Conductor connecting structure
The present disclosure provides a conductor connecting structure that connects a cable to a substrate, where the substrate includes at least one connection pad, the cable includes at least one core wire, the core wire is connected to an upper surface of the connection pad through soldering, and the connection pad includes a solder storing part that is present further frontward than a front end of the core wire.
1. A conductor connecting structure comprising:
a substrate having at least one connection pad, the at least one connection pad having an upper surface and a solder storing part, the at least one connection pad having a width; and
a cable having at least one core wire, the at least one core wire having a front end, the at least one core wire being connected to the upper surface of the connection pad via soldering such that the solder storing part of the at least one connection pad is further frontward than the front end of the at least one core wire, the at least one core wire having a diameter, wherein the diameter of the at least one core wire is substantially equal to the width of the at least one connection pad.
2. The conductor connecting structure as defined in claim 1 , wherein the diameter of the at least one core wire is approximately 16 μm to 105 μm.
3. The conductor connecting structure as defined in claim 2 , wherein the cable has at least two core wires, wherein a pitch of adjacent core wires is approximately 36 μm to 150 μm.
4. The conductor connecting structure as defined in claim 3 , wherein the diameter of the at least two core wires is approximately 16 μm and the pitch of adjacent core wires is approximately 36 μm.
5. The conductor connecting structure as defined in claim 3 , wherein the diameter of the at least two core wires is approximately 40 μm to 60 μm and the pitch of adjacent core wires is approximately 100 μm.
6. The conductor connecting structure as defined in claim 3 , wherein the diameter of the at least two core wires is approximately 75 μm to 105 μm and the pitch of adjacent core wires is approximately 150 μm.
7. The conductor connecting structure as defined in claim 1 , wherein the width of the at least one connection pad is approximately 15 μm to 105 μm.
8. The conductor connecting structure as defined in claim 7 , wherein the substrate has at least two connection pads, wherein a pitch of adjacent connection pads is approximately 36 μm to 150 μm.
9. The conductor connecting structure as defined in claim 8 , wherein the width of the at least two connection pads is approximately 15 μm to 25 μm and the pitch of adjacent connection pads is approximately 36 μm.
10. The conductor connecting structure as defined in claim 8 , wherein the width of the at least two connection pads is approximately 40 μm to 60 μm and the pitch of adjacent connection pads is approximately 100 μm.
11. The conductor connecting structure as defined in claim 8 , wherein the width of the at least two connection pads is approximately 75 μm to 105 μm and the pitch of adjacent connection pads is approximately 150 μm.
12. The conductor connecting structure as defined in claim 1 , wherein the at least one connection pad has a total length, wherein the total length of the at least one connection pad is greater than or equal to six times the diameter of the at least one core wire.
13. The conductor connecting structure as defined in claim 12 , wherein the solder storing part has a length which is less than the total length of the at least one connection pad, wherein the length of the solder storing part is greater than or equal to two times the diameter of the at least one core wire.
14. The conductor connecting structure as defined in claim 1 , wherein the at least one connecting pad has a total length, and wherein the width of the at least one connecting pad is constant throughout the total length thereof.
15. The conductor connecting structure as defined in claim 1 , wherein a solder fillet is formed in front of the at least one core wire.
16. The conductor connecting structure as defined in claim 1 , wherein the substrate has a plurality of connecting pads arranged side by side, and wherein a coating film of a solder resist is formed between adjacent connecting pads on an upper surface of the substrate.
17. The conductor connecting structure as defined in claim 1 , wherein the substrate has a plurality of connecting pads arranged side by side, and wherein a coating film of an insulation protective film is formed between adjacent connecting pads on an upper surface of the substrate.
18. The conductor connecting structure as defined in claim 1 , wherein the at least one connection pad has right and left side ends exposed further upward than an upper surface of the substrate, wherein the solder adheres to at least one of the right and left side ends.
19. The conductor connecting structure as defined in claim 1 , wherein a solder fillet is formed behind the at least one connection pad.
20. The conductor connecting structure as defined in claim 1 , wherein the substrate is a printed circuit board, a flexible circuit board, or an integrated circuit board.