Power module

1. A power module comprising:

a package;

a plurality of power elements disposed within said package, each of said power elements comprising a plurality of semiconductor switching elements constituting an upper arm and a lower arm between a first connection point and a second connection point;

a positive terminal configured to guide said first connection points of said power elements outside said package through a first lead;

a negative terminal configured to guide said second connection points of said power elements outside said package through a second lead;

a plurality of third leads each having a first end electrically connected to a respective one of said first connection points, and a second end exposed from said package, said third leads each being shorter than said first lead; and

a plurality of fourth leads having a first end electrically connected to a respective one of said second connection points, and a second end exposed from said package, said fourth leads each being shorter than said second lead, wherein

each of said plurality of third leads and a respective one of said plurality of fourth leads connects to a respective snubber capacitor that is attachable to and detachable from each of said second ends of said third leads and said fourth leads.

2. A power module comprising:

a package;

a power element disposed within said package, said power element comprising a plurality of semiconductor switching elements constituting an upper arm and a lower arm between a first connection point and a second connection point;

a positive terminal configured to guide said first connection point of said power element outside said package through a first lead;

a negative terminal configured to guide said second connection point of said power element outside said package through a second lead;

a third lead having a first end electrically connected to said first connection point, and a second end exposed from said package, said third lead being shorter than said first lead; and

a fourth lead having a first end electrically connected to said second connection point, and a second end exposed from said package, said fourth lead being shorter than said second lead, wherein

a snubber capacitor is attachable to and detachable from said second ends of said third lead and said fourth lead, and

said power element comprises a wide bandgap semiconductor.

3. A power module comprising:

a package;

a power element disposed within said package, said power element comprising a plurality of semiconductor switching elements constituting an upper arm and a lower arm between a first connection point and a second connection point;

a positive terminal configured to guide said first connection point of said power element outside said package through a first lead;

a negative terminal configured to guide said second connection point of said power element outside said package through a second lead;

a third lead having a first end electrically connected to said first connection point, and a second end exposed from said package, said third lead being shorter than said first lead; and

a fourth lead having a first end electrically connected to said second connection point, and a second end exposed from said package, said fourth lead being shorter than said second lead, wherein

a snubber capacitor is attachable to and detachable from said second ends of said third lead and said fourth lead,

said power element comprises, in a block unit, a first group of said plurality of semiconductor switching elements connected to each other in parallel, and a second group of said plurality of semiconductor switching elements connected to each other in parallel, and

said first group of said plurality of semiconductor switching elements and said second group of said plurality of semiconductor switching elements constitute an upper arm and a lower arm between said first connection point and said second connection point.

4. The power module according to claim 3 , wherein said block unit is a unit of an insulating substrate on which said plurality of semiconductor switching elements are mounted.

5. The power module according to claim 2 , wherein said upper arm and said lower arm, which comprise said plurality of semiconductor switching elements, are provided for individual phases.

6. The power module according to claim 2 , further comprising:

a fifth lead having a first end connected to said third lead, and a second end exposed from said package; and

a sixth lead having a first end connected to said fourth lead, and a second end exposed from said package.

7. The power module according to claim 2 , wherein said first lead and said second lead are adjacent to each other.

8. The power module according to claim 7 , further comprising a dielectric layer disposed between said first lead and said second lead.

9. The power module according to claim 2 , wherein

said third lead and said fourth lead include sockets in said second ends of said third lead and said fourth lead, and

terminals of said snubber capacitor are attachable to and detachable from said sockets.

10. The power module according to claim 2 , wherein said package has a surface provided with a recess in which said snubber capacitor is accommodated when said snubber capacitor is attached to said second ends of said third lead and said fourth lead.

11. The power module according to claim 2 , wherein said package has a surface provided with a protrusion protruding in parallel with said snubber capacitor when said snubber capacitor is attached to said second ends of said third lead and said fourth lead.