IP Library › Granted Patent US 10,374,132
Granted Patent B2
US 10,374,132 · App. 15/386,071 · Granted Aug 6, 2019

Light emitting device using wavelength conversion member, method of manufacturing wavelength conversion member, and method of manufacturing light emitting device

Inventors: Masami Kumano (Tokushima, JP); Yuji Sato (Anan, JP)
Assignee: NICHIA CORPORATION
H01L33/502H01L33/60H01L2933/0041H01L2933/0058
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Quick Facts
Patent No.
US 10,374,132
App. No.
15/386,071
Granted
Aug 6, 2019
Kind
B2
Abstract

A method of manufacturing a wavelength conversion member with improved capability of releasing heat from a fluorescent material is provided. The method of manufacturing the wavelength conversion member includes: disposing a fluorescent material paste containing a fluorescent material and a binder on a surface of a light-transmissive body; orienting face-down the surface where the fluorescent material paste is disposed, to settle the fluorescent material in the fluorescent material paste on a side opposite to another side of the fluorescent material paste, the another side being in contact with the light-transmissive body; and curing the binder in a state where the fluorescent material has been settled, to form a fluorescent material layer.

Claims (14)

1. A method of manufacturing a light emitting device, comprising:

manufacturing a wavelength conversion member according to a method of manufacturing a wavelength conversion member comprising:

disposing a fluorescent material paste containing a fluorescent material and a binder on a surface of a light-transmissive body;

orienting face-down the surface where the fluorescent material paste is disposed, to settle the fluorescent material in the fluorescent material paste on a side opposite to another side of the fluorescent material paste, the another side being in contact with the light-transmissive body; and

curing the binder in a state where the fluorescent material has been settled, to form a fluorescent material layer;

providing a light emitting element; and

joining the light emitting element and the wavelength conversion member to each other so that the fluorescent material layer is oriented toward the light emitting element.

2. The method of manufacturing the light emitting device according to claim 1 , further comprising providing a light reflecting member to cover at least part of a lateral surface of the light emitting element and at least part of a lateral surface of the wavelength conversion member.

3. The method of manufacturing the light emitting device according to claim 1 , wherein the light emitting element and the wavelength conversion member are joined to each other via an adhesive agent.

4. The method of manufacturing the light emitting device according to claim 1 , further comprising cleaving the fluorescent material layer and the light-transmissive body to have a predetermined shape out of an inner region of the fluorescent material layer and to exclude a circumference portion of the fluorescent material layer.

5. The method of manufacturing the light emitting device according to claim 1 , wherein the fluorescent material paste is disposed on the surface by printing.

6. The method of manufacturing the light emitting device according to claim 1 , wherein at least one of the light-transmissive body and the binder contains a diffusing agent.

7. The method of manufacturing the light emitting device according to claim 1 , wherein the light-transmissive body is a glass material.

8. The method of manufacturing the light emitting device according to claim 1 , further comprising roughening at least one of the surface and another surface opposite to the surface of the light-transmissive body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2016
From: KUMANO, MASAMI; SATO, YUJI
To: NICHIA CORPORATION
Reel/Frame 041090/0595 →
Priority Claims (1)
JP 2015-251130 · Dec 24, 2015 · national
Continuity (1)
Related Publication 20170186920A1 · Jun 29, 2017
Cited By (3)
US 12,342,665 US 12,557,447 US 12,672,402