Electrical multilayer lamination transfer films
Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films ( 100 ) may include a plurality of co-extensive electrical protolayers ( 22, 23, 24 ) forming an electrical protolayer stack ( 20 ), at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 10 3 and 10 4 Poise at a shear rate of 100/s when heated to a temperature between its Tg and T dec .
1. A transfer film comprising:
a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers.
2. A transfer film according to claim 1 , wherein the plurality of co-extensive electrical protolayers are interdigitated.
3. A transfer film according to claim 1 , wherein at least selected electrical protolayers are electrically conductive.
4. The transfer film according to claim 1 , wherein each or at least selected electrical protolayers comprise less than 75 wt % inorganic nanomaterials.
5. A transfer film according to claim 1 further comprising a polymeric support layer having a releasable surface, the releasable surface contacting the electrical protolayer stack.
6. A transfer film according to claim 1 , wherein the electrical protolayer stack comprises an electrode protolayer comprising electrically conductive material and a dielectric protolayer comprising electrically insulating material.
7. A transfer film according to claim 1 , wherein the electrical protolayer stack comprises a negative electrode protolayer comprising negative electrode material, a positive electrode protolayer comprising positive electrode material and an electrolyte protolayer comprising electrolyte material and the electrolyte protolayer is disposed between the negative electrode protolayer and the positive electrode protolayer.
8. A transfer film according to claim 1 , wherein the electrical protolayer stack comprises a plurality of electrochromic protolayers comprising electrochromic material and an optional electrolyte protolayer comprising an electrolyte material.
9. The transfer film according to claim 8 , wherein the electrochromic material comprises at least one of, tungsten oxide, iridium oxide, nickel oxide, hydrous nickel oxide, molybdenum oxide, vanadium oxide, niobium oxide, titanium oxide, transition metal oxides of manganese, cobalt, rhodium, and ruthenium, Prussian Blue and metal phthalocyanines.
10. The transfer film according to claim 8 , wherein the electrochromic material comprises at least one PW 12 O 40 3− , SiW 12 O 40 4− , W 10 O 32 3− , [Eu-(H 2 O)P 5 W 30 O 11 ] 12− , WO 3 , IrO 2 , Ir(OH) 3 , MoO 3 , V 2 O 5 , Nb 2 O 5 , TiO 2 , (Fe(III) 4 [Fe(II)(CN) 6 ] 3 , and KFe(III)Fe(II)(CN) 6 ).
11. A transfer film according to claim 1 , wherein at least selected electrical protolayers comprise inorganic nanomaterial having an average size of less than 1000 nm.
12. A transfer film according to claim 1 , wherein sacrificial material comprises an organic polymer material.
13. A transfer film according to claim 1 , wherein the sacrificial material is present in each electrical protolayer in a range from 25 to 95 wt %.
14. A transfer film according to claim 1 , wherein the electrical protolayer stack comprises at least 10 electrical protolayers.
15. A transfer film according to claim 1 , wherein at least selected electrical protolayers comprise inorganic nanoparticles and an organometallic polymer or coordination compound.
16. A method of forming a transfer film, comprising:
forming a plurality of electrical protolayers to form an electrical protolayer stack, each protolayer independently comprising a sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers.
17. A method according to claim 16 , wherein the electrical protolayers are interdigitated.
18. A method according to claim 16 , wherein forming a plurality of electrical protolayers comprises coextruding the plurality of electrical protolayers.
19. A method according to claim 16 , wherein each electrical protolayer of the electrical protolayer stack independently exhibits a complex viscosity of between 10 3 and 10 4 Poise at a shear rate of 100/s when heated to a temperature between its T g and T dec .
20. A method according to any of claim 16 , wherein the electrical protolayer stack is formed on a releasable surface of a polymeric support substrate.