Gate networks having positive temperature coefficients of resistance (PTC) for semiconductor power conversion devices
A gate network of a silicon-carbide (SiC) power conversion device includes a plurality of gate electrodes of SiC metal-oxide-semiconductor-based (MOS-based) transistor device cells disposed in an active area of the SiC power conversion device, and a gate pad disposed in a gate pad and bus area of the SiC power conversion device. The gate network also includes a gate bus disposed in the gate pad and bus area of the SiC power conversion device, wherein the gate bus extends between and electrically connects the gate pad to at least a portion of the plurality of gate electrodes in the active area of the SiC power conversion device. At least a portion of the gate pad, the gate bus, the plurality of gate electrodes, or a combination thereof, of the gate network have a positive temperature coefficient of resistance greater than approximately 2000 parts-per-million per degree Celsius (ppm/° C.).
1. A silicon-carbide (SiC) power conversion device, comprising:
a gate network, including:
a plurality of gate electrodes of a respective plurality of SiC metal-oxide-semiconductor-based (MOS-based) transistor device cells disposed in an active area of the SiC power conversion device;
a gate pad disposed in a gate pad and bus area of the SiC power conversion device;
a gate bus disposed in the gate pad and bus area of the SiC power conversion device, wherein the gate bus extends between and electrically connects the gate pad to at least a portion of the plurality of gate electrodes in the active area of the SiC power conversion device, wherein at least a portion of the gate pad, the gate bus, the plurality of gate electrodes, or a combination thereof, of the gate network have a positive temperature coefficient of resistance greater than approximately 2000 parts-per-million per degree Celsius (ppm/° C.).
2. The device of claim 1 , wherein the positive temperature coefficient of resistance is greater than approximately 2250 ppm/° C.
3. The device of claim 2 , wherein the positive temperature coefficient of resistance is between approximately 2400 ppm/° C. and 3200 ppm/° C.
4. The device of claim 1 , wherein substantially all of the gate pad, the gate bus, and the plurality of gate electrodes of the gate network have substantially the same positive temperature coefficient of resistance.
5. The device of claim 1 , wherein the SiC power conversion device has a total equivalent series gate resistance (R g ) operating at a junction temperature (T j ) of 150° C. that is at least 25% greater than an R g of the SiC power conversion device operating at a T j of 25° C.
6. The device of claim 5 , wherein the R g of the SiC power conversion device operating at the T j of 150° C. is between approximately 30% and 40% greater than the R g of the SiC power conversion device operating at the T j of 25° C.
7. The device of claim 1 , wherein the gate network comprises a highly doped polysilicon layer disposed below a metal silicide layer.
8. The device of claim 7 , wherein the metal silicide layer comprises molybdenum silicide (MoSi 2 ), tantalum silicide (TaSi 2 ), tungsten silicide (WSi 2 ), cobalt silicide (CoSi 2 ), nickel silicide (NiSi 2 ), titanium silicide (TiSi 2 ), or combinations thereof.
9. The device of claim 1 , wherein a sheet resistance of the gate network is between 2 ohms per square (ohm/square) and 50 ohm/square.
10. The device of claim 1 , wherein a total equivalent series gate resistance (R g ) of the SiC power conversion device is between approximately 1 ohms and approximately 80 ohms.
11. The device of claim 10 , wherein the R g of the SiC power conversion device is between approximately 3 ohms and approximately 20 ohms.
12. The device of claim 1 , wherein only the gate pad of the gate network has the positive temperature coefficient of resistance greater than approximately 2000 ppm/° C., and wherein the gate electrodes have substantially lower positive temperature coefficient of resistance.
13. The device of claim 1 , wherein only one of the gate pad, the gate bus, and the plurality of gate electrodes has the positive temperature coefficient of resistance.
14. The device of claim 1 , wherein the gate pad includes an integrated resistor network having plurality of integrated resistors disposed adjacent to a gate metal contact region, wherein the plurality of SiC MOS-based transistor device cells are disposed in different portions of the active area of the device, wherein a first portion of the plurality of gate electrodes is electrically connected to an external gate connection via a first integrated resistor of the plurality of integrated resistors, the gate bus, and the gate metal contact region, and wherein a second portion of the plurality of gate electrodes in a second portion of the active area of the device is electrically connected to the external gate connection via a second integrated resistor of the plurality of integrated resistors, and the gate contact region, and wherein the first and second integrated resistors have substantially different respective resistance values.
15. The device of claim 1 , wherein the plurality of SiC MOS-based transistor device cells are a plurality of metal-oxide-semiconductor field-effect transistor (MOSFET) device cells or a plurality of insulated gate bipolar transistor (IGBT) device cells.