IP Library › Granted Patent US 10,374,116
Granted Patent B2
US 10,374,116 · App. 15/569,595 · Granted Aug 6, 2019

Light receiving and emitting element module and sensor device

Inventor: Naoki Fujimoto (Higashiomi, JP)
Assignee: KYOCERA Corporation
H01L31/12G01N21/17G01S7/4813G01S17/026H01L25/167H01L31/0203H01L31/02164H01L31/02325H01L31/173H01L33/58G01N2201/061H01L2224/48091H03K2217/94108
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Quick Facts
Patent No.
US 10,374,116
App. No.
15/569,595
Granted
Aug 6, 2019
Kind
B2
Abstract

A light receiving and emitting element module includes a wiring substrate; a light emitting element and a light receiving element which are disposed on the wiring substrate; and a lens member having a lens portion, a support portion configured to support the lens portion disposed above the light emitting element and the light receiving element and a column disposed on a lower surface of the support portion, wherein a tip end of the column is in contact with an upper surface of the wiring substrate.

Claims (29)

1. A light receiving and emitting element module, comprising:

a wiring substrate;

a light emitting element and a light receiving element which are disposed on the wiring substrate; and

a lens member comprising a lens portion, a support portion configured to support the lens portion disposed above the light emitting element and the light receiving element and a plurality of columns disposed on a lower surface of the support portion,

the plurality of columns including a plurality of first columns and a plurality of second columns,

the plurality of first columns being positioned with the light emitting element and the light receiving element interposed therebetween, and tip ends of the first columns being in contact with and above a top flat surface of the wiring substrate,

the plurality of second columns being positioned with the light emitting element and the light receiving element interposed therebetween, and tip ends of the second columns being disposed in a plurality of hole portions whose openings are disposed in the top flat surface of the wiring substrate.

2. The light receiving and emitting element module according to claim 1 , wherein the lens portion, the support portion, the plurality of first columns and the plurality of second columns are integrated in the lens member.

3. The light receiving and emitting element module according to claim 1 , wherein a tip end surface of each of the plurality of first columns of the lens member is a convexly curved surface.

4. The light receiving and emitting element module according to claim 1 , further comprising:

a light shield, which is disposed between the lens member and the wiring substrate, is surrounding the light emitting element and the light receiving element, and the light shield comprises a wall portion having frame-like and including an upper surface and a lower surface,

wherein the wall portion of the light shield comprises through holes including openings disposed in the upper surface and the lower surface of the wall portion, and

the plurality of first columns and the plurality of second columns are disposed in the through holes.

5. The light receiving and emitting element module according to claim 4 ,

wherein the upper surface of the light shield is apart from the lower surface of the support portion of the lens member.

6. The light receiving and emitting element module according to claim 4 ,

wherein when the light receiving and emitting element module is viewed from above, an outer edge of the light shield is disposed outside an outer edge of the lens member,

an upper surface of the outer edge of the light shield further comprises a convex portion protruding upward, and

the lens member is fixed to the light shield via an adhesive on a side surface of the support portion of the lens member and an inner surface of the convex portion.

7. The light receiving and emitting element module according to claim 6 , wherein the convex portion is surrounding the support portion of the lens member.

8. The light receiving and emitting element module according to claim 1 ,

wherein the wiring substrate is rectangular in a plan view thereof, and

the plurality of hole portions are disposed on a diagonal line of the wiring substrate, and the light emitting element and the light receiving element are disposed in between the plurality of hole portions.

9. The light receiving and emitting element module according to claim 8 ,

wherein the second columns are fixed via an adhesive on inner surfaces of the hole portions.

10. A sensor device, comprising:

the light receiving and emitting element module according to claim 1 ; and

a control circuit electrically connected to the light receiving and emitting element module and configured to control the light receiving and emitting element module,

the sensor device irradiating light from the light emitting element to an object and detecting a property of the object according to an output value from the light receiving element which is outputted according to reflected light from the object.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2017
From: FUJIMOTO, NAOKI
To: KYOCERA CORPORATION
Reel/Frame 043960/0106 →
Priority Claims (1)
JP 2015-090056 · Apr 27, 2015 · national
Continuity (1)
Related Publication 20180301585A1 · Oct 18, 2018