Semi-floating-gate power device and manufacturing method therefor
The disclosure belongs to the technical field of semiconductor power devices, specifically relates to a semi-floating-gate power device, and comprises the gallium nitride high-electron-mobility transistor, the diode and the capacitor; the anode of the diode is connected with the gate of the gallium nitride high-electron-mobility transistor and the cathode of the diode is connected with the source or the channel area of the gallium nitride high-electron-mobility transistor; one end of the capacitor is connected with the gate of the gallium nitride high-electron-mobility transistor and the other end of the capacitor is connected with the external voltage signal. The semi-floating-gate power device has a simple structure, is easy to manufacture, adapts to high-voltage and high-speed operation and has very high reliability, can increase the threshold voltage of the gallium nitride high-electron-mobility transistor in the working state, so that the transistor can serve as the power switch tube better.
1. A semi-floating-gate power device comprising:
a semiconductor substrate;
a gallium nitride barrier layer arranged on the semiconductor substrate;
a gallium nitride channel layer arranged on the gallium nitride barrier layer;
a gallium nitride aluminum isolation layer arranged on the gallium nitride channel layer;
a gate dielectric layer arranged on the gallium nitride aluminum isolation layer;
a floating gate arranged on the gate dielectric layer, wherein at least a portion of the floating gate directly contacts the gallium nitride aluminum isolation layer;
an interlayer dielectric layer arranged on the floating gate;
a control gate arranged on the interlayer dielectric layer, the control gate acts on the floating gate through capacitive coupling effect, and both sides of the control gate are respectively provided with a source and a drain which are arranged on the gallium nitride channel layer.
2. The semi-floating-gate power device of claim 1 , further comprising a gallium nitride high-electron-mobility transistor, and:
a diode whose anode is connected with the gate of the gallium nitride high-electron-mobility transistor and whose cathode is connected with the source or the channel area of the gallium nitride high-electron-mobility transistor which is connected to the gallium nitride aluminum isolation layer;
a capacitor whose one end is connected with the gate of the gallium nitride high-electron-mobility transistor and whose other end is connected with an external voltage signal and a control gate.
3. The semi-floating-gate power device as claimed in claim 2 , wherein the diode is a Schottky diode.
4. The semi-floating-gate power device as claimed in claim 1 , wherein the floating gate extends to one side of the source, is beyond the gate dielectric layer, and is connected with the gallium nitride aluminum isolation layer.
5. The semi-floating-gate power device as claimed in claim 1 , wherein the floating gate extends to one side of the source, is beyond the gate dielectric layer and the gallium nitride aluminum isolation layer, and is connected with the gallium nitride aluminum isolation layer.
6. The semi-floating-gate power device as claimed in claim 1 , wherein the floating gate is connected with the gallium nitride channel layer through first openings of the gate dielectric layer and the gallium nitride aluminum isolation layer.
7. The semi-floating-gate power device as claimed in claim 6 , wherein a first groove is formed in the gallium nitride channel layer;
the first groove is arranged under the first openings of the gate dielectric layer and, the bottom of the first groove is within any depth of the gallium nitride channel layer or extends to the bottom of the gallium nitride channel layer, and the floating gate fully fills the first groove.
8. The semi-floating-gate power device as claimed in claim 7 , wherein a second opening is formed in the gallium nitride aluminum isolation layer; a second groove is formed in the gallium nitride channel layer below the second opening; the second groove is close to one side of the drain and the depth thereof is the same with that of the first groove; the gate dielectric layer covers the inner surface of the second groove, and the floating gate fully fills the first groove.
9. The semi-floating-gate power device as claimed in claim 1 , wherein the floating gate is made of chromium, an alloy including nickel or tungsten, or doped polysilicon; the interlayer dielectric layer is made of one or more types of silicon dioxide, silicon nitride or silicon oxynitride; the control gate is a polysilicon gate or a metal control gate.
10. The semi-floating-gate power device as claimed in claim 1 , wherein the floating gate extends to one side of the source, is beyond the gate dielectric layer, and is connected with the gallium nitride aluminum isolation layer.
11. The semi-floating-gate power device as claimed in claim 1 , wherein the floating gate extends to one side of the source, is beyond the gate dielectric layer and the gallium nitride aluminum isolation layer, and is connected with the gallium nitride aluminum isolation layer.
12. The semi-floating-gate power device as claimed in claim 1 , wherein the floating gate is connected with the gallium nitride channel layer through the first openings of the gate dielectric layer and the gallium nitride aluminum isolation layer.