IP Library › Granted Patent US 10,400,103
Granted Patent B2
US 10,400,103 · App. 15/368,677 · Granted Sep 3, 2019

Thermoplastic resin composition, molded product, and method of producing molded product

Inventors: Chihiro Maeda (Tokyo, JP); Yuo Umei (Tokyo, JP); Mihoko Yamamoto (Tokyo, JP)
Assignee: ASAHI KASEI KABUSHIKI KAISHA
C08L77/06B29C45/0001B29C45/0081B29C45/2708B29K2071/12B29K2077/00B29K2105/0088B29K2105/251B29L2031/30B29L2031/34C08L2205/03C08L2205/06C08L2205/08
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Quick Facts
Patent No.
US 10,400,103
App. No.
15/368,677
Granted
Sep 3, 2019
Kind
B2
Abstract

The thermoplastic resin composition contains (A) a polyamide, (B) a polyphenylene ether, and (C) a compatibilizer. When the thermoplastic resin composition is molded into a specimen, a continuous phase containing the polyamide (A) and a dispersed phase containing the polyphenylene ether (B) are formed in the specimen, and E-20 represents a mean ellipticity of the dispersed phase in region I extending from a surface of the hinge portion to a depth of 20 μm in the thickness direction, and E-mid represents a mean ellipticity of the dispersed phase in region II extending from a distance, measured along the thickness direction from the surface, equal to 48% of the thickness to a distance, measured along the thickness direction from the surface, equal to 52% of the thickness, the following formula (1) is satisfied: 4.0≤( E -20)/( E -mid)  (1).

Claims (25)

1. A molded product comprising:

a specimen, the specimen having two structural parts and a hinge portion;

the hinge portion having a width of 3 mm to 5 mm, a length of 5 mm to 25 mm, and a thickness of 0.3 mm to 0.7 mm for connecting the two structural parts, wherein

the hinge portion is comprised of a thermoplastic resin composition, the thermoplastic resin composition comprising (A) a polyamide, (B) a polyphenylene ether, and (C) a compatibilizer;

the specimen having a continuous phase wherein the continuous phase is comprised of the polyamide (A), the specimen also having a dispersed phase wherein the dispersed phase is comprised of the polyphenylene ether (B);

a region I extends for a first distance t 1 , the first distance t 1 extending from a first surface of the hinge portion to a depth of 20 μm in the thickness direction of the hinge portion, and wherein

region I comprises E-20, such that E-20 represents a mean ellipticity of the dispersed phase;

a region II extends for a second distance t 2 such that the second distance t 2 extends from a second surface of the hinge portion and the second distance t 2 is between 48% and 52% of the first distance t 1 , and wherein

region II comprises E-mid, such that E-mid represents a mean ellipticity of the dispersed phase; and

the following formula (1) is satisfied:

4.0≤( E -20)/( E -mid)  (1).

2. The molded product according to claim 1 , wherein

region I further comprises S-20, such that S-20 represents an area fraction of the dispersed phase; and

region II further comprises S-mid, such that S-mid represents an area fraction of the polyphenylene ether (B) in the dispersed phase; and

the following formula (2) is satisfied:

1.10≤( S -20)/( S -mid)  (2).

3. The molded product according to claim 1 , wherein the thermoplastic resin composition comprises 40 to 90 parts by mass of the polyamide (A) and 60 to 10 parts by mass of the polyphenylene ether (B), per 100 parts by mass in total of the polyamide (A) and the polyphenylene ether (B).

4. The molded product according to claim 1 , wherein

the compatibilizer (C) is at least one selected from the group consisting of maleic anhydride, maleic acid, citric acid, and fumaric acid, and

the thermoplastic resin composition comprises 0.03 to 10.0 parts by mass of the compatibilizer (C) per 100 parts by mass in total of the polyamide (A) and the polyphenylene ether (B).

5. The molded product according to claim 1 , further comprising (D) an impact modifier.

6. The molded product according to claim 1 , wherein the the specimen is a part of an automotive part.

7. The molded product according to claim 6 , wherein the the specimen is part of a relay block.

8. A method of producing the molded product as recited in claim 1 with a mold having a gate with a gate thickness of 1.0 mm or less, at a molding temperature of 270° C. to 290° C., a mold temperature of 30° C. to 60° C., and an injection rate of 45 cm 3 /sec or higher.

9. The method of producing a molded product according to claim 8 , wherein the thermoplastic resin composition is in the form of pellets with a moisture percentage of 150 mass ppm to 500 mass ppm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2016
From: MAEDA, CHIHIRO; UMEI, YUO; YAMAMOTO, MIHOKO
To: ASAHI KASEI KABUSHIKI KAISHA
Reel/Frame 040511/0266 →
Priority Claims (1)
JP 2015-240558 · Dec 9, 2015 · national
Continuity (1)
Related Publication 20170166746A1 · Jun 15, 2017