Coupling structures for electronic device housings
A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
1. A housing for an electronic device, comprising:
a first conductive component defining:
a first portion of a curved exterior surface of the housing;
a first interface surface; and
a first interlock feature;
a second conductive component defining:
a second portion of the curved exterior surface of the housing;
a second interface surface facing the first interface surface; and
a second interlock feature; and
a joint structure between the first and second interface surfaces, comprising:
a molded element defining:
first and second corresponding interlock features engaged with the first and second interlock features, respectively, and fixing the first conductive component to the second conductive component; and
a third portion of the curved exterior surface of the housing, the third portion positioned between and adjacent to the first and second portions of the curved exterior surface; and
a sealing member abutting the molded element and forming a watertight seal between the first and second conductive components.
2. The housing of claim 1 , wherein:
the sealing member and the molded element are electrical insulators; and
the sealing member and the molded element electrically isolate the first conductive component from the second conductive component.
3. The housing of claim 1 , wherein:
the first and second interlock features are dovetail channels.
4. The housing of claim 1 , wherein the sealing member comprises an elastomeric material.
5. The housing of claim 1 , wherein the sealing member is compressed between the first and second interface surfaces.
6. The housing of claim 1 , wherein:
the molded element is a first molded element; and
the sealing member is a second molded element.
7. The housing of claim 1 , wherein the curved exterior surface of the housing is located at a perimeter of the housing.
8. An electronic device, comprising:
a display;
a cover over the display; and
a housing configured to receive the display and the cover, comprising:
a first component receiving the cover thereon and defining:
a first exterior surface region of the housing; and
a first interlock feature;
a second component forming at least part of an interior cavity of the housing and defining:
a second exterior surface region of the housing; and
a second interlock feature; and
a joint structure positioned in a gap between the first and second components, comprising:
a molded element mechanically engaged with the first and second interlock features to inhibit expansion of the gap, the molded element defining a third exterior surface region between the first and second exterior surface regions; and
an elastomeric sealing member abutting the molded element and between the first and second components; wherein
the third exterior surface region, a portion of the first exterior surface region adjacent the molded element, and a portion of the second exterior surface region adjacent the molded element together define a continuous surface.
9. The electronic device of claim 8 , wherein:
the first and second components are formed of a conductive metal;
the elastomeric sealing member and the molded element are electrical insulators; and
the elastomeric sealing member and the molded element electrically isolate the first component from the second component.
10. The electronic device of claim 8 , wherein:
the first interlock feature comprises a channel extending around a perimeter of the electronic device.
11. The electronic device of claim 10 , wherein the channel is a dovetail channel.
12. The electronic device of claim 8 , wherein the elastomeric sealing member is subject to a residual compressive force by the first and second components.
13. The electronic device of claim 8 , wherein:
the first component defines an opening configured to receive the display and the cover therein; and
the elastomeric sealing member extends around a perimeter of the opening.
14. The electronic device of claim 8 , wherein the molded element is formed of a polymer material.
15. The electronic device of claim 8 , wherein the molded element conforms to a shape of the elastomeric sealing member.