Inter-chip alignment
First, second, and third integrated devices each include one or more interconnecting structure. Each interconnecting structure includes (i) one or more interconnecting nodules extending from an edge surface of the device, (ii) one or more interconnect voids formed in an edge surface of the device, or (iii) both (i) and (ii). The one or more interconnecting structures on each of the first and second device is mated with the one or more interconnecting structures on the second device. The first integrated device includes a signal output, the third integrated device includes a signal input; and the second integrated device includes a conductor for conducting a signal from the signal output to the signal input.
1. A quilt packaging system comprising:
first, second, and third integrated devices formed on surfaces of respective first, second, and third integrated circuit chips;
the first integrated circuit chip including a nodule or void that is mated with a respective void or nodule on the second integrated circuit chip, and the third integrated circuit chip including a nodule or void that is mated with another respective void or nodule on the second integrated circuit chip, wherein each nodule extends laterally from an edge surface of its integrated circuit chip and each void is formed along an edge surface of its integrated circuit chip;
the first integrated device is an optical emitter;
the third integrated device is an optical detector; and
the second integrated device is an optical waveguide for conducting an optical signal from the optical emitter to the optical detector.
2. The quilt packaging system of claim 1 , wherein one of the nodules of one of the integrated circuit chips is at least partially disposed within at least one of the voids of another one of the integrated circuit chips.
3. The quilt packaging system of claim 1 , wherein:
each of the first and third integrated circuit chips include one or more voids; and
the second integrated circuit chip includes one or more nodules at least partially disposed in the one or more voids of the of the first and third integrated devices.
4. A quilt packaging system comprising:
first, second, and third integrated devices formed on surfaces of respective first, second, and third integrated circuit chips;
one or more interconnecting structures on each integrated circuit chip, each interconnecting structure comprising (i) one or more interconnecting nodules extending from an edge surface of the integrated circuit chip and (ii) one or more interconnect voids formed along an edge surface of the integrated circuit chip, wherein the first integrated circuit chip includes a nodule or void that is mated with a respective void or nodule on the second integrated circuit chip, and wherein the third integrated circuit chip includes a nodule or void that is mated with another respective void or nodule on the second integrated circuit chip;
the first integrated device is an optical emitter;
the third integrated device is an optical detector; and
the second integrated device is an optical waveguide for conducting an optical signal from the optical emitter to the optical detector.
5. The quilt packaging system of claim 4 , wherein one of the interconnect nodules of one of the integrated circuit chips is at least partially disposed within at least one of the interconnect voids of another one of the integrated circuit chips.
6. The quilt packaging system of claim 4 , wherein:
each of the first and third integrated circuit chips include one or more interconnect voids; and
the second integrated circuit chip includes one or more interconnect nodules at least partially disposed in the one or more interconnect voids of the of the first and third integrated devices.