Semiconductor device and method of manufacturing the same
A semiconductor device includes, a plurality of semiconductor dies formed using semiconductor substrates, plane orientations of which are the same, and the plurality of the semiconductor dies are stacked such that a crystal orientation of at least one layer is different from other layers.
1. A semiconductor device comprising:
a plurality of semiconductor dies formed using semiconductor substrates, plane orientations of which are the same, and stacked such that a crystal orientation of at least one layer is different from other layers.
2. The semiconductor device according to claim 1 , wherein the semiconductor substrates are a (100) plane Si substrate, and the plurality of semiconductor dies are stacked in a state in which an in-plane <100> orientation of at least one layer is rotated by 15° to 45° with respect to other layers.
3. The semiconductor device according to claim 1 , wherein the semiconductor substrates are (110) plane Si substrates, and the plurality of semiconductor dies are stacked in a state in which an in-plane <100> orientation of at least one layer is rotated by 15° to 90° with respect to other layers.
4. The semiconductor device according to claim 2 , wherein the at least one layer is stacked on a convex side of warping in a state in which the in-plane <100> orientation thereof is rotated by 45° with respect to the other layers.
5. The semiconductor device according to claim 2 , wherein the at least one layer is stacked on a convex side of warping in a state in which the in-plane <100> orientation thereof is rotated by 90° with respect to the other layers.
6. The semiconductor device according to claim 2 , wherein each of the plurality of semiconductor dies includes a transistor provided such that a channel of the transistor is directed along the <100> orientation.
7. A method of manufacturing a semiconductor device, comprising:
stacking a plurality of semiconductor dies formed using semiconductor substrates, plane orientations of which are the same, such that at least one layer has a different crystal orientation.
8. The method according to claim 7 , wherein, in the stacking, the plurality of semiconductor dies using a (100) plane Si substrate as the semiconductor substrate is stacked in a state in which an in-plane orientation <100> of at least one layer is rotated by 15° to 45° with respect to other layers.
9. The method according to claim 7 , wherein, in the stacking, the plurality of semiconductor dies using a (110) plane Si substrate as the semiconductor substrate is stacked in a state in which an in-plane <100> orientation of at least one layer is rotated by 15° to 90° with respect to other layers.
10. The method according to claim 8 , wherein, in the stacking, the at least one layer is stacked on a convex side of warping in a state in which the in-plane <100> is rotated by 45° with respect to other layers.
11. The method according to claim 9 , wherein, in the stacking, the at least one layer is stacked on a convex side of warping in a state in which the in-plane <100> orientation is rotated by 90° with respect to other layers.
12. The method according to claim 8 , comprising:
manufacturing the plurality of semiconductor dies including a transistor provided such that a channel is directed along the <100> orientation, before the stacking.