Thermal solution for transceiver module
A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.
1. An apparatus for cooling a transceiver, the apparatus comprising:
a cooling jacket configured to receive the transceiver, wherein the transceiver is secured within the cooling jacket via a connecting structure;
a plurality of cooling devices secured to an exterior surface of a housing, wherein the plurality of cooling devices comprises a highly thermal conductivity material, the plurality of cooling devices including a heat pipe running along the topside of the transceiver; and
a heat dissipation device connected to a distal end of each of the plurality of cooling devices,
wherein the heat dissipation device comprises a radiator connected to a pipe comprising cool water from a reservoir.
2. The apparatus of claim 1 , wherein the cooling jacket comprises a thermal conductivity material, selected from a group of aluminum, copper, diamond, alloys, or composite materials.
3. The apparatus of claim 1 , wherein the heat dissipation device comprises at least one of a heat sink, a passive heat exchanger, and a fin.
4. The apparatus of claim 1 , wherein the heat pipe comprises highly conductive material.
5. The apparatus of claim 1 , wherein the plurality of cooling devices comprises at least one vapor chamber, comprising highly conductive material.
6. A switch device having an inlet side, an outlet side, a first sidewall, and a second sidewall, the first sidewall, and the second sidewall extending from the inlet side to the outlet side, the switch device comprising:
at least one row of transceivers extending at least partially from the first sidewall to the second sidewall, where the at least one row of transceivers is configured to receive a plurality of cooling assemblies, wherein each of the plurality of cooling assemblies comprises:
a different cooling jacket configured to secure a transceiver of the at least one row of transceivers via a connecting structure;
a plurality of cooling devices secured to an exterior surface of the cooling jacket, wherein the plurality of cooling devices comprises a highly thermal conductivity material, the plurality of cooling devices including a heat pipe running along the topside of the transceiver; and
a heat dissipation device connected to a distal end of each of the plurality of cooling devices.
7. The switch device of claim 6 , wherein the heat dissipation device comprises a radiator connected to a pipe comprising cool water from a reservoir.
8. The switch device of claim 6 , wherein the cooling jacket comprises a thermal conductivity material, selected from the group of aluminum, copper, diamond, alloys, or composite materials.
9. The switch device of claim 6 , wherein the heat dissipation device comprises at least one of a heat sink, a passive heat exchanger, and a fin.
10. The switch device of claim 6 , wherein the plurality of cooling devices comprises at least one heat pipe comprising highly conductive material.
11. The switch device of claim 6 , wherein the plurality of cooling devices comprises at least one vapor chamber comprising highly conductive material.