Circuit member of disk drive suspension
A circuit member includes a metal base, an insulating layer, a conductor, and a cover layer. A termial portion of the circuit member includes a thick portion formed at a part of the insulating layer, a conductor convex portion which is a part of the conductor, and overlaps the thick portion, and a conductor extending portion. By the conductor convex portion and the conductor extending portion, a stepped side pad is formed. The stepped side gad includes a first surface along the conductor extending portion, and a second surface which rises in a thickness direction of the conductor extending portion. The stepped side pad and an element are connected by a conductive member.
1. A circuit member of a disk drive suspension comprising:
a metal base;
an insulating layer formed on the metal base, the insulating layer being formed of an electrically insulating material;
a conductor formed on the insulating layer;
a cover layer covering the conductor, the cover layer being formed of an electrically insulating material; and
a terminal portion, wherein
the terminal portion comprises:
a thick portion formed at a part of the insulating layer;
a conductor convex portion which is a part of the conductor, and overlaps the thick portion;
a conductor extending portion extending from the conductor convex portion toward an edge of the insulating layer; and
a stepped side pad including a first surface extending in a direction along the conductor extending portion, and a second surface rising from the first surface in a thickness direction of the conductor extending portion along a side surface of the conductor convex portion.
2. The circuit member of claim 1 , further comprising an opening which is formed in the cover layer, and is open at a position corresponding to the conductor convex portion, and an upper surface pad which is formed on the conductor convex portion within the opening.
3. The circuit member of claim 1 , wherein the first surface of the stepped side pad includes a positioning portion which supports an electronic component.
4. The circuit member of claim 2 , wherein the first surface of the stepped side pad includes positioning portion which supports an electronic component.
5. The circuit member of claim 1 , wherein an edge of the insulating layer is located on an inner side relative to an edge of the conductor extending portion, an edge of the metal base is located on the inner side relative to the edge of the insulating layer, and the circuit member includes an insulating layer extending portion on an end portion of the insulating layer.
6. The circuit member of claim 2 , wherein an edge of the insulating layer is located on an inner side relative to an edge of the conductor extending portion, an edge of the metal base is located on the inner side relative to the edge of the insulating layer, and the circuit member includes an insulating layer extending portion on an end portion or the insulating layer.
7. The circuit member of claim 1 , wherein an edge of the insulating layer is extended more to an outer side than an edge of the conductor extending portion, an edge of the metal base is extended more to an outer side than the edge of the insulating layer, and the circuit member includes a metal base extension portion which supports the edge of the insulating layer and the edge of the conductor extending portion at an end portion of the metal base.
8. The circuit member of claim 2 , wherein an edge of the insulating layer is extended more to an outer side than an edge of the conductor extending portion, an edge of the metal base is extended more to an outer side than the edge of the insulating layer, and the circuit member includes a metal base extension portion edge of the conductor extending portion at an end portion of the metal base.
9. The circuit member of claim 1 , wherein the circuit member comprises: a cover member, which is formed of an electrically insulating material, and overlaps the conductor extending portion in a thickness direction of the conductor extending portion; and the first surface which supports an electronic component on the cover member.
10. The circuit member of claim 1 , wherein the thick portion comprises step portions whose heights are reduced stepwise toward the edge of the insulating layer, and the circuit member comprises the stepped side pad having a stepwise configuration along the step portions.
11. The circuit member of claim 1 , wherein the circuit member comprises a third surface along the conductor convex portion between the second surface of the stepped side pad and an edge of the cover layer.