Systems and methods for lighting fixtures
Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
1. A heat sink comprising:
a substrate having a heat sink rating, a top heat dissipation surface area, and a width;
at least one light source positioned on a first surface of the substrate;
at least one bend extending along a length of the substrate, wherein a height of the substrate is modified based on the length of substrate by changing an angle of the at least one bend to achieve the heat sink rating based on the width of the substrate.
2. The heat sink of claim 1 , wherein a mechanical rigidity of the heat sink is based on the height.
3. The heat sink of claim 2 , wherein the mechanical rigidity of the heat sink is in a direction perpendicular to a direction of the at least one bend.
4. The heat sink of claim 1 , wherein increasing the width increases the top heat dissipation surface area.
5. The heat sink of claim 1 , wherein the substrate is metal-core printed circuit board.
6. The heat sink of claim 1 , further comprising:
a second bend, the at least one bend and the second bend being position on different sides of the at least one light source, the at least one first bend and the second bend being asymmetrical.
7. The heat sink of claim 1 , further comprising:
a coating positioned on a second surface of the substrate;
reflectors positioned on the second surface of the substrate, wherein the reflectors are positioned on the second surface of the substrate before the coating.
8. The heat sink of claim 7 , wherein the reflectors are positioned around the at least one light surface.
9. The heat sink of claim 8 , wherein the reflectors are positioned on the at least one bend.
10. The heat sink of claim 1 , wherein the height is based in part on a length of the heat sink.
11. A method for dissipating heat using a heat sink comprising:
positioning at least one light source on a first surface of the substrate;
positioning at least one bend extending along a longitudinal axis of the substrate;
determining a rating of the heat sink;
determining a width of a top heat dissipation surface area of the heat sink;
determining a length of the heat sink;
modifying a height of the heat sink by changing an angle of a first bend extending along the length of the heat sink to achieve the rating of the heat sink;
generating heat, via the at least one light source;
flowing the heat around the first bend.
12. The method of claim 11 , further comprising:
increasing a mechanical rigidity of the heat sink by increasing the height.
13. The method of claim 12 , wherein the mechanical rigidity of the heat sink is in a direction perpendicular to a direction of the bend.
14. The method of claim 11 , wherein increasing the width increases the top heat dissipation surface area of the heat sink.
15. The method of claim 11 , wherein the substrate is metal-core printed circuit board.
16. The method of claim 11 , further comprising:
forming a second bend, the first bend and the second bend being position on different sides of the at least one light source, the first bend and the second bend being asymmetrical.
17. The method of claim 11 , further comprising:
positioning reflectors on a second surface of the substrate
positioning a coating positioned on the second surface of the substrate after the reflectors are positioned on the second surface of the substrate.
18. The method of claim 17 , wherein the reflectors are positioned around the at least one light surface.
19. The method of claim 18 , wherein the reflectors are positioned on the first bend.
20. The method of claim 11 , wherein the height of the height sink is dependent on the length of the heat sink.