Differential MEMS microphone
A microphone includes a base; a first micro electro mechanical system (MEMS) device and a second MEMS device disposed on the base. The first MEMS device has a first diaphragm and a first back plate, and the second MEMS device has a second diaphragm and a second back plate. The first MEMS device and the second MEMS device are arranged such that positive pressure moves the first diaphragm towards the first back plate, and the positive pressure simultaneously moves the second diaphragm of the from second back plate.
1. A microphone, comprising:
a base;
a first micro electro mechanical system (MEMS) device disposed over a first portion of the base, the first MEMS device having a first diaphragm and a first back plate;
a second MEMS device, the second MEMS device disposed over a second portion of the base different from the first portion, the second MEMS device having a second diaphragm and a second back plate;
wherein the first MEMS device and the second MEMS device are arranged such that positive pressure moves the first diaphragm towards the first back plate, and the positive pressure simultaneously moves the second diaphragm away from the second back plate.
2. The microphone of claim 1 , wherein one of the first MEMS device and the second MEMS device is flip-chip connected to the base.
3. The microphone of claim 1 , further comprising a port extending through the base.
4. The microphone of claim 1 , further comprising a cover coupled to the base and enclosing the first MEMS device and the second MEMS device, and a port extending through the cover.
5. The microphone of claim 1 , wherein the first MEMS device is disposed over a first port extending through the base and the second MEMS device is disposed over a second port extending through the base.
6. The microphone of claim 1 , further comprising an integrated circuit disposed on the base.
7. The microphone of claim 1 , wherein the first diaphragm and the first back plate are disposed on a first MEMS silicon base, and the second diaphragm and the second back plate are disposed on a second MEMS silicon base.
8. A microphone comprising:
a base;
a first micro electro mechanical system (MEMS) device disposed over a first portion of the base, the first MEMS device comprising:
a first diaphragm;
a first back plate; and
a first substrate supporting the first diaphragm and the first back plate, wherein the first diaphragm is positioned between the first back plate and the base, and
a second MEMS device disposed over a second portion of the base different from the first portion, the second MEMS device comprising:
a second diaphragm;
a second back plate; and
a second substrate supporting the second diaphragm and the second back plate, wherein the second back plate is positioned between the second diaphragm and the base.
9. The microphone of claim 8 , wherein the second MEMS device is flip-chip connected to the base.
10. The microphone of claim 8 , further comprising an integrated circuit disposed on the base.
11. The microphone of claim 10 , wherein the first MEMS device and the second MEMS device are connected to the integrated circuit through lead wires.
12. The microphone of claim 11 , wherein the integrated circuit is configured to generate an output of the microphone using a difference between signals from the first MEMS device and the second MEMS device.
13. The microphone of claim 8 , wherein the base includes a printed circuit board.
14. The microphone of claim 8 , wherein the first substrate and the second substrate are constructed of silicon.
15. A microphone comprising:
a base;
a substrate disposed on the base, the substrate holding a first MEMS device positioned over a first portion of the base and a second MEMS device positioned over a second portion of the base, the second portion different from the first portion;
the first MEMS device comprising:
a first diaphragm; and
a first back plate;
wherein the first diaphragm is positioned between the first back plate and the base; and
the second MEMS device comprising:
a second diaphragm; and
a second back plate;
wherein the second back plate is positioned between the second diaphragm and the base.
16. The microphone of claim 15 , wherein the base includes a printed circuit board, and wherein the substrate is constructed of silicon.
17. The microphone of claim 15 , further comprising an integrated circuit disposed on the base.
18. The microphone of claim 15 , wherein the first MEMS device and the second MEMS device are connected to the integrated circuit through lead wires.
19. The microphone of claim 18 , wherein the integrated circuit is configured to generate an output of the microphone using a difference of signals from the first MEMS device and the second MEMS device.
20. The microphone of claim 15 , further comprising a port extending through the base, which allows sound pressure to reach the first MEMS device and the second MEMS device.