IP Library › Granted Patent US 10,431,722
Granted Patent B2
US 10,431,722 · App. 15/587,709 · Granted Oct 1, 2019

Light emitting element, light emitting element array, and light transmission device

Inventors: Junichiro Hayakawa (Kanagawa, JP); Akemi Murakami (Kanagawa, JP); Takashi Kondo (Kanagawa, JP); Naoki Jogan (Kanagawa, JP); Jun Sakurai (Kanagawa, JP)
Assignee: FUJI XEROX CO., LTD.
H01L33/60H01L25/167H01L27/15H01L27/156H01L31/125H01L33/405H01L33/62
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Quick Facts
Patent No.
US 10,431,722
App. No.
15/587,709
Granted
Oct 1, 2019
Kind
B2
Abstract

A light emitting element includes: a semiconductor stack structure that includes a light emitting part, and a light receiving part that receives light propagating in a lateral direction through a semiconductor layer from the light emitting part, wherein the light emitting part and the light receiving part share a quantum layer; and a light reflection layer that covers ⅓ or more of a lateral surface of the quantum layer in the light receiving part.

Claims (36)

1. A light emitting element comprising:

a semiconductor stack structure including:

a light emitting part; and

a light receiving part configured to receive light propagating in a lateral direction through a semiconductor layer from the light emitting part,

wherein the light receiving part is configured to convert a received light into a detected monitor current, and

wherein the light emitting part and the light receiving part share a quantum layer; and

a light reflection layer that covers ⅓ or more of a lateral surface of the quantum layer in the light receiving part.

2. The light emitting element according to claim 1 , wherein the light reflection layer is a metal layer.

3. The light emitting element according to claim 2 , wherein the metal layer is an electrode wiring.

4. The light emitting element according to claim 1 , wherein the light reflection layer covers ¾ or more of the lateral surface of the quantum layer.

5. The light emitting element according to claim 1 , wherein the light reflection layer further covers a light receiving surface of the light receiving part.

6. A light transmission device comprising:

the light emitting element according to claim 1 ; and

an applying unit configured to apply a driving signal to the light emitting element.

7. A light emitting element array comprising:

a plurality of the light emitting elements according to claim 1 .

8. The light emitting element according to claim 1 , wherein the light receiving part comprises a monitor photodiode.

9. The light emitting element according to claim 1 , wherein the light emitting element is configured to compare the detected monitor current with a reference value to perform feedback control on the light emitting part.

10. The light emitting element according to claim 1 , wherein the light reflection layer directly covers ⅓ or more of the lateral surface of the quantum layer in the light receiving part.

11. The light emitting element according to claim 1 , wherein the light reflection layer directly covers ⅓ or more of the lateral surface of the quantum layer in the light receiving part.

12. The light emitting element according to claim 1 , wherein the light reflection layer contacts ⅓ or more of the lateral surface of the quantum layer in the light receiving part.

13. The light emitting element according to claim 1 , wherein the light reflection layer is configured to adjust reflectivity on the ⅓ or more of the lateral surface of the quantum layer in the light receiving part.

14. The light emitting element according to claim 1 , wherein the light reflection layer overlaps with the ⅓ or more of the lateral surface of the quantum layer in the light receiving part when viewed from the lateral direction.

15. A light emitting element comprising:

a semiconductor stack structure including:

a light emitting part; and

a light receiving part configured to receive light propagating in a lateral direction through a semiconductor layer from the light emitting part, wherein the light receiving part is configured to convert a received light into a detected monitor current, wherein the light emitting part and the light receiving part share a quantum layer;

a first electrode wiring that is formed on a lateral surface of the light emitting part; and

a second electrode wiring that is formed on a lateral surface of the light receiving part and that has a wider width than the first electrode wiring.

16. A light emitting element comprising:

a semiconductor stack structure including:

a light emitting part, and

a light receiving part configured to receive light propagating in a lateral direction through a semiconductor layer from the light emitting part, wherein the light receiving part is configured to convert a received light into a detected monitor current, wherein the light emitting part and the light receiving part share a quantum layer; and

a light blocking layer configured to block light by absorbing the light from outside, that is provided on at least a part of a lateral surface of the quantum layer in the light receiving part, and that has a thickness of 1 μm or more.

17. The light emitting element according to claim 16 , wherein the light blocking layer covers ¾ or more of the lateral surface of the quantum layer.

18. The light emitting element according to claim 16 , wherein the light blocking layer further covers a light receiving surface of the light receiving part.

Assignments (2)
CHANGE OF NAME Recorded Aug 12, 2021
From: FUJI XEROX CO., LTD.
To: FUJIFILM BUSINESS INNOVATION CORP.
Reel/Frame 058287/0056 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2017
From: HAYAKAWA, JUNICHIRO; MURAKAMI, AKEMI; KONDO, TAKASHI; JOGAN, NAOKI; SAKURAI, JUN
To: FUJI XEROX CO., LTD.
Reel/Frame 042256/0770 →
Priority Claims (1)
JP 2016-157998 · Aug 10, 2016 · national
Continuity (1)
Related Publication 20180047882A1 · Feb 15, 2018
Cited By (1)
US 12,538,613