Assembly and method for transfer molding

1. A transfer molding assembly, comprising:

a chamber;

a die within the chamber;

a heater operable to heat the die;

a first gas control device configured to provide a first gas into the chamber; and

a second gas control device configured to provide a second gas into the die during a transfer molding process in which the heater heats the die, wherein the second gas has a different chemical composition than the first gas;

wherein the first gas control device is in communication with a source of the first gas, and wherein the second gas control device is in communication with a source of the second gas;

wherein an interior of the die includes a molding cavity interconnected with a reservoir, and wherein a preform is provided in the molding cavity and a material is provided in the reservoir; and

wherein the second gas inhibits a potential reaction of the preform in response to an increase in temperature.

2. The assembly as recited in claim 1 , including a controller in communication with the first gas control device and the second gas control device, the controller configured to regulate a rate at which the first and second gases are provided into the chamber and the die, respectively.

3. The assembly as recited in claim 1 , wherein a passageway leads from the source of the second gas directly to the interior of the die.

4. The assembly as recited in claim 1 , wherein the preform includes silicon carbide (SiC) fibers.

5. The assembly as recited in claim 1 , wherein the material is a glass-based material.

6. The assembly as recited in claim 5 , wherein the glass-based material is heated and injected into the preform to form a glass-based composite material.

7. The assembly as recited in claim 1 , wherein the preform is capable of releasing a third gas during the transfer molding process in which the preform is subjected to an increase in temperature, and wherein the second gas is the same as the third gas.

8. The assembly as recited in claim 1 , wherein the first gas includes argon (Ar), and wherein the second gas includes carbon monoxide (CO).

9. The assembly as recited in claim 8 , wherein the first gas is provided into the chamber at a rate of about fifteen times a rate the second gas is provided into the chamber.

10. The assembly as recited in claim 8 , wherein the first gas is substantially pure argon (Ar), and wherein the second gas is substantially pure carbon monoxide (CO).

11. The assembly as recited in claim 1 , wherein the die includes a graphite material.

12. A method comprising:

providing a first gas into a chamber; and

providing a second gas into a die within the chamber, the second gas having a different chemical composition than the first gas, wherein the second gas is provided into the die during a transfer molding process in which the die is heated, and wherein the die includes a preform is capable of releasing a third gas during the transfer molding process in which the preform is subjected to an increase in temperature, wherein the second gas has the same chemical composition as the third gas.

13. The method as recited in claim 12 , wherein the first and second gases are provided such that a volume percentage of the second gas is less than or equal to 12.5% of the volume of the chamber.

14. The method as recited in claim 12 , wherein the first and second gases are provided such that a volume percentage of the second gas is less than or equal to 7% of the volume of the chamber.

15. The method as recited in claim 12 , wherein the die includes an injection ram, and the second gas is provided into the die as a downward force is applied onto a material within the die by the injection ram.