Retaining device for an electronic component
A holding device ( 1 ) for an electronic component ( 2 ) in a vehicle headlamp, the electronic component ( 2 ) comprising an optical interface area on a front side and a thermal interface area and electrical contacts on a rear side facing away from the front side, as well as: a base body ( 3 ) having a mounting position for the electronic component, and an opening ( 31 ) located in the region of the mounting position, through which opening access to the optical interface area of the electronic component ( 2 ) is possible, wherein the electronic component ( 2 ) bears by way of the front side thereof against the base body ( 3 ), a circuit board ( 4 ), to which the electronic component ( 2 ) can be connected by means of the electrical contacts thereof and which has an opening ( 41 ), though which access to the thermal interface area of the electronic component ( 2 ) is possible, a heat sink ( 5 ), which is arranged on the thermal interface area of the electronic component ( 2 ) and can be fastened on the base body, at least one resilient spacer ( 6 ), which is arranged between the circuit board ( 4 ) and the base body ( 3 ).
1. A vehicle headlamp comprising:
a holding device ( 1 ) for an electronic component ( 2 ), the electronic component ( 2 ) comprising an optical interface area ( 21 ) on a front side and a thermal interface area ( 22 ) and electrical contacts ( 23 ) on a rear side facing away from the front side,
wherein the holding device comprises:
a base body ( 3 ) having a mounting position for the electronic component, and an opening ( 31 ) located in the region of the mounting position, through which opening access to the optical interface area ( 21 ) of the electronic component ( 2 ) is possible, wherein the electronic component ( 2 ) bears by way of the front side thereof against the base body ( 3 ),
a circuit board ( 4 ), to which the electronic component ( 2 ) can be connected by means of the electrical contacts thereof and which has an opening ( 41 ), though which access to the thermal interface area ( 22 ) of the electronic component ( 2 ) is possible,
a heat sink ( 5 ), which is arranged on the thermal interface area ( 22 ) of the electronic component ( 2 ) and is fastened on the base body, and
at least one resilient spacer ( 6 ), which is arranged between the circuit board ( 4 ) and the base body ( 3 ).
2. The vehicle headlamp according to claim 1 , wherein the circuit board ( 4 ) and the base body ( 3 ) are connected to one another via the resilient spacer ( 6 ), and are held spaced apart.
3. The vehicle headlamp according to claim 1 , wherein at least one second resilient spacer ( 8 ) is arranged between the circuit board ( 4 ) and the heat sink ( 5 ).
4. The vehicle headlamp according to claim 1 , wherein the electronic component ( 2 ) is an analogue or digital micromirror array.
5. The vehicle headlamp according to claim 2 , wherein the circuit board ( 4 ) and the base body ( 3 ) are connected to one another by a connecting element ( 7 ).
6. The vehicle headlamp according to claim 5 , wherein the connecting element ( 7 ) is a screw or plug connection.