IP Library › Granted Patent US 10,361,337
Granted Patent B2
US 10,361,337 · App. 15/681,234 · Granted Jul 23, 2019

Micro light-emitting diode (LED) display and fluidic self-assembly of same

Inventors: Khaled Ahmed (Santa Clara, CA); Anup Pancholi (Santa Clara, CA); Ali Khakifirooz (Santa Clara, CA)
Assignee: Intel Corporation
H01L33/005H01L2933/0008
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Quick Facts
Patent No.
US 10,361,337
App. No.
15/681,234
Granted
Jul 23, 2019
Kind
B2
Abstract

Micro light-emitting diode (LED) displays and assembly apparatuses are described. In an example, method of manufacturing a micro-light emitting diode (LED) display panel includes positioning a display backplane substrate in a tank or container, the display backplane substrate having microgrooves therein. The method also includes adding a fluid to the tank or container, the fluid including a suspension of light-emitting diode (LED) pixel elements therein. The method also includes moving the fluid over the display backplane substrate. The method also includes assembling LED pixel elements from the fluid into corresponding ones of the microgrooves.

Claims (11)

1. A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:

positioning a display backplane substrate in a tank or container, the display backplane substrate having microgrooves therein;

adding a fluid to the tank or container, the fluid including a suspension of light-emitting diode (LED) pixel elements therein;

moving the fluid over the display backplane substrate, wherein moving the fluid comprises repeatedly circulating the fluid including the suspension of LED pixel elements into and out of the tank or container; and

assembling LED pixel elements from the fluid into corresponding ones of the microgrooves.

2. The method of claim 1 , wherein adding the fluid comprises adding a fluid having a surfactant.

3. The method of claim 1 , wherein the microgrooves of the display backplane substrate include a metal layer therein.

4. The method of claim 1 , wherein the microgrooves of the display backplane substrate are trapezoidal, and the suspension of LED pixel elements is a suspension of trapezoidal LED pixel elements.

5. The method of claim 4 , wherein the trapezoidal microgrooves have at least a first size and a second size, and wherein the suspension of trapezoidal LED pixel elements corresponds to the first size but not the second size.

6. The method of claim 1 , wherein the suspension of LED pixel elements is a suspension of nanowire-based LED pixel elements.

7. The method of claim 6 , wherein the suspension of nanowire-based LED pixel elements comprises GaN nanowires or InGaN nanowires.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2022
From: INTEL CORPORATION
To: SAMSUNG ELECTRONICS CO. LTD.
Reel/Frame 058910/0602 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2019
From: AHMED, KHALED; PANCHOLI, ANUP; KHAKIFIROOZ, ALI
To: INTEL CORPORATION
Reel/Frame 049360/0627 →
Continuity (1)
Related Publication 20190058080A1 · Feb 21, 2019
Cited By (3)
US 12,374,669 US 12,500,212 US 12,593,652