Memory device and memory unit
There are provided a memory device and a memory unit that make it possible to improve retention property of a resistance value in low-current writing. The memory device of the technology includes a first electrode, a memory layer, and a second electrode in order, in which the memory layer includes an ion source layer containing one or more transition metal elements selected from group 4, group 5, and group 6 in periodic table, one or more chalcogen elements selected from tellurium (Te), sulfur (S), and selenium (Se), and one or both of boron (B) and carbon (C), and a resistance change layer having resistance that is varied by voltage application to the first electrode and the second electrode.
1. A memory device, comprising:
a first electrode, a memory layer, and a second electrode in order, wherein the second electrode comprises copper (Cu); and
a material that covers a surface of the second electrode, wherein
the material includes at least one of titanium nitride (TiN) or tantalum nitride (TaN), and
the memory layer includes:
an ion source layer in contact with the first electrode, wherein
the ion source layer contains boron (B), carbon (C), at least one transition metal element selected from at least one of group 4, group 5, or group 6 in periodic table, and at least one chalcogen element selected from tellurium (Te), sulfur (S), or selenium (Se), and
a content of the boron (B) in the ion source layer is greater than 30 at % and lower than or equal to 40 at %; and
a resistance change layer, wherein a resistance value of the resistance change layer is changeable based on a variation in an oxygen defect concentration in the resistance change layer.
2. The memory device according to claim 1 , wherein a content of the carbon (C) in the ion source layer is 3 at % or greater and 35 at % or lower.
3. The memory device according to claim 1 , wherein the ion source layer further contains oxygen (O).
4. The memory device according to claim 1 , wherein the ion source layer further contains nitrogen (N).
5. The memory device according to claim 1 , wherein the ion source layer further contains one of manganese (Mn), cobalt (Co), iron (Fe), nickel (Ni), platinum (Pt), or silicon (Si).
6. The memory device according to claim 1 , wherein
the ion source layer further contains a metal element,
first binding energy of the metal element with oxygen is lower than second binding energy of the transition metal element with oxygen, and
the metal element suppresses formation of an oxide of the transition metal element.
7. The memory device according to claim 6 , wherein the metal element is at least one of molybdenum (Mo), platinum (Pt), or nickel (Ni).
8. The memory device according to claim 6 , wherein a content of the metal element in the ion source layer is 3 at % or greater and 10 at % or lower.
9. The memory device according to claim 6 , wherein the metal element is at least one of molybdenum (Mo), tungsten (W), or nickel (Ni), and wherein a content of the at least one of molybdenum (Mo), tungsten (W), or nickel (Ni) in the ion source layer is 3 at % and greater and 10 at % or lower.
10. The memory device according to claim 1 , wherein the transition metal element in the ion source layer is hafnium (Hf).
11. The memory device according to claim 1 , wherein the resistance change layer further contains at least one of oxygen (O), nitrogen (N), boron (B), or carbon (C).
12. The memory device according to claim 1 , wherein the resistance change layer further contains an oxide, an oxynitride, and a nitride of at least one of zirconium (Zr), hafnium (Hf), aluminum (Al), or rare earth elements.
13. The memory device according to claim 1 , wherein the resistance value of the resistance change layer changes based on a presence of the transition metal element in a low resistance part of the resistance change layer and based on application of voltage to the first electrode and the second electrode.
14. The memory device according to claim 1 , wherein
the resistance value of the resistance change layer changes based on the variation in the oxygen defect concentration in a low resistance part of the resistance change layer, and
the variation in the oxygen defect concentration in the low resistance part of the resistance change layer is based on application of voltage to the first electrode and the second electrode.
15. The memory device according to claim 1 , wherein the ion source layer further contains an element that forms a conduction path in the resistance change layer.
16. The memory device according to claim 1 , wherein the ion source layer is free from copper (Cu).
17. A memory unit, comprising:
a plurality of memory devices,
wherein each of the plurality of memory devices includes:
a first electrode, a memory layer, and a second electrode in order, wherein the second electrode comprises copper (Cu); and
a material that covers a surface of the second electrode, wherein the material includes at least one of titanium nitride (TiN) or tantalum nitride (TaN); and
a pulse application section configured to selectively apply a pulse of a voltage or a current to the plurality of memory devices, wherein the memory layer includes:
an ion source layer in contact with the first electrode, wherein
the ion source layer contains boron (B), carbon (C), at least one transition metal element selected from at least one of group 4, group 5, and group 6 in periodic table, and at least one chalcogen element selected from tellurium (Te), sulfur (S), and selenium (Se), and
a content of the boron (B) in the ion source layer is greater than 30 at % and lower than or equal to 40 at %; and
a resistance change layer, wherein a resistance value of the resistance change layer is changeable based on a variation in an oxygen defect concentration in the resistance change layer.