Display device and organic luminescent display device
Provided is a display device including: a structure including a display area and a peripheral area surrounding the display area; and an inorganic encapsulation thin film disposed on the display and peripheral areas. The peripheral area includes at least one inorganic surface portion having a closed shape continuously.
1. An electroluminescent device, comprising:
a lower structure which has an emission area and a peripheral area surrounding the emission area, and which comprises an inorganic insulating film, an insulation film located on the inorganic insulating film, a lower electrode located on the insulation film, an electroluminescent layer located on the lower electrode, an upper electrode located on the electroluminescent layer, and a conductor located on a top surface of the inorganic insulating film, and side and top surfaces of the insulation film to be electrically connected to the upper electrode,
a flexible encapsulation multilayer located on the emission and peripheral areas of the lower structure, including at least three layers, and having a bottom surface comprising only at least one inorganic material, and
wherein the conductor comprises a first inorganic wiring extending on the top surface of the inorganic insulating film along a periphery of the emission area, and a second inorganic wiring which extends on the side and top surfaces of the insulation film along the periphery of the emission area, which has a bottom surface electrically contacting a top surface of the first inorganic wiring, and which has a top surface electrically contacting a bottom surface of the upper electrode,
wherein a surface of the peripheral area comprises an inorganic surface portion located outside the upper electrode in a plan view, and substantially surrounding the emission area of the lower structure,
wherein an entire of the inorganic surface portion directly contacts the bottom surface of the flexible encapsulation multilayer,
wherein the inorganic surface portion comprises a plurality of stepped surface portions, each including a top surface portion of the inorganic insulating film, a side surface portion of the first inorganic wiring, and a top surface portion of the first inorganic wiring, and
wherein the first inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the first inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the first inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the outer edge portion of the first inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer.
2. The electroluminescent device of claim 1 , wherein the inorganic surface portion further comprises a plurality of stepped surface portions, each including a top surface portion of the first inorganic wiring, a side surface portion of the second inorganic wiring, and a top surface portion of the second inorganic wiring, and
wherein the second inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the second inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the second inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the outer edge portion of the second inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer.
3. The electroluminescent device of claim 1 , wherein the inorganic surface portion further comprises a plurality of stepped surface portions, each including a top surface portion of the inorganic insulating film, a side surface portion of the second inorganic wiring, and a top surface portion of the second inorganic wiring, and
wherein the second inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the second inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the second inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the outer edge portion of the second inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer.
4. The electroluminescent device of claim 1 , wherein the inorganic surface portion further comprises a plurality of stepped surface portions, each including a top surface portion of the first inorganic wiring, a side surface portion of the second inorganic wiring, and a top surface portion of the second inorganic wiring,
wherein the inorganic surface portion further comprises a plurality of stepped surface portions, each including a top, surface portion of the inorganic insulating film, a side surface portion of the second, inorganic wiring, and a top surface portion of the second inorganic wiring, and
wherein the second inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the second inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the second inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the outer edge portion of the second inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer.
5. The electroluminescent device of claim 1 , further comprising an organic layer which is located between the upper electrode and the bottom surface of the flexible encapsulation multilayer, which is in direct contact with the upper electrode, and which has a conductive or semi-conductive property.
6. An electroluminescent device, comprising:
a lower structure which has an emission area and a peripheral area surrounding the emission area, and which comprises an inorganic insulating film, an insulation film located on the inorganic insulating film, a lower electrode located on the insulation film, an electroluminescent layer located on the lower electrode, an upper electrode located on the electroluminescent layer, and a conductor located on a top surface of the inorganic insulating film, and side and top surfaces of the insulation film to be electrically connected to the upper electrode,
a flexible encapsulation multilayer located on the emission and peripheral areas of the lower structure, including at least three layers, and having a bottom surface comprising only at least one inorganic material, and
wherein a surface of the peripheral area comprises an inorganic surface portion located outside the upper electrode in a plan view, and substantially surrounding the emission area of the lower structure,
wherein an entire of the inorganic surface portion directly contacts the bottom surface of the flexible encapsulation multilayer,
wherein the conductor comprises a first inorganic wiring located on the top surface of the inorganic insulating film, and a second inorganic wiring located on the side and top surfaces of the insulation film to electrically contact both a top surface of the first inorganic wiring and a bottom surface of the upper electrode, and
wherein at least a portion of a surface of the conductor directly contacts the bottom surface of the flexible encapsulation multilayer to be included in the inorganic surface portion.
7. The electroluminescent device of claim 6 , further comprising an organic layer which is located between the upper electrode and the bottom surface of the flexible encapsulation multilayer, which is in direct contact with the upper electrode, and which has a conductive or semi-conductive property.
8. An electroluminescent device, comprising:
a lower structure which has an emission area and a peripheral area surrounding the emission area, and which comprises an insulation film, a lower electrode located on the insulation film, an electroluminescent layer located on the lower electrode, and an upper electrode located on the electroluminescent layer, and
a flexible encapsulation multilayer located on the emission and peripheral areas of the lower structure, including at least three layers, and having a bottom surface comprising only at least one inorganic material, and
wherein a surface of the peripheral area comprises an inorganic surface portion located outside the upper electrode in a plan view, substantially surrounding the emission area of the lower structure, and comprising a plurality of inorganic surface branches spaced apart from each other,
wherein the surface of the peripheral area comprises an organic surface portion substantially surrounding the emission area of the lower structure, having a predetermined height, and located between the inorganic surface branches to be substantially surrounded by the inorganic surface portion,
wherein an entire of the inorganic surface portion and an entire of the organic surface portion are in direct contact with the bottom surface of the flexible encapsulation multilayer,
wherein the inorganic surface branches include an outer inorganic surface branch located outer than the organic surface portion and an inner inorganic surface branch located inner than the organic surface portion, and
wherein a height of the inner inorganic surface branch is relatively larger than a height of the outer inorganic surface branch.
