Semiconductor device
A semiconductor device includes a switching device region including an active region having a first conductivity-type emitter region formed on an upper surface side of a first conductivity-type substrate, a second conductivity-type base region formed on an upper surface side of the substrate, a second conductivity-type collector layer formed on a lower surface side of the substrate, and a diode region having a second conductivity-type anode layer formed on the upper surface side of the substrate and a first conductivity-type cathode layer formed on the lower surface side of the substrate, wherein the cathode layer is separated from the active region when planarly viewed, and on an upper surface side of the active region, a second conductivity type high-concentration region having an impurity concentration higher than that of the anode layer is formed.
1. A semiconductor device comprising:
a switching device region including an active region having a first conductivity-type emitter region formed at an upper surface of a semiconductor substrate, a second conductivity-type base region formed on an upper surface side of the semiconductor substrate and adjacent the first conductivity-type emitter region, a gate electrode, a second conductivity-type collector layer formed on a lower surface side of the semiconductor substrate, and a first conductivity-type region between the base region and the collector layer;
a diode region having a second conductivity-type anode layer formed on the upper surface side of the semiconductor substrate and a first conductivity-type cathode layer formed on the lower surface side of the semiconductor substrate; and
an upper surface electrode formed on the upper surface of the substrate, wherein
the cathode layer is separated from the active region such that no cathode layer portion overlaps with the active region when planarly viewed,
at an upper surface of the semiconductor substrate in the active region, a second conductivity-type high concentration region having an impurity concentration higher than that of the anode layer is formed,
the switching device region has a gate region in which an external gate electrode and a conductive gate line are formed between the active region and the diode region, the conductive gate line connecting the external gate electrode and the gate electrode,
the semiconductor device comprising a second conductivity-type well region formed on the semiconductor substrate in the gate region, wherein the cathode layer is separated from the well region when planarly viewed,
the external gate electrode and the conductive gate line are disposed above the upper surface of the semiconductor substrate, and
the second conductivity-type high concentration region is a P + contact region having an impurity concentration higher than that of the base region.
2. The semiconductor device according to claim 1 , wherein the high concentration region is the base region.
3. The semiconductor device according to claim 1 , wherein
a distance between the cathode layer and the active region when planarly viewed is equal to or longer than a length obtained by lifetime of carriers×100 in units of meters and seconds in the semiconductor substrate.
4. The semiconductor device according to claim 1 , wherein
the distance between the cathode layer and the active region when planarly viewed is 1.5 or more times a thickness of the semiconductor substrate.
5. The semiconductor device according to claim 1 , wherein
the well region is formed on the active region side of the gate region and is not formed on the diode region side of the gate region.
6. The semiconductor device according to claim 1 , comprising
a first conductivity-type carrier store region formed between the anode layer and the semiconductor substrate and having an impurity concentration higher than that of the semiconductor substrate.