Silicon carbide semiconductor device, power module, and power conversion device
Provided is a silicon carbide semiconductor device in which SiC-MOSFETs are formed within an active region of an n-type silicon carbide semiconductor substrate, and a p + -type semiconductor region is formed on an upper surface of an epitaxial layer so as to surround the active region.
1. A silicon carbide semiconductor device comprising:
a semiconductor substrate which includes an n-type substrate containing silicon carbide and an n-type semiconductor layer containing silicon carbide formed over the n-type substrate, the semiconductor substrate having an element region and a first region surrounding the element region in plan view;
a p-type first semiconductor region formed on an upper surface of the semiconductor substrate within the element region;
an n-type source region formed on an upper surface of the first semiconductor region;
a p-type first contact region formed on the upper surface of the first semiconductor region;
a p-type second semiconductor region formed on the upper surface of the semiconductor substrate within the first region and surrounding the element region in plan view;
a p-type second contact region formed on an upper surface of the second semiconductor region and surrounding the element region in plan view;
an n-type drain region formed on a lower surface of the semiconductor substrate;
a gate electrode formed on the upper surface of the first semiconductor region adjacent to the source region via an insulating film;
a first electrode formed on the second contact region; and
a conductive connecting portion formed on the second contact region and electrically connecting the first electrode and the second contact region to each other,
wherein the gate electrode, the source region and the drain region configure a field effect transistor, and
the second semiconductor region and the semiconductor substrate configure a diode.
2. The silicon carbide semiconductor device according to claim 1 , further comprising:
a second region formed in a peripheral portion of the semiconductor substrate and surrounding the element region and the first region in plan view;
a p-type third semiconductor region formed on the upper surface of the semiconductor substrate within the second region so as to be deeper than each of the first semiconductor region and the second semiconductor region; and
a p-type third contact region formed on an upper surface of the third semiconductor region.
3. The silicon carbide semiconductor device according to claim 1 ,
wherein the gate electrode and the second contact region are arranged apart from each other in plan view.
4. The silicon carbide semiconductor device according to claim 1 ,
wherein a third impurity concentration of the first contact region is greater than a first impurity concentration of the first semiconductor region, and
a fourth impurity concentration of the second contact region is greater than a second impurity concentration of the second semiconductor region.
5. The silicon carbide semiconductor device according to claim 1 ,
wherein the first contact region is shallower than the first semiconductor region, and
the second contact region is shallower than the second semiconductor region.
6. The silicon carbide semiconductor device according to claim 1 ,
wherein an impurity concentration of the second contact region ranges from 1×10 18 cm −3 to 1×10 21 cm −3 .
7. The silicon carbide semiconductor device according to claim 1 ,
wherein a shortest distance between the first contact region and the second contact region ranges from 2.0 μm to 20 μm.
8. The silicon carbide semiconductor device according to claim 1 ,
wherein a density of basal plane dislocations (BPDs) in the semiconductor layer is greater than or equal to 0.1 BPDs/cm 2 and less than 10 BPDs/cm 2 .
9. The silicon carbide semiconductor device according to claim 1 ,
wherein the element region has a rectangular shape in plan view, and
a width of the second contact region in the vicinity of a corner portion of the element region is greater than a width of the second contact region extending along each of four sides of the element region in plan view.
10. The silicon carbide semiconductor device according to claim 1 ,
wherein a smallest width of the second contact region is greater than a width of the first contact region.
11. A power module comprising the silicon carbide semiconductor device according to claim 1 .
12. A power conversion device comprising:
a power module having the silicon carbide semiconductor device according to claim 1 ; and
a control circuit for controlling the silicon carbide semiconductor device in the power module.