IP Library › Granted Patent US 10,396,313
Granted Patent B2
US 10,396,313 · App. 15/794,927 · Granted Aug 27, 2019

Display device and method of manufacturing the same

Inventor: Won Je Cho (Yongin-si, KR)
Assignee: Samsung Display Co., Ltd.
H01L51/56H01L27/3234H01L51/0097H01L51/5253H01L51/5281H01L51/5293H01L27/3244H01L2251/5338
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Quick Facts
Patent No.
US 10,396,313
App. No.
15/794,927
Granted
Aug 27, 2019
Kind
B2
Abstract

A manufacturing method of a display device includes: forming pixels on a mother substrate including a display area and a non-display area; attaching a polarization film stretched in a first direction and a second direction opposite to the first direction on the mother substrate having the pixels thereon; and cutting at least a portion of the polarization film along a third direction, wherein the third direction forms an acute angle with the first direction toward an outside of the polarization film.

Claims (36)

1. A manufacturing method of a display device, comprising:

forming pixels on a mother substrate comprising a display area and a non-display area;

attaching a polarization film stretched in a first direction and a second direction opposite to the first direction on the mother substrate having the pixels thereon; and

cutting at least a portion of the polarization film along a third direction,

wherein the third direction forms an acute angle with the first direction toward an outside of the polarization film.

2. The manufacturing method of claim 1 , wherein the polarization film surrounds the display area and is cut along a cutting line at the non-display area.

3. The manufacturing method of claim 2 , wherein the display area has a rectangular shape, and the polarization film is cut along at least one side of the display area.

4. The manufacturing method of claim 3 , wherein the polarization film is cut by an ultrasonic wave cutter.

5. The manufacturing method of claim 1 , further comprising cutting at least a portion of the mother substrate to form a substrate,

wherein the mother substrate and the polarization film are concurrently cut.

6. The manufacturing method of claim 5 , further comprising:

attaching an adhesive layer to a rear surface of the substrate; and

attaching a rear surface protective film to the adhesive layer.

7. The manufacturing method of claim 6 , wherein the substrate has a bendable portion in the non-display area, and

wherein the manufacturing method further comprises cutting a portion of the rear surface protective film corresponding to the bendable portion.

8. The manufacturing method of claim 7 , wherein the cutting of the portion of the rear surface protective film comprises:

forming a cutting groove at a portion corresponding to the bendable portion to penetrate the rear surface protective film, the cutting groove having a thickness that is less than a thickness of the adhesive layer from a surface of the adhesive layer; and

removing a portion of the adhesive layer and the portion of the rear surface protective film along the cutting groove.

9. The manufacturing method of claim 8 , wherein the rear surface protective film is cut by an ultrasonic wave cutter.

10. The manufacturing method of claim 9 , further comprising:

measuring a thickness of the rear surface protective film by a laser sensor when the rear surface protective film is cut; and

adjusting a depth of the ultrasonic wave cutter depending on the measured thickness.

11. The manufacturing method of claim 1 , further comprising:

attaching a protective film on the pixels with an adhesive layer therebetween after the forming of the pixels and before the stretching of the polarization film;

forming a cutting groove that penetrates the protective film and has a depth that is less than a thickness of the adhesive layer from a surface of the adhesive layer;

removing a portion of the adhesive layer and a portion of the protective film along the cutting groove;

inspecting the mother substrate; and

removing the protective film.

12. The manufacturing method of claim 11 , wherein the protective film is cut by an ultrasonic wave cutter.

13. The manufacturing method of claim 12 , further comprising:

measuring a thickness of the protective film by using a laser sensor when the protective film is cut; and

adjusting a depth of the ultrasonic wave cutter depending on the measured thickness.

14. The manufacturing method of claim 1 , further comprising:

forming a camera opening that penetrates an adhesive layer between the pixels and the polarization film and penetrates the polarization film, the forming of the camera opening comprising:

forming a cutting groove that penetrates the polarization film and has a depth that is less than a thickness of the adhesive layer from a surface of the adhesive layer; and

removing a portion of the adhesive layer and a portion of the polarization film along the cutting groove.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2017
From: CHO, WON JE
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 043962/0515 →
Priority Claims (1)
KR 10-2016-0162964 · Dec 1, 2016 · national
Continuity (1)
Related Publication 20180159086A1 · Jun 7, 2018
Cited By (1)
US 12,666,856