Semiconductor device and method for manufacturing the same
A semiconductor device includes a predetermined number of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin that covers the semiconductor element and a part of each lead. Each lead includes some portions exposed from the sealing resin. A surface plating layer is formed on at least one of the exposed portions of the respective leads.
1. A semiconductor device comprising:
at least one lead including an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction;
a semiconductor element supported by the lead; and
a sealing resin covering the semiconductor element and a part of the lead, the sealing resin comprising a sealing-resin side surface and a sealing-resin reverse surface,
wherein the lead includes portions exposed from the sealing resin, the exposed portions include a first exposed portion and a second exposed portion that are exposed at the sealing-resin side surface and the sealing-resin reverse surface, respectively, the first exposed portion being flush with the sealing-resin side surface, and each of the first exposed portion and the second exposed portion is formed with a surface plating layer,
the surface plating layer on the first exposed portion is formed integral with the surface plating layer on the second exposed portion,
the sealing resin comprises a sealing-resin obverse surface that is connected to the sealing-resin side surface,
the sealing-resin side surface comprises a first portion and a second portion, the first portion being outwardly offset from the second portion as viewed in the thickness direction, and
the first exposed portion of the lead is disposed at the second portion of the sealing-resin side surface.
2. The semiconductor device according to claim 1 , wherein each of the exposed portions is formed with a surface plating layer.
3. The semiconductor device according to claim 1 , wherein the surface plating layer has a higher solder wettability than a base material of the lead.
4. The semiconductor device according to claim 3 , wherein the base material comprises Cu.
5. The semiconductor device according to claim 4 , wherein the surface plating layer is made of Au.
6. The semiconductor device according to claim 1 , wherein the surface plating layer is formed by substitutional electroless plating.
7. The semiconductor device according to claim 1 , wherein at least a part of the surface plating layer is formed directly on a base material of the lead.
8. The semiconductor device according to claim 7 , wherein an entirety of the surface plating layer is formed directly on the base material of the lead.
9. The semiconductor device according to claim 1 , further comprising an intermediate plating layer disposed between the surface plating layer and a bulk material of the lead.
10. The semiconductor device according to claim 9 , wherein the intermediate plating layer is formed near the obverse surface and the reverse surface of the lead.
11. The semiconductor device according to claim 1 , wherein
the lead comprises a terminal end face that is flush with the sealing-resin side surface.
12. The semiconductor device according to claim 11 , wherein the reverse surface of the lead is flush with the sealing-resin reverse surface.
13. The semiconductor device according to claim 1 , wherein the lead is formed with a reverse-side recess that is disposed at the reverse surface of the lead and covered with the sealing resin.
14. The semiconductor device according to claim 13 , wherein the semiconductor element is disposed at a position avoiding the reverse-side recess as viewed in the thickness direction.
15. The semiconductor device according to claim 1 , further comprising an additional lead and a wire, wherein the additional lead includes an obverse surface and a reverse surface that are spaced apart from each other in the thickness direction, the additional lead being formed with a reverse-side recess that is disposed at the reverse surface of the additional lead and covered with the sealing resin, the wire having a first end and a second end that are bonded to the semiconductor element and the additional lead, respectively, wherein the second end of the wire is disposed at a position avoiding the reverse-side recess of the additional lead as viewed in the thickness direction.
16. The semiconductor device according to claim 1 , wherein the sealing resin comprises a sealing-resin obverse surface that is connected to the sealing-resin side surface, and
the lead comprises a terminal end face exposed from the sealing-resin side surface and spaced apart from the reverse surface of the lead, no surface plating layer being formed on the terminal end face.