Ingot cutting apparatus, and load detecting device used in ingot cutting apparatus
In an ingot cutting apparatus that cuts an ingot using a plurality of stretched wires, load sensors are provided on the new wire side and the old wire side of the ingot, and loads applied to the new wire side and the old wire side of the ingot are measured using the load sensors on the new wire side and the old wire side. When measuring the loads, for example, the center of moment about the X-axis that is the running direction of the wire is calculated. When the deviation from the center of gravity of the ingot is greater than or equal to a reference value, notification for replacement of the wire, control of the conveying speed of the wire, control of the pressing speed of the ingot, and so forth are performed through a control unit.
1. An ingot cutting apparatus that cuts an ingot by pressing the ingot against a wire wound a plurality of turns around a pair of rollers, the apparatus comprising a measuring device that measures loads applied to the ingot or the amount of bending of the wire on a new wire side where new wire is supplied to the ingot and an old wire side where old wire is recovered, wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures the moment of the ingot about an axis along the pressing direction.
2. The ingot cutting apparatus according to claim 1 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a pressing direction of the ingot on the new wire side and the old wire side of the ingot.
3. The ingot cutting apparatus according to claim 1 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a running direction of the wire on the new wire side and the old wire side of the ingot.
4. An ingot cutting apparatus that cuts an ingot by pressing the ingot against a wire wound a plurality of turns around a pair of rollers, the apparatus comprising a measuring device that measures loads applied to the ingot or the amount of bending of the wire on a new wire side where new wire is supplied to the ingot and an old wire side where old wire is recovered, wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures the moment of the ingot about an axis along the running direction of the wire.
5. An ingot cutting apparatus that cuts an ingot by pressing the ingot against a wire wound a plurality of turns around a pair of rollers, the apparatus comprising a measuring device that measures loads applied to the ingot or the amount of bending of the wire on a new wire side where new wire is supplied to the ingot and an old wire side where old wire is recovered, wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures the distance between the center of moment of the ingot about an axis erected from the surface of the plurality of wires and the center of gravity of the ingot.
6. An ingot cutting apparatus that cuts an ingot by pressing the ingot against a wire wound a plurality of turns around a pair of rollers, the apparatus comprising a measuring device that measures loads applied to the ingot or the amount of bending of the wire on a new wire side where new wire is supplied to the ingot and an old wire side where old wire is recovered, wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures the distance between the center of moment of the ingot about an axis along the running direction of the wire and the center of gravity of the ingot.
7. The ingot cutting apparatus according to claim 1 , wherein the measuring device is composed of an inductive proximity sensor that measures the amount of bending of the wire.
8. The ingot cutting apparatus according to claim 4 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a pressing direction of the ingot on the new wire side and the old wire side of the ingot.
9. The ingot cutting apparatus according to claim 4 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a running direction of the wire on the new wire side and the old wire side of the ingot.
10. The ingot cutting apparatus according to claim 4 , wherein the measuring device is composed of an inductive proximity sensor that measures the amount of bending of the wire.
11. The ingot cutting apparatus according to claim 5 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a pressing direction of the ingot on the new wire side and the old wire side of the ingot.
12. The ingot cutting apparatus according to claim 5 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a running direction of the wire on the new wire side and the old wire side of the ingot.
13. The ingot cutting apparatus according to claim 5 , wherein the measuring device is composed of an inductive proximity sensor that measures the amount of bending of the wire.
14. The ingot cutting apparatus according to claim 6 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a pressing direction of the ingot on the new wire side and the old wire side of the ingot.
15. The ingot cutting apparatus according to claim 6 , wherein the measuring device includes load sensors attached to a slicing table holding the ingot, and is a device that measures loads along a running direction of the wire on the new wire side and the old wire side of the ingot.
16. The ingot cutting apparatus according to claim 6 , wherein the measuring device is composed of an inductive proximity sensor that measures the amount of bending of the wire.