9. The electroluminescent device of claim 8 , wherein the lower structure further comprises a first inorganic wiring located on a top surface of the inorganic insulating film, and a second inorganic wiring located on side and top surfaces of the insulation film to electrically contact both a top surface of the first inorganic wiring and a bottom surface of the upper electrode, and
wherein the inner inorganic surface branch includes at least a portion of a top surface of the second inorganic wiring.
10. The electroluminescent device of claim 9 , wherein a portion of a surface of the first inorganic wiring directly contacts the lower surface of the flexible, encapsulation multilayer, and
wherein the portion of the surface of the first inorganic wiring is relatively farther than the organic surface portion from the emission area.
11. The electroluminescent device of claim 10 , wherein the portion of the surface of the first inorganic wiring, which directly contacts the lower surface of the flexible encapsulation multilayer, is included in the outer inorganic surface branch.
12. The electroluminescent device of claim 8 , further comprising an organic layer which is located between the upper electrode and the bottom surface of the flexible encapsulation multilayer, which is in direct contact with the upper electrode, and which has a conductive or semi-conductive property.
13. An electroluminescent device, comprising:
a lower structure which has an emission area and a peripheral area surrounding the emission area, and which comprises an insulation film, a lower electrode located on the insulation film, an electroluminescent layer located on the lower electrode, and an upper electrode located on the electroluminescent layer, and
a flexible encapsulation multilayer located on the emission and peripheral areas of the lower structure, including at least three layers, and having a bottom surface comprising only at least one inorganic material, and
wherein a surface of the peripheral area comprises an inorganic surface portion located outside the upper electrode in a plan view, substantially surrounding the emission area of the lower structure, and comprising a plurality of inorganic surface branches spaced apart from each other,
wherein the surface of the peripheral area comprises an organic surface portion substantially surrounding the emission area of the lower structure, having a predetermined height, and located between the inorganic surface branches to be substantially surrounded by the inorganic surface portion,
wherein an entire of the inorganic surface portion and an entire of the organic surface portion are in direct contact with the bottom surface of the flexible encapsulation multilayer, and
wherein the organic surface portion has an opened shape discontinuously surrounding the emission area.
14. The electroluminescent device of claim 13 , further comprising an organic layer which is located between the upper electrode and the bottom surface of the flexible encapsulation multilayer, which is in direct contact with the upper electrode, and which has a conductive or semi-conductive property.
15. An electroluminescent device, comprising:
a lower structure which has an emission area and a peripheral area surrounding the emission area, and which comprises an inorganic insulating film, an inorganic capping film located on the inorganic insulating film, an insulation film located on the inorganic capping film, a lower electrode located on the insulation film, an electroluminescent layer located on the lower electrode, an upper electrode located on the electroluminescent layer, and a conductor located on a top surface of the inorganic insulating film, and side and top surfaces of the insulation film to be electrically connected to the upper electrode,
a flexible encapsulation multilayer located on the emission and peripheral areas of the lower structure, including at least three layers, and having a bottom surface comprising only at least one inorganic material, and
wherein the conductor comprises a first inorganic wiring extending on the top surface of the inorganic insulating film along a periphery of the emission area, and a second inorganic wiring which extends on the side and top surfaces of the insulation film along the periphery of the emission area, which has a bottom surface electrically contacting a top surface of the first inorganic wiring, and which has a top surface electrically contacting a bottom surface of the upper electrode,
wherein a surface of the peripheral area comprises an inorganic surface located outside the upper electrode in a plan view, and substantially surrounding the emission area of the lower structure,
wherein an entire of the inorganic surface directly contacts the bottom surface of the flexible encapsulation multilayer, and
wherein the inorganic capping film has an opening exposing the top surface of first inorganic wiring.
16. The electroluminescent device of claim 15 , further comprising an organic spacer which is located on a region where the first inorganic wiring and the second inorganic wiring are in direct contact with each other, and which is located under the bottom surface of the flexible encapsulation multilayer.
17. The electroluminescent device of claim 15 , wherein the first inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the first inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the first inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the inorganic capping film is located between the outer edge portion of the first inorganic wiring and the bottom surface of the flexible encapsulation multilayer such that the outer edge portion of the first inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer.
18. The electroluminescent device of claim 15 , wherein the second inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the second inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the second inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the outer edge portion of the second inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer.
19. The electroluminescent device of claim 15 , wherein the first inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the first inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the first inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the inorganic capping film is located between the outer edge portion of the first inorganic wiring and the bottom surface of the flexible encapsulation multilayer such that the outer edge portion of the first inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer; and
wherein the second inorganic wiring has an inner edge portion and an outer edge portion opposite to the inner edge portion, the outer edge portion of the second inorganic wiring is relatively farther than the inner edge portion from the emission area, the outer edge portion of the second inorganic wiring is located under the bottom surface of the flexible encapsulation multilayer, and the outer edge portion of the second inorganic wiring is not in direct contact with the bottom surface of the flexible encapsulation multilayer.
20. The electroluminescent device of claim 15 , further comprising an organic layer which is located between the upper electrode and the bottom surface of the flexible encapsulation multilayer, which is in direct contact with the upper electrode, and which has a conductive or semi-conductive property.