IP Library › Granted Patent US 10,400,333
Granted Patent B2
US 10,400,333 · App. 15/234,940 · Granted Sep 3, 2019

Hybrid ceramic showerhead

Inventors: Mohamed Sabri (Beaverton, OR); Ramkishan Rao Lingampalli (Fremont, CA); Karl F. Leeser (West Linn, OR)
Assignee: Novellus Systems, Inc.
C23C16/45565
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,400,333
App. No.
15/234,940
Granted
Sep 3, 2019
Kind
B2
Abstract

Various implementations of hybrid ceramic faceplates for substrate processing showerheads are provided. The hybrid ceramic showerhead faceplates may include an electrode embedded within the ceramic material of the faceplate, as well as a pattern of through-holes. The electrode may be fully encapsulated within the ceramic material with respect to the through-holes. In some implementations, a heater element may also be embedded within the hybrid ceramic showerhead faceplate. A DC voltage source may be electrically connected with the hybrid ceramic showerhead faceplate during use. The hybrid ceramic faceplates may be easily removable from the substrate processing showerheads for easy cleaning and faceplate replacement.

Claims (44)

1. An apparatus comprising:

a gas distributor including:

a ceramic faceplate for a substrate processing showerhead of a processing chamber, the ceramic faceplate including a first pattern of first through-holes;

an electrode including a second pattern of second through-holes;

an electrically conductive contact ring encircling the first pattern of first through-holes; and

a plurality of standoffs, wherein the standoffs are electrically conductive and each electroconductively couple the electrode with the contact ring, wherein:

the electrode is embedded within the ceramic faceplate,

the second pattern matches the first pattern,

the first pattern includes all of the through-holes through which processing gases flow through the ceramic faceplate when the ceramic faceplate is installed in the substrate processing showerhead of the processing chamber,

each second through-hole is larger in size than the corresponding first through-hole, and

each blind hole terminates at the electrode and is occupied by a different one of the standoffs.

2. The apparatus of claim 1 , wherein the ceramic material of the ceramic faceplate is selected from the group consisting of: aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), silicon nitride (Si 3 N 4 ), silicon carbide, boron nitride (BN), and aluminum oxynitride (AlON).

3. The apparatus of claim 1 , wherein the electrode comprises a material selected from the group consisting of: molybdenum and tungsten.

4. The apparatus of claim 1 , wherein the standoffs comprise a material selected from the group consisting of: molybdenum and tungsten.

5. The apparatus of claim 1 , wherein a surface of each standoff is coated with a material selected from the group consisting of nickel, gold, platinum, palladium, and irridium.

6. The apparatus of claim 1 , wherein the standoffs are each connected to the electrode by a bonded connection selected from the group consisting of: a diffusion-bonded connection and a brazed connection.

7. The apparatus of claim 1 , wherein the standoffs are spaced around the outer perimeter of the ceramic faceplate.

8. The apparatus of claim 1 , wherein the standoffs are spaced apart along a circular path that encircles the first pattern of first through-holes.

9. The apparatus of claim 1 , wherein the standoffs protrude from a surface of the ceramic faceplate having the blind holes and the contact ring is separated from the ceramic faceplate by a gap.

10. The apparatus of claim 1 , wherein each second through-hole has a diameter that is greater than or equal to at least twice a diameter of the corresponding first through-hole in the first pattern or 0.04″ larger than the diameter of the corresponding first through-hole in the first pattern.

11. The apparatus of claim 10 , wherein the electrode and the ceramic faceplate are both substantially circular in shape and the electrode has a smaller outer diameter than the ceramic faceplate.

12. The apparatus of claim 11 , further comprising a heater element embedded within the ceramic faceplate, the heater element substantially encircling the first pattern of first through-holes and located in close proximity to an outermost nominal diameter of the ceramic faceplate.

13. The apparatus of claim 1 , wherein the electrode and the ceramic faceplate are both substantially circular in shape and the electrode has a smaller outer diameter than the ceramic faceplate.

14. The apparatus of claim 1 , further comprising at least one heater element, wherein the at least one heater element:

is embedded within the ceramic faceplate,

is not in electrical contact with the electrode,

follows a path which does not intersect any of the first through-holes, and

maintains a minimum distance from the outer perimeter of each first through-hole of at least the larger of 0.04″ and the radius of the first through-hole.

15. The apparatus of claim 1 , further comprising a heater element embedded within the ceramic faceplate, the heater element substantially encircling the first pattern of first through-holes and located in close proximity to an outermost nominal diameter of the ceramic faceplate.

16. The apparatus of claim 1 , wherein the electrode is embedded within the ceramic faceplate at a depth of approximately 0.05″ from a face of the ceramic faceplate that faces in an opposite direction from the direction that the standoffs extend from the electrode.

17. The apparatus of claim 1 , wherein the first through-holes have diameters of between 0.02″ to 0.06″.

18. The apparatus of claim 1 , wherein the ceramic faceplate is in the shape of a flat disk.

19. The apparatus of claim 1 , further comprising:

the processing chamber;

the substrate processing showerhead; and

a pedestal, wherein:

the substrate processing showerhead, the ceramic faceplate, and the pedestal are located substantially within the processing chamber,

the ceramic faceplate is connected with the substrate processing showerhead, and

the standoffs and the contact ring provide portions of electrically conductive pathways between the substrate processing showerhead and the electrode.

20. The apparatus of claim 19 , further comprising a gas distribution stem with a first end and a second end, wherein:

the first end is opposite the second end on the gas distribution stem,

the first end of the gas distribution stem is connected with a top of the processing chamber,

the second end of the gas distribution stem is connected to the substrate processing showerhead, and

the ceramic faceplate is removable from the substrate processing showerhead without removing the gas distribution stem from the top of the processing chamber.

Continuity (3)
Continuation 13411369 · Mar 2, 2012
Provisional Application 61449537 · Mar 4, 2011
Related Publication 20160348244A1 · Dec 1, 2016
Cited By (3)
US 12,203,168 US 12,486,574 US 12,565,704