Anti-vibration mounting system

1. A mounting system for mounting an electronic component ( 2 ) in a housing ( 8 ), the mounting system comprising:

a damping element ( 14 , 20 ) for damping the transmission of vibration from the housing ( 8 ) to the component ( 2 ) in use, and

a support ( 24 , 52 ) for supporting the component ( 2 ) in the housing ( 8 ) independently of the damping element ( 14 , 20 ) such that the weight of the component is substantially or completely removed from the damping element ( 14 , 20 ), the support ( 24 , 52 ) being configured to be releasable from the component ( 2 ) such that the component ( 2 ) is supported only by the damping element ( 14 , 20 ) after the support has been released from the component, wherein the support ( 24 , 52 ) is collapsible or permanently deformable upon a predetermined movement of the component ( 2 ) relative to the housing ( 8 ) so as to release the component ( 2 ).

2. A mounting system as claimed in claim 1 , wherein the support ( 24 , 52 ) is configured to be collapsible or permanently deformable in an axial and/or radial direction.

3. A mounting system as claimed in claim 1 , wherein the support comprises a first support element ( 24 ) which is deformable or collapsible in response to movement of the component ( 2 ) in a first direction (D 1 ) relative to the housing ( 8 ) and a second support element ( 52 ) which is deformable or collapsible in response to movement of the component ( 2 ) in a second, opposite direction (D 2 ) relative to the housing ( 8 ).

4. A mounting system as claimed in claim 3 , wherein first and second support elements ( 24 , 52 ) are spaced apart axially along the component ( 2 ), the first support element ( 24 ) being collapsible in response to movement of the component ( 2 ) in the first direction (D 1 ) and the second support element ( 52 ) being collapsible in response to movement of the component ( 2 ) in the second direction (D 2 ), the respective support elements ( 24 , 52 ) optionally being arranged at respective axial ends of the component ( 2 ).

5. A mounting system as claimed in claim 1 , wherein the damping element ( 14 , 20 ) is disposed between opposed axially facing surfaces ( 16 , 18 , 20 , 22 ) of the housing ( 8 ) and the component ( 2 ).

6. A mounting system as claimed in claim 5 , comprising first and second damping elements ( 14 , 20 ) provided at axially spaced locations along the component ( 2 ).

7. A mounting system as claimed in claim 1 , wherein the damping element ( 14 , 20 ) comprises a plurality of damping bodies ( 48 , 80 ), optionally mounted to a common support ( 46 , 78 ).

8. A mounting system as claimed in claim 1 , wherein the damping element is a visco-elastic damping element.

9. A mounting system for mounting an electronic component ( 2 ) in a housing ( 8 ), the mounting system comprising:

a damping element ( 14 , 20 ) for damping the transmission of vibration from the housing ( 8 ) to the component ( 2 ) in use, and

a support ( 24 , 52 ) for supporting the component ( 2 ) in the housing ( 8 ) independently of the damping element ( 14 , 20 ) such that the weight of the component is substantially or completely removed from the damping element ( 14 , 20 ), the support ( 24 , 52 ) being configured to be releasable from the component ( 2 ) such that the component ( 2 ) is supported only by the damping element ( 14 , 20 ) after the support has been released from the component, wherein the support ( 24 , 52 ) comprises a plurality of fingers ( 28 , 60 ) which engage and support the component ( 2 ), but which are plastically deformed upon the movement of the component ( 2 ) by the predetermined amount.

10. A mounting system as claimed in claim 9 , wherein the fingers ( 28 , 60 ) are configured to be deformed either radially inwardly or outwardly.

11. A mounting system as claimed in claim 10 , wherein the fingers ( 28 ) of one support element ( 24 ) deforming radially outwardly and the fingers ( 60 ) of a second support element ( 52 ) deforming radially inwardly.

12. A mounting system as claimed in claim 9 , wherein the fingers ( 28 , 60 ) are mounted to a common base element ( 26 , 58 ) which is mounted either to the housing ( 8 ) or to the component ( 2 ).

13. A mounting system as claimed in claim 12 , wherein the fingers ( 28 , 60 ) are arranged in a circumferential array around the base element ( 26 , 58 ), the array optionally being axi-symmetrical.

14. A mounting system as claimed in claim 9 , wherein the fingers ( 28 , 60 ) have a bent shape with a first, generally axially extending portion ( 36 , 68 ) for engaging a radially facing surface ( 38 , 72 ) of the component ( 2 ) or the housing ( 8 ), and an inclined portion ( 40 , 70 ) engaging an axially facing surface or edge ( 16 , 74 ), of the component ( 2 ) or housing ( 8 ).

15. A projectile ( 6 ) comprising:

a mounting system for mounting an electronic component ( 2 ) in a housing ( 8 ), the mounting system comprising:

a damping element ( 14 , 20 ) for damping the transmission of vibration from the housing ( 8 ) to the component ( 2 ) in use, and

a support ( 24 , 52 ) for supporting the component ( 2 ) in the housing ( 8 ) independently of the damping element ( 14 , 20 ) such that the weight of the component is substantially or completely removed from the damping element ( 14 , 20 ), the support ( 24 , 52 ) being configured to be releasable from the component ( 2 ) such that the component ( 2 ) is supported only by the damping element ( 14 , 20 ) after the support has been released from the component;

wherein the support ( 24 , 52 ) is collapsible or permanently deformable upon a predetermined movement of the component ( 2 ) relative to the housing ( 8 ) so as to release the component ( 2 ), and

wherein the launching of the projectile ( 6 ) cause the release of acting to release the support ( 24 , 52 ) from the component ( 2 ).

16. A projectile as claimed claim 15 , wherein the mounting system is fitted in a tip portion of the projectile ( 6 ).