Single wavelength reflection for leadframe brightness measurement

1. A method of manufacturing a packaged device, the method comprising:

irradiating light having a single predetermined wavelength on a predetermined area on a surface of a leadframe to determine whether a brightness ratio of the predetermined area is higher than a predetermined minimum brightness ratio threshold;

mounting a semiconductor chip on the leadframe responsive to a determination that the brightness ratio of the predetermined area is higher than the threshold;

electrically connecting pads on the semiconductor chip with pads on the leadframe;

applying a molding compound on the semiconductor chip and the leadframe and curing the molding compound; and

singulating each of a plurality of the leadframes of a leadframe sheet to manufacture a plurality of packaged devices.

2. The method of manufacturing the packaged device according to claim 1 , further comprising:

positioning the leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor;

irradiating the predetermined area on the surface of the leadframe with the light having the single predetermined wavelength from the light source;

receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal;

determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and

calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

3. The method of manufacturing the packaged device according to claim 2 , further comprising:

positioning a calibration piece on the measurement apparatus and irradiating the calibration piece with the light having the single predetermined wavelength;

receiving, with the light receiver of the optical sensor, reflected light from the calibration piece;

determining the predetermined reference reflection intensity value based on the reflected light from the calibration piece; and

dividing the reflection intensity value by the predetermined reference reflection intensity value to calculate the reflection ratio.

4. The method of manufacturing the packaged device according to claim 3 , wherein the calibration piece is coated with one or more of gold, silver, and aluminum.

5. The method of manufacturing the packaged device according to claim 2 , wherein the reflected light from the predetermined area on the surface of the leadframe represents a brightness of the surface of the leadframe; and

wherein the method further comprises indicating the brightness of the surface of the leadframe as being within a permissible range when the reflection ratio is higher than a predetermined minimum brightness ratio threshold.

6. The method of manufacturing the packaged device according to claim 2 , wherein the light source is a pulsed light source, and wherein the method further comprises:

irradiating the predetermined area on the surface of the leadframe with the light having the single predetermined wavelength during a first time period;

ceasing irradiating the predetermined area on the surface of the leadframe with the light having the single predetermined wavelength during a second time period following the first time period; and

synchronizing an operation of the light receiver with an operation of the light source such that the light receiver operates to receive the reflected light during the first time period but not during the second time period.

7. The method of manufacturing the packaged device according to claim 6 , wherein the light source is a pulsed light emitting diode (LED) that emits red light at 630 nanometers.

8. The method of manufacturing the packaged device according to claim 2 , wherein the optical sensor is a fiber optic sensor, and wherein the light source comprises an LED and a first optical fiber guiding the light from the LED to the distal end portion of the light source, and wherein the light receiver comprises a photodiode and a second optical fiber guiding the reflected light from a distal end portion of the light receiver to the photodiode.

9. method of manufacturing the packaged device according to claim 2 , further comprising:

positioning a lens in an optical path between the distal end portion of the light source and the predetermined area on the surface of the leadframe on the measurement apparatus; and

adjusting a focus positon of the lens to focus the light from the light source on the predetermined area on the surface of the leadframe.

10. The method of manufacturing the packaged device according to claim 2 , wherein the light receiver is a photodiode.

11. The method of manufacturing the packaged device according to claim 1 , wherein the irradiating light is a red light having a single wavelength within the wavelength range of 620-750 nanometers (nm).

12. The method of manufacturing the packaged device according to claim 1 , wherein the irradiating light is a green light having a single wavelength within the wavelength range of 495-570 nanometers (nm).

13. The method of manufacturing the packaged device according to claim 1 , wherein the irradiating light is a blue light having a single wavelength within the wavelength range of 450-495 nanometers (nm).

14. A method of manufacturing packaged devices, the method comprising:

irradiating light having a single predetermined wavelength on a predetermined area on a surface of a leadframe in a leadframe sheet to determine whether a brightness ratio of the predetermined area is higher than a predetermined minimum brightness ratio threshold;

mounting a semiconductor chip on each leadframe in the leadframe sheet responsive to a determination that the brightness ratio of the predetermined area is higher than the threshold;

electrically connecting pads on each semiconductor chip with pads on the leadframe to which it is attached;

applying a molding compound on the semiconductor chips and the leadframe sheet and curing the molding compound; and

singulating each of a plurality of the leadframes of a leadframe sheet to manufacture a plurality of packaged devices.

