Heat dissipation system and heat dissipation method
View Patent ↗A heat dissipation system includes a motherboard, at least two chips, at least two heat sinks and at least two air guide covers. Every two chips of the at least two chips constitute a chipset, the chips in each chipset are installed on the motherboard in sequence along an airflow direction, each of the at least heat sinks is installed on a surface of the chip corresponding to the heat sink, and every two air guide covers of the at least two air guide covers constitute an air guide group. In the air guide group, a first air guide cover is arranged on a first side of a first chip, and a second air guide cover is arranged on a second side of a second chip. A heat dissipation method based on the system is also provided. The solution ensures a relatively uniform heat dissipation between the chips.
1. A heat dissipation system, comprising a motherboard, at least two chips, at least two heat sinks and at least two air guide covers, wherein
every two chips of the at least two chips constitute a chipset;
the chips in each chipset are installed on the motherboard in sequence along an airflow direction;
each of the at least two heat sinks is installed on a surface of the respective chip;
every two air guide covers of the at least two air guide covers constitute an air guide group;
wherein in each air guide group, a first air guide cover is arranged on a first side of a first chip of the chipset corresponding to the air guide group, which side is parallel to the airflow direction, and is configured to guide a first airflow into the heat sink corresponding to the first chip; and
a second air guide cover is arranged on a second side of a second chip of the chipset corresponding to the air guide group, which side is parallel to the first side and is in the same line with an opposite side of the first side, and is configured to guide a second airflow which does not flow through the heat sink corresponding to the first chip into the heat sink corresponding to the second chip, and guide the first airflow to bypass the heat sink corresponding to the second chip when the first airflow flows through the heat sink corresponding to the first chip.
2. The heat dissipation system according to claim 1 , further comprising at least four card slots, wherein
each of the at least four card slots is installed on the motherboard, and every two card slots of the at least four card slots are arranged on both sides parallel to the airflow direction of the chip and configured to insert peripheral memory banks respectively;
the first air guide cover is configured to cover the card slot arranged on the first side; and
the second air guide cover is configured to cover the card slot arranged on the second side and guide the second airflow, which flows through the card slot corresponding to the first chip and not covered by the air guide cover, into the heat sink corresponding to the second chip.
3. The heat dissipation system according to claim 2 , wherein
each of the at least two air guide covers comprises: a rectangular groove and two air guide openings arranged on sidewalls of the rectangular groove; and
a first air guide opening and a second air guide opening of the two air guide openings are arranged on the two parallel sidewalls of the rectangular groove, and are perpendicular to the airflow direction.
4. The heat dissipation system according to claim 3 , wherein
the first air guide opening of the first air guide cover receives a third airflow, and the third airflow flows out via the second air guide opening of the first air guide cover, to dissipate heat from inside of the first air guide cover.
5. The heat dissipation system according to claim 3 , wherein
the first air guide opening of the second air guide cover receives a fourth branch airflow branched from the second airflow, and the fourth branch airflow flows out via the second air guide opening of the second air guide cover, to dissipate heat from inside of the second air guide cover.
6. The heat dissipation system according to claim 3 , wherein
the rectangle groove of each of the at least two air guide covers has a size of 145 mm×40 mm×16 mm; and
each of the air guide openings is arranged on the sidewall with a size of 40 mm×16 mm of the rectangular groove, and has a size of 30 mm×5 mm.
7. The heat dissipation system according to claim 1 , wherein
the two chips in the chipset have a distance not less than 15 mm.
8. A heat dissipation method implemented based on the heat dissipation system according to claim 1 , comprising:
guiding, by the first air guide cover, the first airflow into the heat sink corresponding to the first chip;
guiding, by the second air guide cover, the second airflow which does not flow through the heat sink corresponding to the first chip into the heat sink corresponding to the second chip; and
guiding, by the second air guide cover, the first airflow to bypass the heat sink corresponding to the second chip when the first airflow flows through the heat sink corresponding to the first chip.
9. The heat dissipation method according to claim 8 , further comprising:
covering, by the first air guide cover, the card slot arranged on the first side of the first chip; and
covering, by the second air guide cover, the card slot arranged on the second side of the second chip; wherein
the step of guiding the second airflow which does not flow through the heat sink corresponding to the first chip into the heat sink corresponding to the second chip comprises:
guiding the second airflow, which flows through the card slot corresponding to the first chip and not covered by the air guide cover, into the heat sink corresponding to the second chip.
10. The heat dissipation method according to claim 8 , further comprising: providing two air guide openings for each of the at least two air guide covers, wherein
a first air guide opening and a second air guide opening are arranged on two sidewalls parallel to each other, and are perpendicular to the airflow direction;
the first air guide opening of the first air guide cover receives a third airflow, and the third airflow flows out via the second air guide opening of the first air guide cover, to dissipate heat from inside of the first air guide cover; and
the first air guide opening of the second air guide cover receives a fourth airflow branched from the second airflow, and the fourth branch airflow flows out via the second air guide opening of the second air guide cover, to dissipate heat from inside of the second air guide cover.
11. The heat dissipation system according to claim 4 , wherein
the first air guide opening of the second air guide cover receives a fourth branch airflow branched from the second airflow, and the fourth branch airflow flows out via the second air guide opening of the second air guide cover, to dissipate heat from inside of the second air guide cover.
12. The heat dissipation system according to claim 2 , wherein the two chips in the chipset have a distance not less than 15 mm.
13. The heat dissipation system according to claim 3 , wherein the two chips in the chipset have a distance not less than 15 mm.
14. The heat dissipation system according to claim 4 , wherein the two chips in the chipset have a distance not less than 15 mm.
15. The heat dissipation system according to claim 5 , wherein the two chips in the chipset have a distance not less than 15 mm.
16. The heat dissipation system according to claim 6 , wherein the two chips in the chipset have a distance not less than 15 mm.
17. The heat dissipation method according to claim 9 , further comprising: providing two air guide openings for each of the at least two air guide covers, wherein
a first air guide opening and a second air guide opening are arranged on two sidewalls parallel to each other, and are perpendicular to the airflow direction;
the first air guide opening of the first air guide cover receives a third airflow, and the third airflow flows out via the second air guide opening of the first air guide cover, to dissipate heat from inside of the first air guide cover; and
the first air guide opening of the second air guide cover receives a fourth airflow branched from the second airflow, and the fourth branch airflow flows out via the second air guide opening of the second air guide cover, to dissipate heat from inside of the second air guide cover.