Curing apparatus and curing method
A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.
1. A curing apparatus, comprising:
a chamber, configured for accommodating a substrate provided with a polyimide adhesive;
an air extracting unit, configured for evacuating the chamber; and
a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during an evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive,
wherein, the chamber is provided with an exhaust unit, and the exhaust unit is connected with the air extracting unit, the exhaust unit includes a plurality of exhausting pipes and a connecting part for connecting the plurality of exhausting pipes, a plurality of pores are distributed on each exhausting pipe, and the air extracting unit is connected with the connecting part.
2. The curing apparatus according to claim 1 , further comprising an air supplying unit, configured for supplying nitrogen to the chamber after the first heating and before the second heating, so that a second predetermined pressure is reached in the chamber.
3. The curing apparatus according to claim 2 , wherein the second predetermined pressure is greater than the first predetermined pressure.
4. The curing apparatus according to claim 3 , wherein, the first predetermined pressure is 20 Pa to 30 Pa, and the second predetermined pressure is 1000 Pa to 2000 Pa.
5. The curing apparatus according to claim 1 , further comprising a cooling unit, configured for cooling the substrate after the second heating.
6. The curing apparatus according to claim 5 , wherein, the cooling unit cools the substrate by circulating nitrogen in the chamber.
7. The curing apparatus according to claim 1 , wherein, the chamber includes an opening for placing and taking out the substrate and a shutting member for opening and closing the opening.
8. The curing apparatus according to claim 7 , further comprising an air cylinder, wherein the shutting member opens and closes the opening under a control of the air cylinder.
9. The curing apparatus according to claim 7 , wherein, a sealing ring is provided on a periphery of the opening or the shutting member.
10. The curing apparatus according to claim 1 , comprising a plurality of chambers in a stacked arrangement, each of the chambers configured for accommodating one substrate.
11. The curing apparatus according to claim 10 , comprising a plurality of air extracting units, each of the chambers being connected with one air extracting unit.
12. The curing apparatus according to claim 10 , further comprising a cooling unit, configured for cooling the substrates after the second heating.
13. The curing apparatus according to claim 12 , wherein, the cooling unit cools the substrates by circulating nitrogen in the plurality of chambers or circulating the nitrogen in each chamber.
14. The curing apparatus according to claim 1 , wherein, a temperature of the first heating is 200° C. to 300° C., and a temperature of the second heating is 400° C. to 500° C.
15. A curing method, comprising:
placing a substrate provided with a polyimide adhesive into a chamber;
evacuating the chamber with an air extracting unit;
performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber in the process of evacuating the chamber, to remove organic gases from the polyimide adhesive; and
performing a second heating on the substrate, to cure the polyimide adhesive,
wherein, the chamber is provided with an exhaust unit, and the exhaust unit is connected with the air extracting unit, the exhaust unit includes a plurality of exhausting pipes and a connecting part for connecting the plurality of exhausting pipes, a plurality of pores are distributed on each exhausting pipe, and the air extracting unit is connected with the connecting part.
16. The curing method according to claim 15 , wherein, after the first heating and before the second heating, the method further comprises:
supplying nitrogen to the chamber, so that a second predetermined pressure is reached in the chamber.
17. The curing method according to claim 15 , wherein, after the second heating, the method further comprises: cooling the substrate.