15. The method of manufacturing the packaged devices according to claim 14 , further comprising:

positioning the leadframe sheet on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor;

irradiating the predetermined area on the surface of the leadframe sheet with the light having the single predetermined wavelength from the light source;

receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe sheet, and converting the reflected light into an electric signal;

determining a reflection intensity value of the predetermined area on the surface of the leadframe sheet based on the electric signal; and

calculating a reflection ratio of the predetermined area on the surface of the leadframe sheet based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

16. The method of manufacturing the packaged device according to claim 15 , further comprising:

positioning a calibration piece on the measurement apparatus and irradiating the calibration piece with the light having the single predetermined wavelength;

receiving, with the light receiver of the optical sensor, reflected light from the calibration piece;

determining the predetermined reference reflection intensity value based on the reflected light from the calibration piece; and

dividing the reflection intensity value by the predetermined reference reflection intensity value to calculate the reflection ratio.

17. The method of manufacturing the packaged device according to claim 16 , wherein the calibration piece is coated with one or more of gold, silver, and aluminum.

18. The method of manufacturing the packaged device according to claim 15 , wherein the reflected light from the predetermined area on the surface of the leadframe sheet represents a brightness of the surface of the leadframe sheet; and

wherein the method further comprises indicating the brightness of the surface of the leadframe sheet as being within a permissible range when the reflection ratio is higher than a predetermined minimum brightness ratio threshold.

19. The method of manufacturing the packaged device according to claim 15 , wherein the light source is a pulsed light source, and wherein the method further comprises:

irradiating the predetermined area on the surface of the leadframe sheet with the light having the single predetermined wavelength during a first time period;

ceasing irradiating the predetermined area on the surface of the leadframe sheet with the light having the single predetermined wavelength during a second time period following the first time period; and

synchronizing an operation of the light receiver with an operation of the light source such that the light receiver operates to receive the reflected light during the first time period but not during the second time period.

20. The method of manufacturing the packaged device according to claim 19 , wherein the light source is a pulsed light emitting diode (LED) that emits red light at 630 nanometers.

21. The method of manufacturing the packaged device according to claim 15 , wherein the optical sensor is a fiber optic sensor, and wherein the light source comprises an LED and a first optical fiber guiding the light from the LED to the distal end portion of the light source, and wherein the light receiver comprises a photodiode and a second optical fiber guiding the reflected light from a distal end portion of the light receiver to the photodiode.

22. The method of manufacturing the packaged device according to claim 15 , further comprising:

positioning a lens in an optical path between the distal end portion of the light source and the predetermined area on the surface of the leadframe sheet on the measurement apparatus; and

adjusting a focus positon of the lens to focus the light from the light source on the predetermined area on the surface of the leadframe sheet.

23. The method of manufacturing the packaged device according to claim 15 , wherein the light receiver is a photodiode.

24. The method of manufacturing the packaged device according to claim 14 , wherein the irradiating light is a red light having a single wavelength within the wavelength range of 620-750 nanometers (nm).

25. The method of manufacturing the packaged device according to claim 14 , wherein the irradiating light is a green light having a single wavelength within the wavelength range of 495-570 nanometers (nm).

26. The method of manufacturing the packaged device according to claim 14 , wherein the irradiating light is a blue light having a single wavelength within the wavelength range of 450-495 nanometers (nm).

27. A method of manufacturing a packaged device, the method comprising:

irradiating light having a single predetermined wavelength on a predetermined area on a surface of a leadframe to determine whether a brightness ratio of the predetermined area is higher than a predetermined minimum brightness ratio threshold;

mounting a semiconductor chip on the leadframe responsive to a determination that the brightness ratio of the predetermined area is higher than the threshold;

electrically connecting pads on the semiconductor chip with pads on the leadframe;

applying a molding compound on the semiconductor chip and the leadframe and curing the molding compound; and

singulating the mold encapsulated semiconductor chip and lead frame from a leadframe sheet.