Manufacturing method of circuit structure embedded with heat-dissipation block
A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.
1. A manufacturing method of circuit structure embedded with heat-dissipation block, comprising:
providing a core board, wherein the core board comprises a first dielectric layer and two first conductive layers, and the two first conductive layers are located on two opposite sides of the first dielectric layer, respectively;
forming two inner-layer circuits on two opposite sides of the core board;
bonding two build-up structures on two opposite sides of the core board, wherein each of the build-up structures comprises a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board;
forming a cavity on a predetermined region of each of the two build-up structures, wherein the cavity is communicated with the corresponding inner-layer circuit;
forming a through hole penetrated the core board after forming the cavity and bonding the build-up structures, wherein a dimension of the cavity is greater than a dimension of the through hole, and the through hole is communicated with the cavity, and wherein the cavities of the two build-up structures have an overlapping area, the through hole is formed at the overlapping area and communicated with the cavities; and
disposing a heat-dissipation block into the through hole, wherein the through hole is corresponding to the heat-dissipation block, an upper surface and a lower surface of the heat-dissipation block are aligned with two opening ends of the through hole, respectively.
2. The manufacturing method of circuit structure embedded with heat-dissipation block of claim 1 , further comprising:
before the step of bonding the build-up structure on the core board, disposing a release film on the core board, wherein the release film is corresponding to the predetermined region of the build-up structure; and in the step of forming the cavity on the predetermined region of the build-up structure, removing the predetermined region of the build-up structure and the release film, so as to form the cavity on the build-up structure.
3. The manufacturing method of circuit structure embedded with heat-dissipation block of claim 1 , further comprising:
disposing a chip into the cavity, wherein the chip is electrically connected to the corresponding inner-layer circuit; or disposing a heat sink into the cavity, wherein the heat sink is connected to the heat-dissipation block.