outer edge of the third face and an outer edge of the fourth face, and a through electrode passing through at least a semiconductor substrate between the third face and the fourth face. The second side face is the first condition plane and a second condition plane having more irregularities than the first condition plane. The second semiconductor-chip is located between the wiring substrate and the first semiconductor-chip. The resin is located around the first and second semiconductor-chips.
1. A semiconductor device comprising:
a wiring substrate;
a first semiconductor chip having a first face, a second face on an opposite side to the first face, and a first side face between an outer edge of the first face and an outer edge of the second face, and the first semiconductor chip being located above the wiring substrate so that the first face faces a surface of the wiring substrate;
a second semiconductor chip having a third face, a fourth face on an opposite side to the third face, a second side face between an outer edge of the third face and an outer edge of the fourth face, and a through electrode passing through at least a semiconductor substrate between the third face and the fourth face, where the second side face has a first portion having more irregularities than the first side face, and the second semiconductor chip being located between the wiring substrate and the first semiconductor chip so that the third face faces the surface of the wiring substrate; and
a resin located around the first and second semiconductor chips.
2. The device of claim 1 , wherein the second semiconductor chip further comprises a first metal bump electrically connecting the through electrode to the first semiconductor chip or another second semiconductor chip.
3. The device of claim 2 , further comprising a third semiconductor chip having a fifth face, a sixth face on an opposite side to the fifth face, and a third side face between an outer edge of the fifth face and an outer edge of the sixth face, the third semiconductor chip being located between the wiring substrate and the second semiconductor chip so that the fifth face faces the surface of the wiring substrate.
4. The device of claim 2 , comprising an adhesive between the first semiconductor chip and the second semiconductor chip.
5. The device of claim 2 , comprising an electrode pad on a third face of the second semiconductor chip, where the third face is located on a side of the wiring substrate, and comprising an adhesive between the first semiconductor chip and the second semiconductor chip, wherein
a density of the adhesive on a fourth face opposed to the electrode pad is higher than that in a part of the fourth face corresponding to a part of the third face where no electrode pad is placed.
6. The device of claim 1 , further comprising a third semiconductor chip having a fifth face, a sixth face on an opposite side to the fifth face, and a third side face between an outer edge of the fifth face and an outer edge of the sixth face, the third semiconductor chip being located between the wiring substrate and the second semiconductor chip so that the fifth face faces the surface of the wiring substrate.
7. The device of claim 6 , comprising an adhesive between the wiring substrate and the second semiconductor chip and between the wiring substrate and the third semiconductor chip.
8. The device of claim 6 , comprising an electrode pad on a third face of the second semiconductor chip, where the third face is located on a side of the wiring substrate, and comprising an adhesive between the first semiconductor chip and the second semiconductor chip, wherein
a density of the adhesive on a fourth face opposed to the electrode pad is higher than that in a part of the fourth face corresponding to a part of the third face where no electrode pad is placed.
9. The device of claim 8 , wherein
the adhesive on the fourth face comprises
a first adhesive being placed near the electrode pad and having a first area, and
a second adhesive being placed at a position farther from the electrode pad than the first adhesive and having a second area smaller than the first area.
10. The device of claim 1 , comprising an adhesive between the first semiconductor chip and the second semiconductor chip.
11. The device of claim 10 , further comprising a support body on the second face of the first semiconductor chip.
12. The device of claim 1 , further comprising a support body on the second face of the first semiconductor chip.
13. The device of claim 1 , comprising an electrode pad on a third face of the second semiconductor chip, where the third face is located on a side of the wiring substrate, and comprising an adhesive between the first semiconductor chip and the second semiconductor chip, wherein
a density of the adhesive on a fourth face opposed to the electrode pad is higher than that in a part of the fourth face corresponding to a part of the third face where no electrode pad is placed.
14. The device of claim 1 , wherein
the first side face is a cleavage plane which is a crystal plane of a semiconductor single crystal.
15. The device of claim 14 , wherein
the second side face is a modified plane having more irregularities than the cleavage plane.
16. The device of claim 1 , wherein
the first condition plane is a mirror plane containing few irregularities.
17. The device of claim 1 , wherein
the first side face has a same crystal plane of a semiconductor single crystal, entirely.